IT8820975A0 - Dispositivo per il raffreddamento di zone con superficie di scambio termico limitata, in particolareper componenti elettronici. - Google Patents

Dispositivo per il raffreddamento di zone con superficie di scambio termico limitata, in particolareper componenti elettronici.

Info

Publication number
IT8820975A0
IT8820975A0 IT8820975A IT2097588A IT8820975A0 IT 8820975 A0 IT8820975 A0 IT 8820975A0 IT 8820975 A IT8820975 A IT 8820975A IT 2097588 A IT2097588 A IT 2097588A IT 8820975 A0 IT8820975 A0 IT 8820975A0
Authority
IT
Italy
Prior art keywords
heat exchange
electronic components
exchange surface
limited heat
cooling areas
Prior art date
Application number
IT8820975A
Other languages
English (en)
Other versions
IT1218075B (it
Inventor
Antonio Callerio
Vincenzo Callerio
Original Assignee
Fimac Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fimac Spa filed Critical Fimac Spa
Priority to IT20975/88A priority Critical patent/IT1218075B/it
Publication of IT8820975A0 publication Critical patent/IT8820975A0/it
Priority to EP89110123A priority patent/EP0346719A3/en
Priority to US07/362,792 priority patent/US5029635A/en
Priority to CA000602805A priority patent/CA1316586C/en
Application granted granted Critical
Publication of IT1218075B publication Critical patent/IT1218075B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/911—Vaporization

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT20975/88A 1988-06-15 1988-06-15 Dispositivo per il raffredamento di zone con superficie di scambio termico limitata,in particolare per componenti elettronici IT1218075B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT20975/88A IT1218075B (it) 1988-06-15 1988-06-15 Dispositivo per il raffredamento di zone con superficie di scambio termico limitata,in particolare per componenti elettronici
EP89110123A EP0346719A3 (en) 1988-06-15 1989-06-05 Device for cooling regions with limited thermal exchange surface, in particular for electronic components
US07/362,792 US5029635A (en) 1988-06-15 1989-06-07 Device for cooling regions with limited thermal exchange surface, in particular for electronic components
CA000602805A CA1316586C (en) 1988-06-15 1989-06-14 Device for cooling regions with limited thermal exchange surface, in particular for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT20975/88A IT1218075B (it) 1988-06-15 1988-06-15 Dispositivo per il raffredamento di zone con superficie di scambio termico limitata,in particolare per componenti elettronici

Publications (2)

Publication Number Publication Date
IT8820975A0 true IT8820975A0 (it) 1988-06-15
IT1218075B IT1218075B (it) 1990-04-12

Family

ID=11174871

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20975/88A IT1218075B (it) 1988-06-15 1988-06-15 Dispositivo per il raffredamento di zone con superficie di scambio termico limitata,in particolare per componenti elettronici

Country Status (4)

Country Link
US (1) US5029635A (it)
EP (1) EP0346719A3 (it)
CA (1) CA1316586C (it)
IT (1) IT1218075B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220809A (en) * 1991-10-11 1993-06-22 Nartron Corporation Apparatus for cooling an air conditioning system electrical controller
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2295087A (en) * 1939-03-24 1942-09-08 William P Gruner Fluid cooling apparatus and method
US2393854A (en) * 1942-01-31 1946-01-29 Elizabeth C Carpenter Feed control for liquid refrigerant
US2698162A (en) * 1951-04-18 1954-12-28 North Penn Company Inc Cooling jacket for beverage dispensers
US3006157A (en) * 1960-05-04 1961-10-31 Union Carbide Corp Cryogenic apparatus
US3324674A (en) * 1966-01-03 1967-06-13 Texas Instruments Inc Refrigeration control apparatus
DE2204589A1 (de) * 1972-02-01 1973-08-16 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente
US4212349A (en) * 1979-01-02 1980-07-15 International Business Machines Corporation Micro bellows thermo capsule
JPS5936827B2 (ja) * 1979-01-12 1984-09-06 日本電信電話株式会社 集積回路素子の冷却装置

Also Published As

Publication number Publication date
EP0346719A2 (en) 1989-12-20
IT1218075B (it) 1990-04-12
US5029635A (en) 1991-07-09
CA1316586C (en) 1993-04-20
EP0346719A3 (en) 1990-08-16

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