JP4348408B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP4348408B2 JP4348408B2 JP2009507411A JP2009507411A JP4348408B2 JP 4348408 B2 JP4348408 B2 JP 4348408B2 JP 2009507411 A JP2009507411 A JP 2009507411A JP 2009507411 A JP2009507411 A JP 2009507411A JP 4348408 B2 JP4348408 B2 JP 4348408B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- protective film
- electrostatic chuck
- wafer
- ion implantation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 216
- 238000004519 manufacturing process Methods 0.000 title claims description 35
- 230000001681 protective effect Effects 0.000 claims description 136
- 238000005468 ion implantation Methods 0.000 claims description 81
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 66
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 65
- 238000000034 method Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 33
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 229910052799 carbon Inorganic materials 0.000 claims description 15
- 238000001179 sorption measurement Methods 0.000 claims description 15
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 242
- 239000010408 film Substances 0.000 description 156
- 230000007547 defect Effects 0.000 description 51
- 239000010410 layer Substances 0.000 description 40
- 239000002245 particle Substances 0.000 description 31
- 239000000758 substrate Substances 0.000 description 25
- 229910004298 SiO 2 Inorganic materials 0.000 description 23
- 230000008569 process Effects 0.000 description 22
- 238000004140 cleaning Methods 0.000 description 20
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 16
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
- 238000002513 implantation Methods 0.000 description 16
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 11
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 10
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 230000004913 activation Effects 0.000 description 9
- 238000000137 annealing Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 6
- 229910021529 ammonia Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 241000052343 Dares Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/6606—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2001—Maintaining constant desired temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
Description
(1)静電チャックの吸着面に存在する突起や異物によって半導体ウェハの被吸着面が削られてできる「傷」。
(2)静電チャックの吸着面に存在する突起や異物によって削られたウェハ材料が半導体ウェハの吸着面に吸着する「パーティクル」。
(3)半導体ウェハによって削られた静電チャックの吸着面材料が半導体ウェハの被吸着面に付着する「パーティクル」。
まず、本発明に係る半導体装置の製造方法の第1の実施形態を説明する。本実施形態では、半導体ウェハとしてSiウェハを用いる。
(ア)SiO2(厚さ100nm)
