JP4343326B2 - 基板搬送装置および露光装置 - Google Patents

基板搬送装置および露光装置 Download PDF

Info

Publication number
JP4343326B2
JP4343326B2 JP13412999A JP13412999A JP4343326B2 JP 4343326 B2 JP4343326 B2 JP 4343326B2 JP 13412999 A JP13412999 A JP 13412999A JP 13412999 A JP13412999 A JP 13412999A JP 4343326 B2 JP4343326 B2 JP 4343326B2
Authority
JP
Japan
Prior art keywords
substrate
temperature control
wafer
control plate
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP13412999A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000323553A (ja
JP2000323553A5 (enExample
Inventor
博 中里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP13412999A priority Critical patent/JP4343326B2/ja
Priority to US09/570,061 priority patent/US6309212B1/en
Publication of JP2000323553A publication Critical patent/JP2000323553A/ja
Priority to US09/977,702 priority patent/US6607380B1/en
Publication of JP2000323553A5 publication Critical patent/JP2000323553A5/ja
Application granted granted Critical
Publication of JP4343326B2 publication Critical patent/JP4343326B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP13412999A 1999-05-14 1999-05-14 基板搬送装置および露光装置 Expired - Fee Related JP4343326B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP13412999A JP4343326B2 (ja) 1999-05-14 1999-05-14 基板搬送装置および露光装置
US09/570,061 US6309212B1 (en) 1999-05-14 2000-05-12 Substrate conveying system and device manufacturing method using the same
US09/977,702 US6607380B1 (en) 1999-05-14 2001-10-16 Substrate conveying system and device manufacturing method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13412999A JP4343326B2 (ja) 1999-05-14 1999-05-14 基板搬送装置および露光装置

Publications (3)

Publication Number Publication Date
JP2000323553A JP2000323553A (ja) 2000-11-24
JP2000323553A5 JP2000323553A5 (enExample) 2006-06-22
JP4343326B2 true JP4343326B2 (ja) 2009-10-14

Family

ID=15121153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13412999A Expired - Fee Related JP4343326B2 (ja) 1999-05-14 1999-05-14 基板搬送装置および露光装置

Country Status (2)

Country Link
US (2) US6309212B1 (enExample)
JP (1) JP4343326B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4244555B2 (ja) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 被処理体の支持機構
JP4670677B2 (ja) * 2006-02-17 2011-04-13 東京エレクトロン株式会社 加熱装置、加熱方法、塗布装置及び記憶媒体
US8200354B2 (en) * 2006-04-21 2012-06-12 The Boeing Company Assembly task verification system and method
JP4885023B2 (ja) * 2007-03-23 2012-02-29 東京エレクトロン株式会社 ロードロック装置および基板の処理システム
US20090174873A1 (en) * 2007-12-17 2009-07-09 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
JP2010182906A (ja) * 2009-02-06 2010-08-19 Tokyo Electron Ltd 基板処理装置
JP5511536B2 (ja) * 2010-06-17 2014-06-04 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539695A (en) * 1984-01-06 1985-09-03 The Perkin-Elmer Corporation X-Ray lithography system
JPS60169148A (ja) * 1984-02-13 1985-09-02 Dainippon Screen Mfg Co Ltd 基板の搬送方法及びその装置
US4853880A (en) 1985-08-23 1989-08-01 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
US4887904A (en) 1985-08-23 1989-12-19 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
US4984953A (en) 1987-02-20 1991-01-15 Canon Kabushiki Kaisha Plate-like article conveying system
JPH0333058Y2 (enExample) * 1987-06-26 1991-07-12
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
JP3028462B2 (ja) * 1995-05-12 2000-04-04 東京エレクトロン株式会社 熱処理装置
TW353777B (en) * 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
JP3333135B2 (ja) * 1998-06-25 2002-10-07 東京エレクトロン株式会社 熱処理装置及び熱処理方法
US6087632A (en) * 1999-01-11 2000-07-11 Tokyo Electron Limited Heat processing device with hot plate and associated reflector
JP3635214B2 (ja) * 1999-07-05 2005-04-06 東京エレクトロン株式会社 基板処理装置
KR100348938B1 (ko) * 1999-12-06 2002-08-14 한국디엔에스 주식회사 포토리소그라피 공정을 위한 반도체 제조장치
US6402508B2 (en) * 1999-12-09 2002-06-11 Tokyo Electron Limited Heat and cooling treatment apparatus and substrate processing system

Also Published As

Publication number Publication date
JP2000323553A (ja) 2000-11-24
US6309212B1 (en) 2001-10-30
US6607380B1 (en) 2003-08-19

Similar Documents

Publication Publication Date Title
TWI244118B (en) Exposure apparatus, substrate processing unit and lithographic system, and device manufacturing method
KR101515247B1 (ko) 기판 처리 장치
KR101086174B1 (ko) 도포·현상 장치 및 도포·현상 방법
JPH07297258A (ja) 板状体の搬送装置
JPH08222616A (ja) 基板処理装置
JP4279102B2 (ja) 基板処理装置及び基板処理方法
JP4343326B2 (ja) 基板搬送装置および露光装置
JP3880769B2 (ja) 搬送装置の位置合わせ方法および基板処理装置
TW410415B (en) Substrate carrying equipment and substrate processing equipment
JP3936900B2 (ja) 基板の処理システム
CN110943005B (zh) 基板处理装置以及基板处理方法
JP3504822B2 (ja) 基板処理装置および基板処理用露光装置
JP3767811B2 (ja) 基板処理装置、基板処理方法および塗布・現像装置
JPH0484410A (ja) レジスト処理装置
JP2919123B2 (ja) 板状体搬送装置
JP2926213B2 (ja) 基板処理装置
JP3912478B2 (ja) 基板搬送装置
JP2006332558A (ja) 基板の処理システム
JP2010192559A (ja) 基板処理システム
JP2743274B2 (ja) 基板処理装置および基板搬送装置
JP2926703B2 (ja) 基板処理方法及び装置
JP3822752B2 (ja) 処理装置
JP2926592B2 (ja) 基板処理装置
JPH11274283A (ja) 搬送方法及び搬送装置
JP2010192688A (ja) 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060502

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060502

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080827

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080903

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081031

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20081031

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20090406

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090707

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090709

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120717

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees