ATE554142T1 - Härtbare silikonharzzusammensetzung, gehärtetes produkt daraus und opake silikonklebefolie aus der zusammensetzung - Google Patents

Härtbare silikonharzzusammensetzung, gehärtetes produkt daraus und opake silikonklebefolie aus der zusammensetzung

Info

Publication number
ATE554142T1
ATE554142T1 AT09011620T AT09011620T ATE554142T1 AT E554142 T1 ATE554142 T1 AT E554142T1 AT 09011620 T AT09011620 T AT 09011620T AT 09011620 T AT09011620 T AT 09011620T AT E554142 T1 ATE554142 T1 AT E554142T1
Authority
AT
Austria
Prior art keywords
composition
opaque
adhesive film
film made
resin composition
Prior art date
Application number
AT09011620T
Other languages
English (en)
Inventor
Tsutomu Kashiwagi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Application granted granted Critical
Publication of ATE554142T1 publication Critical patent/ATE554142T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
  • Laminated Bodies (AREA)
AT09011620T 2008-09-11 2009-09-10 Härtbare silikonharzzusammensetzung, gehärtetes produkt daraus und opake silikonklebefolie aus der zusammensetzung ATE554142T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008233104 2008-09-11

Publications (1)

Publication Number Publication Date
ATE554142T1 true ATE554142T1 (de) 2012-05-15

Family

ID=41280422

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09011620T ATE554142T1 (de) 2008-09-11 2009-09-10 Härtbare silikonharzzusammensetzung, gehärtetes produkt daraus und opake silikonklebefolie aus der zusammensetzung

Country Status (5)

Country Link
US (2) US20100059177A1 (de)
EP (1) EP2163584B1 (de)
JP (1) JP2010090363A (de)
AT (1) ATE554142T1 (de)
TW (1) TW201022333A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103748171B (zh) 2011-08-10 2016-03-16 株式会社艾迪科 含硅固化性组合物及其固化物
JP5848572B2 (ja) * 2011-10-04 2016-01-27 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
US11191435B2 (en) * 2013-01-22 2021-12-07 Seno Medical Instruments, Inc. Probe with optoacoustic isolator
US11287309B2 (en) 2011-11-02 2022-03-29 Seno Medical Instruments, Inc. Optoacoustic component utilization tracking
KR20150097947A (ko) 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
TWI506058B (zh) * 2014-03-18 2015-11-01 Benq Materials Corp 可固化矽樹脂組成物
KR102806830B1 (ko) * 2018-12-27 2025-05-13 닛산 가가쿠 가부시키가이샤 광조사 박리용 접착제 조성물 및 적층체, 그리고 적층체의 제조 방법 및 박리 방법
WO2020158640A1 (ja) * 2019-01-29 2020-08-06 パナソニックＩｐマネジメント株式会社 衝撃吸収材
US12139634B2 (en) * 2020-04-14 2024-11-12 Shin-Etsu Chemical Co., Ltd. Silylated isocyanurate compound, metal corrosion inhibitor, curable organosilicon resin composition, and semiconductor apparatus
WO2022019285A1 (ja) * 2020-07-21 2022-01-27 パナソニック株式会社 衝撃吸収材

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001013513A (ja) 1999-06-30 2001-01-19 Optrex Corp 液晶表示素子
JP4101469B2 (ja) 2001-04-10 2008-06-18 信越化学工業株式会社 半導電性シリコーンゴム組成物
TWI257271B (en) * 2003-09-29 2006-06-21 Ibiden Co Ltd Interlaminar insulating layer for printed wiring board, printed wiring board and the method of producing the same
DE102004036573A1 (de) * 2004-07-28 2006-03-23 Ge Bayer Silicones Gmbh & Co. Kg Verwendung lichtaktivierbarer, härtbarer Silikonzusammensetzungen zur Herstellung von dickwandigen Formartikeln oder dickwandigen Beschichtungen
JP4816951B2 (ja) * 2005-12-06 2011-11-16 信越化学工業株式会社 シリコーン組成物及びその硬化物
TWI398487B (zh) * 2005-12-06 2013-06-11 Shinetsu Chemical Co A polysiloxane composition and a hardened product thereof
JP4902190B2 (ja) * 2005-12-20 2012-03-21 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4636275B2 (ja) * 2006-07-18 2011-02-23 信越化学工業株式会社 シリコーン樹脂組成物で封止された半導体装置及び該半導体装置封止用シリコーン樹脂タブレット

Also Published As

Publication number Publication date
US20120261068A1 (en) 2012-10-18
JP2010090363A (ja) 2010-04-22
EP2163584A1 (de) 2010-03-17
US20100059177A1 (en) 2010-03-11
EP2163584B1 (de) 2012-04-18
TW201022333A (en) 2010-06-16

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