(イ)SiO2(厚さ1000nm)
(ウ)poly-Si(厚さ800nm)/熱酸化膜(厚さ70nm)
(エ)SiO2(厚さ1000nm)/poly-Si(厚さ800nm)/熱酸化膜(厚さ70nm)
以下、本発明による半導体装置の製造方法の第2の実施形態を説明する。本実施形態では、静電チャックの吸着面が熱分解性窒化ホウ素(pyrolytic Boron Nitride:pBN)から形成されている。pBNは、層状構造の材料であり、AlNに比べ硬度が格段に低い材料である。
(カ)保護膜なしSiウェハ
(キ)SiO2(厚さ1μm)付Siウェハ
(ク)保護膜なしSiCウェハ
(ケ)SiO2(厚さ1μm)付SiCウェハ
(コ)SiO2((厚さ0.1μm)付Siウェハ
(サ)SiO2((厚さ0.1μm)付SiCウェハ
(シ)poly−Si(厚さ800nm)/熱酸化膜(厚さ70nm)付SiCウェハ
要件1)ウェハを加工する工程のウェハ表面温度(処理温度)に耐えうること。
要件2)ウェハを汚染しない材料であること。
要件3)静電チャック時における静電チャック表面との擦れによって、自身は削られることがないこと。
以下、本発明に係る半導体装置の製造方法の第3の実施形態を説明する。本実施形態では、炭化珪素半導体の縦型MISFETを製造する。
図8(a)から(h)を参照して、本発明による半導体装置の製造方法の他の実施形態を説明する。
1a 第1の面(半導体ウェハの主面)
1b 第2の面(半導体ウェハの裏面)
2 保護膜
3 イオン
4 傷
5 パーティクル
6 静電チャック
6a 静電チャック表面の突起
7 裏面注入層
21 ベース
22 表面誘電体層
23a 第1の電極
23b 第2の電極
24 電源
101 炭化珪素基板
102 ドリフト層
103 ウェル領域
104 コンタクト領域
105 ソース領域
106 ゲート絶縁膜
107 ドレイン電極
108 ソース電極
109 ゲート電極
110 層間絶縁膜
111 上部配線
112 注入マスク
Claims (10)
- 主面および前記主面に平行な裏面を有する半導体ウェハの一方の面上に保護膜を形成する工程(a)と、
400℃以上に加熱された静電チャックの吸着面に前記半導体ウェハを吸着させる工程であって、前記保護膜を介して前記吸着面に前記半導体ウェハを吸着させる工程(b)と、
前記半導体ウェハを400℃以上に加熱した状態で、前記半導体ウェハのうち前記保護膜が形成されていない側の面に対してイオン注入を行う工程(c)と、
前記保護膜を前記半導体ウェハから除去する工程(d)と、
を含み、
前記工程(b)は、
400℃以上に加熱された前記静電チャックの吸着面に前記半導体ウェハを載せ、前記半導体ウェハの温度を第1の温度まで上昇させる工程と、
前記静電チャックに電圧を印加し、前記半導体ウェハを前記吸着面に吸着させることにより、前記半導体ウェハの温度を前記第1の温度よりも更に上昇させ、400℃以上にする工程と、
を含み、
前記保護膜の硬度は前記静電チャックの前記吸着面の硬度より低く、かつ、前記保護膜の厚さは1μm以上5μm以下である、半導体装置の製造方法。 - 前記保護膜は前記半導体ウェハの主面上に形成し、かつ、前記イオン注入は前記半導体ウェハの裏面に対して行う請求項1に記載の半導体装置の製造方法。
- 前記工程(b)は、前記静電チャックに印加する電圧を多段階に上昇させる工程を含む請求項1に記載の半導体装置の製造方法。
- 前記静電チャックに印加する電圧を多段階に上昇させる工程において、前記静電チャックに印加する電圧の上昇は、0.5秒以上の時間をかけて行う請求項3に記載の半導体装置の製造方法。
- 前記保護膜の表面は平坦である請求項1に記載の半導体装置の製造方法。
- 前記半導体ウェハは炭化珪素から形成されている請求項1に記載の半導体装置の製造方法。
- 前記保護膜は珪素または炭素を主成分とする材料から形成されている請求項1に記載の半導体装置の製造方法。
- 前記保護膜は、酸化シリコンおよび多結晶シリコンの少なくとも一方から形成された単層または積層膜である請求項7に記載の半導体装置の製造方法。
- 前記半導体ウェハの前記保護膜が形成される側の面に対して、前記工程(a)の前にイオン注入を行う工程を含む請求項1に記載の半導体装置の製造方法。
- 前記半導体ウェハの前記保護膜が形成されていた側の面に対して、前記工程(d)の後にイオン注入を行う工程を含む請求項1に記載の半導体装置の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007088342 | 2007-03-29 | ||
JP2007088342 | 2007-03-29 | ||
PCT/JP2008/000732 WO2008120467A1 (ja) | 2007-03-29 | 2008-03-26 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4348408B2 true JP4348408B2 (ja) | 2009-10-21 |
JPWO2008120467A1 JPWO2008120467A1 (ja) | 2010-07-15 |
Family
ID=39808053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009507411A Expired - Fee Related JP4348408B2 (ja) | 2007-03-29 | 2008-03-26 | 半導体装置の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7772098B2 (ja) |
JP (1) | JP4348408B2 (ja) |
WO (1) | WO2008120467A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4348408B2 (ja) * | 2007-03-29 | 2009-10-21 | パナソニック株式会社 | 半導体装置の製造方法 |
