SE9901831D0 - Bärare för elektronikkomponenter - Google Patents

Bärare för elektronikkomponenter

Info

Publication number
SE9901831D0
SE9901831D0 SE9901831A SE9901831A SE9901831D0 SE 9901831 D0 SE9901831 D0 SE 9901831D0 SE 9901831 A SE9901831 A SE 9901831A SE 9901831 A SE9901831 A SE 9901831A SE 9901831 D0 SE9901831 D0 SE 9901831D0
Authority
SE
Sweden
Prior art keywords
carrier
components
electronic components
ltcc
low temperature
Prior art date
Application number
SE9901831A
Other languages
English (en)
Other versions
SE515856C2 (sv
SE9901831L (sv
Inventor
Leif Bergstedt
Per Ligander
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9901831A priority Critical patent/SE515856C2/sv
Publication of SE9901831D0 publication Critical patent/SE9901831D0/sv
Priority to PCT/SE2000/001008 priority patent/WO2000070679A1/en
Priority to JP2000619030A priority patent/JP4758006B2/ja
Priority to EP00931872A priority patent/EP1186033B1/en
Priority to BR0010572-4A priority patent/BR0010572A/pt
Priority to AU49685/00A priority patent/AU4968500A/en
Priority to DE60041916T priority patent/DE60041916D1/de
Priority to US09/574,243 priority patent/US6690583B1/en
Publication of SE9901831L publication Critical patent/SE9901831L/sv
Publication of SE515856C2 publication Critical patent/SE515856C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01058—Cerium [Ce]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Wire Bonding (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
SE9901831A 1999-05-19 1999-05-19 Bärare för elektronikkomponenter SE515856C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9901831A SE515856C2 (sv) 1999-05-19 1999-05-19 Bärare för elektronikkomponenter
PCT/SE2000/001008 WO2000070679A1 (en) 1999-05-19 2000-05-18 Carrier for electronic components and a method for manufacturing a carrier
JP2000619030A JP4758006B2 (ja) 1999-05-19 2000-05-18 電子部品用のキャリア及びキャリアの製造方法
EP00931872A EP1186033B1 (en) 1999-05-19 2000-05-18 Carrier for electronic components and a method for manufacturing a carrier
BR0010572-4A BR0010572A (pt) 1999-05-19 2000-05-18 Portador projetado para um ou diversos componentes eletrônicos, e, processo para fabricar um portador substancialmente condutor de calor para um componente eletrônico
AU49685/00A AU4968500A (en) 1999-05-19 2000-05-18 Carrier for electronic components and a method for manufacturing a carrier
DE60041916T DE60041916D1 (de) 1999-05-19 2000-05-18 Elektonikbauteil-träger und seine herstellung
US09/574,243 US6690583B1 (en) 1999-05-19 2000-05-19 Carrier for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9901831A SE515856C2 (sv) 1999-05-19 1999-05-19 Bärare för elektronikkomponenter

Publications (3)

Publication Number Publication Date
SE9901831D0 true SE9901831D0 (sv) 1999-05-19
SE9901831L SE9901831L (sv) 2000-11-20
SE515856C2 SE515856C2 (sv) 2001-10-22

Family

ID=20415669

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9901831A SE515856C2 (sv) 1999-05-19 1999-05-19 Bärare för elektronikkomponenter

Country Status (8)

