TW200615281A - Solvent-free polyimide silicone resin composition and cured resin film thereof - Google Patents

Solvent-free polyimide silicone resin composition and cured resin film thereof

Info

Publication number
TW200615281A
TW200615281A TW094130944A TW94130944A TW200615281A TW 200615281 A TW200615281 A TW 200615281A TW 094130944 A TW094130944 A TW 094130944A TW 94130944 A TW94130944 A TW 94130944A TW 200615281 A TW200615281 A TW 200615281A
Authority
TW
Taiwan
Prior art keywords
solvent
silicone resin
polyimide silicone
resin composition
group
Prior art date
Application number
TW094130944A
Other languages
English (en)
Chinese (zh)
Other versions
TWI370138B (OSRAM
Inventor
Yoshinori Yoneda
Michihiro Sugo
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200615281A publication Critical patent/TW200615281A/zh
Application granted granted Critical
Publication of TWI370138B publication Critical patent/TWI370138B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW094130944A 2004-09-09 2005-09-08 Solvent-free polyimide silicone resin composition and cured resin film thereof TW200615281A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004262005 2004-09-09
JP2005234548A JP4372065B2 (ja) 2004-09-09 2005-08-12 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜

Publications (2)

Publication Number Publication Date
TW200615281A true TW200615281A (en) 2006-05-16
TWI370138B TWI370138B (OSRAM) 2012-08-11

Family

ID=35427957

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130944A TW200615281A (en) 2004-09-09 2005-09-08 Solvent-free polyimide silicone resin composition and cured resin film thereof

Country Status (6)

Country Link
US (1) US7432313B2 (OSRAM)
EP (1) EP1634907B1 (OSRAM)
JP (1) JP4372065B2 (OSRAM)
KR (1) KR101135772B1 (OSRAM)
DE (1) DE602005005588T2 (OSRAM)
TW (1) TW200615281A (OSRAM)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4602151B2 (ja) * 2004-04-22 2010-12-22 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜
WO2007052540A1 (ja) * 2005-11-01 2007-05-10 Jsr Corporation 感光性樹脂組成物
JP4771100B2 (ja) 2008-08-27 2011-09-14 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
JP5457051B2 (ja) * 2009-03-05 2014-04-02 新日鉄住金化学株式会社 位相差フィルム及びその製造方法
KR101588492B1 (ko) * 2009-12-22 2016-01-25 신닛테츠 수미킨 가가쿠 가부시키가이샤 폴리이미드 수지, 그 제조 방법, 접착제 수지 조성물, 커버레이 필름 및 회로 기판
TWI362398B (en) * 2009-12-31 2012-04-21 Ind Tech Res Inst Polyimide polymers for flexible electrical device substrate material and flexible electrical devices comprising the same
RU2414762C1 (ru) * 2010-03-26 2011-03-20 Федеральное государственное унитарное предприятие "Особое конструкторское бюро кабельной промышленности" Радиационно-сшиваемая композиция на основе фторуглеродного полимера
WO2014163100A1 (ja) * 2013-04-03 2014-10-09 日産化学工業株式会社 無溶剤型光硬化性樹脂組成物
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
EP3266808B1 (en) 2015-03-05 2020-12-09 LG Chem, Ltd. Composition for polyimide film for flexible substrate of optoelectronic device
JP6763139B2 (ja) 2015-12-25 2020-09-30 信越化学工業株式会社 無溶剤型シリコーン変性ポリイミド樹脂組成物
JP2017222745A (ja) 2016-06-14 2017-12-21 信越化学工業株式会社 無溶剤型シリコーン変性ポリイミド樹脂組成物
US10982048B2 (en) * 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
KR20230008696A (ko) * 2020-05-08 2023-01-16 세키스이가가쿠 고교가부시키가이샤 점착제 조성물, 점착 테이프, 및 전자 부품의 처리 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499149A (en) * 1980-12-15 1985-02-12 M&T Chemicals Inc. Siloxane-containing polymers
JP3211108B2 (ja) * 1992-06-25 2001-09-25 チッソ株式会社 感光性樹脂組成物
JP3451128B2 (ja) 1994-03-31 2003-09-29 新日鐵化学株式会社 ポリイミド樹脂及び耐熱接着剤
JP2002012667A (ja) 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜
JP3865046B2 (ja) * 2001-05-08 2007-01-10 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物
WO2003038526A1 (fr) * 2001-10-30 2003-05-08 Kaneka Corporation Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
JP4204435B2 (ja) 2002-10-10 2009-01-07 信越化学工業株式会社 熱硬化性基を含有する透明ポリイミドシリコーン樹脂
DE60302853T2 (de) * 2002-10-10 2006-08-24 Shin-Etsu Chemical Co., Ltd. Farbloses und transparentes Polyimidsilikonharz mit wärmehärtenden funktionellen Gruppen

Also Published As

Publication number Publication date
EP1634907B1 (en) 2008-03-26
US20060052476A1 (en) 2006-03-09
EP1634907A1 (en) 2006-03-15
TWI370138B (OSRAM) 2012-08-11
KR101135772B1 (ko) 2012-04-16
DE602005005588D1 (de) 2008-05-08
DE602005005588T2 (de) 2009-05-07
KR20060051106A (ko) 2006-05-19
JP4372065B2 (ja) 2009-11-25
JP2006104447A (ja) 2006-04-20
US7432313B2 (en) 2008-10-07

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