JP2000323553A5 - - Google Patents

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Publication number
JP2000323553A5
JP2000323553A5 JP1999134129A JP13412999A JP2000323553A5 JP 2000323553 A5 JP2000323553 A5 JP 2000323553A5 JP 1999134129 A JP1999134129 A JP 1999134129A JP 13412999 A JP13412999 A JP 13412999A JP 2000323553 A5 JP2000323553 A5 JP 2000323553A5
Authority
JP
Japan
Prior art keywords
substrate
substrate transfer
temperature control
control plate
transfer member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999134129A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000323553A (ja
JP4343326B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP13412999A priority Critical patent/JP4343326B2/ja
Priority claimed from JP13412999A external-priority patent/JP4343326B2/ja
Priority to US09/570,061 priority patent/US6309212B1/en
Publication of JP2000323553A publication Critical patent/JP2000323553A/ja
Priority to US09/977,702 priority patent/US6607380B1/en
Publication of JP2000323553A5 publication Critical patent/JP2000323553A5/ja
Application granted granted Critical
Publication of JP4343326B2 publication Critical patent/JP4343326B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP13412999A 1999-05-14 1999-05-14 基板搬送装置および露光装置 Expired - Fee Related JP4343326B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP13412999A JP4343326B2 (ja) 1999-05-14 1999-05-14 基板搬送装置および露光装置
US09/570,061 US6309212B1 (en) 1999-05-14 2000-05-12 Substrate conveying system and device manufacturing method using the same
US09/977,702 US6607380B1 (en) 1999-05-14 2001-10-16 Substrate conveying system and device manufacturing method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13412999A JP4343326B2 (ja) 1999-05-14 1999-05-14 基板搬送装置および露光装置

Publications (3)

Publication Number Publication Date
JP2000323553A JP2000323553A (ja) 2000-11-24
JP2000323553A5 true JP2000323553A5 (enExample) 2006-06-22
JP4343326B2 JP4343326B2 (ja) 2009-10-14

Family

ID=15121153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13412999A Expired - Fee Related JP4343326B2 (ja) 1999-05-14 1999-05-14 基板搬送装置および露光装置

Country Status (2)

Country Link
US (2) US6309212B1 (enExample)
JP (1) JP4343326B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4244555B2 (ja) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 被処理体の支持機構
JP4670677B2 (ja) * 2006-02-17 2011-04-13 東京エレクトロン株式会社 加熱装置、加熱方法、塗布装置及び記憶媒体
US8200354B2 (en) * 2006-04-21 2012-06-12 The Boeing Company Assembly task verification system and method
JP4885023B2 (ja) * 2007-03-23 2012-02-29 東京エレクトロン株式会社 ロードロック装置および基板の処理システム
US20090174873A1 (en) * 2007-12-17 2009-07-09 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
JP2010182906A (ja) * 2009-02-06 2010-08-19 Tokyo Electron Ltd 基板処理装置
JP5511536B2 (ja) * 2010-06-17 2014-06-04 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539695A (en) * 1984-01-06 1985-09-03 The Perkin-Elmer Corporation X-Ray lithography system
JPS60169148A (ja) * 1984-02-13 1985-09-02 Dainippon Screen Mfg Co Ltd 基板の搬送方法及びその装置
US4853880A (en) 1985-08-23 1989-08-01 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
US4887904A (en) 1985-08-23 1989-12-19 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
US4984953A (en) 1987-02-20 1991-01-15 Canon Kabushiki Kaisha Plate-like article conveying system
JPH0333058Y2 (enExample) * 1987-06-26 1991-07-12
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
JP3028462B2 (ja) * 1995-05-12 2000-04-04 東京エレクトロン株式会社 熱処理装置
TW353777B (en) * 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
JP3333135B2 (ja) * 1998-06-25 2002-10-07 東京エレクトロン株式会社 熱処理装置及び熱処理方法
US6087632A (en) * 1999-01-11 2000-07-11 Tokyo Electron Limited Heat processing device with hot plate and associated reflector
JP3635214B2 (ja) * 1999-07-05 2005-04-06 東京エレクトロン株式会社 基板処理装置
KR100348938B1 (ko) * 1999-12-06 2002-08-14 한국디엔에스 주식회사 포토리소그라피 공정을 위한 반도체 제조장치
US6402508B2 (en) * 1999-12-09 2002-06-11 Tokyo Electron Limited Heat and cooling treatment apparatus and substrate processing system

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