Country Link
US (1) US6690583B1 (sv)
EP (1) EP1186033B1 (sv)
JP (1) JP4758006B2 (sv)
AU (1) AU4968500A (sv)
BR (1) BR0010572A (sv)
DE (1) DE60041916D1 (sv)
SE (1) SE515856C2 (sv)
WO (1) WO2000070679A1 (sv)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6862189B2 (en) * 2000-09-26 2005-03-01 Kabushiki Kaisha Toshiba Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device
SE0004078L (sv) * 2000-11-06 2002-05-07 Imego Ab Metod och anordning för att förse ett substrat med kaviteter
FI119583B (sv) * 2003-02-26 2008-12-31 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
US7429596B2 (en) * 2003-06-20 2008-09-30 The Regents Of The University Of California 1H-pyrrolo [2,3-D] pyrimidine derivatives and methods of use thereof
US7321098B2 (en) * 2004-04-21 2008-01-22 Delphi Technologies, Inc. Laminate ceramic circuit board and process therefor
FI20041680A (sv) * 2004-04-27 2005-10-28 Imbera Electronics Oy Elektronikmodul och förfarande för tillverkning därav
US9512125B2 (en) 2004-11-19 2016-12-06 The Regents Of The University Of California Substituted pyrazolo[3.4-D] pyrimidines as anti-inflammatory agents
US7365273B2 (en) * 2004-12-03 2008-04-29 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices
FR2879819B1 (fr) * 2004-12-21 2007-02-23 Ulis Soc Par Actions Simplifie Composant de detection de rayonnements electromagnetiques notamment infrarouges
US7335986B1 (en) 2005-09-14 2008-02-26 Amkor Technology, Inc. Wafer level chip scale package
DK2004654T3 (da) * 2006-04-04 2013-07-22 Univ California Pyrazolopyrimidin derivater til anvendelse som kinase antagonister
KR100825766B1 (ko) * 2007-04-26 2008-04-29 한국전자통신연구원 Ｌｔｃｃ 패키지 및 그 제조방법
DE102007037538A1 (de) * 2007-08-09 2009-02-12 Robert Bosch Gmbh Baugruppe sowie Herstellung einer Baugruppe
WO2009046448A1 (en) * 2007-10-04 2009-04-09 Intellikine, Inc. Chemical entities and therapeutic uses thereof
US8703777B2 (en) 2008-01-04 2014-04-22 Intellikine Llc Certain chemical entities, compositions and methods
US8193182B2 (en) 2008-01-04 2012-06-05 Intellikine, Inc. Substituted isoquinolin-1(2H)-ones, and methods of use thereof
WO2009114874A2 (en) * 2008-03-14 2009-09-17 Intellikine, Inc. Benzothiazole kinase inhibitors and methods of use
JP5547099B2 (ja) 2008-03-14 2014-07-09 インテリカイン， エルエルシー キナーゼ阻害剤および使用方法
KR100962369B1 (ko) * 2008-06-26 2010-06-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
AU2009268611B2 (en) 2008-07-08 2015-04-09 Intellikine, Llc Kinase inhibitors and methods of use
US20110224223A1 (en) 2008-07-08 2011-09-15 The Regents Of The University Of California, A California Corporation MTOR Modulators and Uses Thereof
JP5731978B2 (ja) 2008-09-26 2015-06-10 インテリカイン， エルエルシー 複素環キナーゼ阻害剤
WO2010040398A1 (en) * 2008-10-08 2010-04-15 Telefonaktiebolaget L M Ericsson (Publ) Chip interconnection
ES2570429T3 (es) 2008-10-16 2016-05-18 Univ California Inhibidores de heteroaril quinasa de anillo condensado
US8476282B2 (en) * 2008-11-03 2013-07-02 Intellikine Llc Benzoxazole kinase inhibitors and methods of use
JP5789252B2 (ja) 2009-05-07 2015-10-07 インテリカイン， エルエルシー 複素環式化合物およびその使用
US8980899B2 (en) 2009-10-16 2015-03-17 The Regents Of The University Of California Methods of inhibiting Ire1
AU2011255218B2 (en) 2010-05-21 2015-03-12 Infinity Pharmaceuticals, Inc. Chemical compounds, compositions and methods for kinase modulation
US8847376B2 (en) 2010-07-23 2014-09-30 Tessera, Inc. Microelectronic elements with post-assembly planarization
EP2637669A4 (en) 2010-11-10 2014-04-02 Infinity Pharmaceuticals Inc Heterocyclic compounds and their use
JP2014501790A (ja) 2011-01-10 2014-01-23 インフィニティー ファーマシューティカルズ， インコーポレイテッド イソキノリノンの調製方法及びイソキノリノンの固体形態
US9295673B2 (en) 2011-02-23 2016-03-29 Intellikine Llc Combination of mTOR inhibitors and P13-kinase inhibitors, and uses thereof
AR088218A1 (es) 2011-07-19 2014-05-21 Infinity Pharmaceuticals Inc Compuestos heterociclicos utiles como inhibidores de pi3k
EP2734520B1 (en) 2011-07-19 2016-09-14 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
RU2014111823A (ru) 2011-08-29 2015-10-10 Инфинити Фармасьютикалз, Инк. Гетероциклические соединения и их применения
JP6342805B2 (ja) 2011-09-02 2018-06-13 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 置換ピラゾロ［３，４−ｄ］ピリミジンおよびその用途
US8940742B2 (en) 2012-04-10 2015-01-27 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