JP5087375B2 (ja) * | 2007-11-28 | 2012-12-05 | 株式会社ブリヂストン | 炭化ケイ素半導体デバイスの製造方法 |
JP5317509B2 (ja) * | 2008-03-27 | 2013-10-16 | 東京エレクトロン株式会社 | プラズマ処理装置および方法 |
JP5438992B2 (ja) * | 2009-02-20 | 2014-03-12 | 昭和電工株式会社 | 炭化珪素半導体装置の製造方法 |
JP5543123B2 (ja) * | 2009-03-30 | 2014-07-09 | 大日本スクリーン製造株式会社 | 熱処理用サセプタおよび熱処理装置 |
EP2432020A4 (en) * | 2009-05-11 | 2013-06-26 | Sumitomo Electric Industries | SEMICONDUCTOR DEVICE |
JP2011253915A (ja) * | 2010-06-02 | 2011-12-15 | Shin Etsu Handotai Co Ltd | シリコンウェーハ |
US8580693B2 (en) * | 2010-08-27 | 2013-11-12 | Applied Materials, Inc. | Temperature enhanced electrostatic chucking in plasma processing apparatus |
CN103065997B (zh) * | 2011-10-19 | 2015-08-05 | 中芯国际集成电路制造(上海)有限公司 | 晶圆承载设备及晶圆承载的方法 |
CN103066000B (zh) * | 2011-10-19 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 晶圆承载设备及晶圆承载的方法 |
JP6136731B2 (ja) | 2013-08-06 | 2017-05-31 | 住友電気工業株式会社 | 炭化珪素半導体基板およびその製造方法、ならびに炭化珪素半導体装置の製造方法 |
JP6217233B2 (ja) | 2013-08-21 | 2017-10-25 | 住友電気工業株式会社 | 半導体装置の製造方法 |
JP2015065318A (ja) * | 2013-09-25 | 2015-04-09 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
JP6248684B2 (ja) * | 2014-02-19 | 2017-12-20 | 住友電気工業株式会社 | 半導体装置の製造方法 |
US11594441B2 (en) * | 2021-04-09 | 2023-02-28 | Applied Materials, Inc. | Handling for high resistivity substrates |
US20230077578A1 (en) * | 2021-09-13 | 2023-03-16 | Applied Materials, Inc. | Chambers and coatings for reducing backside damage |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6467976A (en) | 1987-09-08 | 1989-03-14 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPH0855900A (ja) | 1994-08-11 | 1996-02-27 | Fujitsu Ltd | 静電吸着方法とその装置と半導体装置の製造方法 |
JP4086967B2 (ja) | 1998-06-18 | 2008-05-14 | 日本碍子株式会社 | 静電チャックのパーティクル発生低減方法及び半導体製造装置 |
JP2003017223A (ja) | 2001-07-03 | 2003-01-17 | Onahama Seisakusho:Kk | セラミックヒータ及びセラミックヒータ内臓型静電チャック |
JP4463448B2 (ja) * | 2001-09-07 | 2010-05-19 | パナソニック株式会社 | SiC基板及びSiC半導体素子の製造方法 |
JP3976546B2 (ja) * | 2001-10-31 | 2007-09-19 | 大日本スクリーン製造株式会社 | 薄膜形成装置 |
JP3978714B2 (ja) | 2002-02-26 | 2007-09-19 | ジーイー・スペシャルティ・マテリアルズ・ジャパン株式会社 | 静電チャックの製造方法 |
CN1532943B (zh) | 2003-03-18 | 2011-11-23 | 松下电器产业株式会社 | 碳化硅半导体器件及其制造方法 |
JP3759145B2 (ja) | 2003-03-18 | 2006-03-22 | 松下電器産業株式会社 | 炭化珪素半導体装置およびその製造方法 |
JP4309714B2 (ja) * | 2003-08-27 | 2009-08-05 | 信越化学工業株式会社 | 静電吸着機能を有する加熱装置 |
JP4278046B2 (ja) * | 2003-11-10 | 2009-06-10 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | ヒータ機構付き静電チャック |
JP4942134B2 (ja) * | 2005-05-20 | 2012-05-30 | 日産自動車株式会社 | 炭化珪素半導体装置の製造方法 |
JP2007096263A (ja) | 2005-08-31 | 2007-04-12 | Denso Corp | 炭化珪素半導体装置およびその製造方法。 |
WO2007055185A1 (ja) * | 2005-11-08 | 2007-05-18 | Tohoku University | シャワープレート及びシャワープレートを用いたプラズマ処理装置 |
JP4493638B2 (ja) | 2006-10-12 | 2010-06-30 | 株式会社アルバック | 真空処理方法 |
JP4348408B2 (ja) * | 2007-03-29 | 2009-10-21 | パナソニック株式会社 | 半導体装置の製造方法 |
-
2008
- 2008-03-26 JP JP2009507411A patent/JP4348408B2/ja not_active Expired - Fee Related
- 2008-03-26 US US12/593,141 patent/US7772098B2/en active Active
- 2008-03-26 WO PCT/JP2008/000732 patent/WO2008120467A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US7772098B2 (en) | 2010-08-10 |
WO2008120467A1 (ja) | 2008-10-09 |
US20100093161A1 (en) | 2010-04-15 |
JPWO2008120467A1 (ja) | 2010-07-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4348408B2 (ja) | 半導体装置の製造方法 | |
JP4971340B2 (ja) | 炭化珪素半導体素子の製造方法 | |
JP4802380B2 (ja) | 半導体基板の製造方法 | |
JP2009194216A (ja) | 半導体装置の製造方法 | |
JP2009088223A (ja) | 炭化珪素半導体基板およびそれを用いた炭化珪素半導体装置 | |
US20130119406A1 (en) | Silicon carbide substrate, semiconductor device, and methods for manufacturing them | |
AU2005299298B2 (en) | A method of making a semiconductor structure for high power semiconductor devices | |
TW200926303A (en) | Semiconductor device manufacturing method and semiconductor device | |
JP2008135611A (ja) | 半導体装置の製造方法 | |
EP2551891B1 (en) | Semiconductor device and method for producing same | |
WO2008136126A1 (ja) | 炭化ケイ素基板を有する半導体デバイスのアニール方法と半導体デバイス | |
JP4449814B2 (ja) | 炭化けい素半導体素子の製造方法 | |
JP5999687B2 (ja) | SiCエピタキシャルウエハおよびそれを用いたSiC半導体素子 | |
JPH09321323A (ja) | 炭化けい素半導体基板とその製造方法およびその基板を用いた炭化けい素半導体素子 | |
JP5529217B2 (ja) | 半導体装置の製造方法 | |
US11576259B2 (en) | Carrier, laminate and method of manufacturing semiconductor devices | |
JP2008251579A (ja) | 静電チャックおよび半導体装置の製造方法 | |
JP2008544945A (ja) | 酸素感受性の高いケイ素層及び該ケイ素層を得るための方法 | |
JP5884585B2 (ja) | 炭化珪素半導体装置の製造方法 | |
JP2008060401A (ja) | 半導体装置の製造方法、半導体装置の製造用治具、および半導体装置の製造装置 | |
JPWO2007072624A1 (ja) | Soi基板の製造方法およびsoi基板 | |
JP5971718B2 (ja) | 半導体装置製造方法 | |
US11682549B2 (en) | Semiconductor wafer with modified surface and fabrication method thereof | |
JP5608358B2 (ja) | 半導体装置とその製造方法 | |
JP2008251574A (ja) | 静電チャック及びその製造方法ならびに半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090623 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090717 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4348408 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120724 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120724 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130724 Year of fee payment: 4 |
|
LAPS | Cancellation because of no payment of annual fees |