US8828998B2 (en) 2012-06-25 2014-09-09 Infinity Pharmaceuticals, Inc. Treatment of lupus, fibrotic conditions, and inflammatory myopathies and other disorders using PI3 kinase inhibitors
RU2015115631A (ru) 2012-09-26 2016-11-20 Дзе Риджентс Оф Дзе Юниверсити Оф Калифорния Модулирование ire1
US9385075B2 (en) * 2012-10-26 2016-07-05 Infineon Technologies Ag Glass carrier with embedded semiconductor device and metal layers on the top surface
US9481667B2 (en) 2013-03-15 2016-11-01 Infinity Pharmaceuticals, Inc. Salts and solid forms of isoquinolinones and composition comprising and methods of using the same
PL3052485T3 (pl) 2013-10-04 2022-02-28 Infinity Pharmaceuticals, Inc. Związki heterocykliczne i ich zastosowania
US9751888B2 (en) 2013-10-04 2017-09-05 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
SG11201607705XA (en) 2014-03-19 2016-10-28 Infinity Pharmaceuticals Inc Heterocyclic compounds for use in the treatment of pi3k-gamma mediated disorders
US20150320755A1 (en) 2014-04-16 2015-11-12 Infinity Pharmaceuticals, Inc. Combination therapies
US9708348B2 (en) 2014-10-03 2017-07-18 Infinity Pharmaceuticals, Inc. Trisubstituted bicyclic heterocyclic compounds with kinase activities and uses thereof
US10160761B2 (en) 2015-09-14 2018-12-25 Infinity Pharmaceuticals, Inc. Solid forms of isoquinolinones, and process of making, composition comprising, and methods of using the same
WO2017161116A1 (en) 2016-03-17 2017-09-21 Infinity Pharmaceuticals, Inc. Isotopologues of isoquinolinone and quinazolinone compounds and uses thereof as pi3k kinase inhibitors
US10919914B2 (en) 2016-06-08 2021-02-16 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
SG10201912456RA (en) 2016-06-24 2020-02-27 Infinity Pharmaceuticals Inc Combination therapies
US10636690B2 (en) * 2016-07-20 2020-04-28 Applied Materials, Inc. Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6265991A (ja) * 1985-09-13 1987-03-25 株式会社東芝 高熱伝導性セラミツクス基板
JPS62224646A (ja) * 1986-03-12 1987-10-02 オリン　コ−ポレ−シヨン 複合材料とその製造方法
JPH02500907A (ja) * 1986-10-30 1990-03-29 オリン コーポレーション セラミック・ガラス・金属複合体
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
JPH0541471A (ja) * 1991-08-07 1993-02-19 Hitachi Ltd 半導体集積回路装置
US5343363A (en) * 1992-12-21 1994-08-30 Delco Electronics Corporation Split backed pressure sensitive die carrier tape
US5831828A (en) * 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
US5386339A (en) * 1993-07-29 1995-01-31 Hughes Aircraft Company Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink
US5532513A (en) * 1994-07-08 1996-07-02 Johnson Matthey Electronics, Inc. Metal-ceramic composite lid
US5798909A (en) * 1995-02-15 1998-08-25 International Business Machines Corporation Single-tiered organic chip carriers for wire bond-type chips
US5661647A (en) * 1995-06-07 1997-08-26 Hughes Electronics Low temperature co-fired ceramic UHF/VHF power converters
US5708570A (en) * 1995-10-11 1998-01-13 Hughes Aircraft Company Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures
JPH09266265A (ja) * 1996-03-28 1997-10-07 Toshiba Corp 半導体パッケージ
EP0934515B1 (en) * 1996-10-09 2006-03-08 Symyx Technologies, Inc. Infrared spectroscopy and imaging of libraries
US5855803A (en) * 1996-11-20 1999-01-05 Northrop Grumman Corporation Template type cavity-formation device for low temperature cofired ceramic (LTCC) sheets
WO1998035398A1 (de) * 1997-02-11 1998-08-13 Bossel Ulf G Brennstoffzellenstapel mit festen elektrolyten und deren anordnung
JPH10256429A (ja) * 1997-03-07 1998-09-25 Toshiba Corp 半導体パッケージ
JPH1154665A (ja) * 1997-07-31 1999-02-26 Toshiba Corp 複合パッケージ
SE514529C2 (sv) 1998-09-21 2001-03-05 Ericsson Telefon Ab L M Metod och anordning för begravda elektronik-komponenter
US6288905B1 (en) * 1999-04-15 2001-09-11 Amerasia International Technology Inc. Contact module, as for a smart card, and method for making same

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WO2000070679B1 (en) 2001-02-08
JP2003500834A (ja) 2003-01-07
SE515856C2 (sv) 2001-10-22
WO2000070679A1 (en) 2000-11-23
SE9901831L (sv) 2000-11-20
US6690583B1 (en) 2004-02-10
DE60041916D1 (de) 2009-05-14
EP1186033B1 (en) 2009-04-01
JP4758006B2 (ja) 2011-08-24
AU4968500A (en) 2000-12-05
EP1186033A1 (en) 2002-03-13

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