JP4303120B2 - 半導体ウェハキャリア用マッピングセンサ - Google Patents

半導体ウェハキャリア用マッピングセンサ Download PDF

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Publication number
JP4303120B2
JP4303120B2 JP2003553603A JP2003553603A JP4303120B2 JP 4303120 B2 JP4303120 B2 JP 4303120B2 JP 2003553603 A JP2003553603 A JP 2003553603A JP 2003553603 A JP2003553603 A JP 2003553603A JP 4303120 B2 JP4303120 B2 JP 4303120B2
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Prior art keywords
sensor
laser
wafer
detector
laser source
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JP2003553603A
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Japanese (ja)
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JP2005513775A5 (https=
JP2005513775A (ja
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シューダ，フェリックス，ジェイ．
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サイバーオプティクス セミコンダクタ インコーポレイテッド
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Lasers (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2003553603A 2001-12-17 2002-12-16 半導体ウェハキャリア用マッピングセンサ Expired - Fee Related JP4303120B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34149401P 2001-12-17 2001-12-17
PCT/US2002/040104 WO2003052800A2 (en) 2001-12-17 2002-12-16 Semiconductor wafer carrier mapping sensor

Publications (3)

Publication Number Publication Date
JP2005513775A JP2005513775A (ja) 2005-05-12
JP2005513775A5 JP2005513775A5 (https=) 2006-02-09
JP4303120B2 true JP4303120B2 (ja) 2009-07-29

Family

ID=23337807

Family Applications (1)

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JP2003553603A Expired - Fee Related JP4303120B2 (ja) 2001-12-17 2002-12-16 半導体ウェハキャリア用マッピングセンサ

Country Status (7)

Country Link
US (1) US7095763B2 (https=)
JP (1) JP4303120B2 (https=)
KR (1) KR20040070216A (https=)
CN (1) CN100397557C (https=)
AU (1) AU2002357241A1 (https=)
DE (1) DE10297565T5 (https=)
WO (1) WO2003052800A2 (https=)

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US6825486B1 (en) * 2001-07-13 2004-11-30 Cyberoptics Corporation System for mapping wafers using predictive dynamic lighting
US7418016B2 (en) * 2003-02-13 2008-08-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for modifying the spread of a laser beam
US20050086024A1 (en) * 2003-09-19 2005-04-21 Cyberoptics Semiconductor Inc. Semiconductor wafer location sensing via non contact methods
JP2007528615A (ja) * 2004-03-09 2007-10-11 サイバーオプティクス セミコンダクタ インコーポレイテッド 改良型の基板状無線センサ
DE112007002309T5 (de) * 2006-09-29 2009-07-30 Cyberoptics Semiconductor, Inc., Beaverton Substratähnlicher Teilchensensor
CN101206181B (zh) * 2006-12-22 2010-05-19 中芯国际集成电路制造(上海)有限公司 检测晶圆边缘洗边效果的装置及方法
JP2013093389A (ja) * 2011-10-24 2013-05-16 Hitachi High-Technologies Corp 光学式検査装置及びエッジ検査装置
DE102016101942B4 (de) 2016-02-04 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung
KR102181121B1 (ko) * 2016-09-20 2020-11-20 주식회사 원익아이피에스 기판 이송 장치 및 기판 이송 장치의 제어 방법
KR102342270B1 (ko) * 2021-06-03 2021-12-22 정병철 측정기를 이용한 반도체 웨이퍼의 티칭을 위한 측정방법
KR102342264B1 (ko) * 2021-06-03 2021-12-22 정병철 반도체 웨이퍼의 티칭을 위한 측정기
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置

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US3815998A (en) * 1972-10-30 1974-06-11 Ibm Surface contrast system and method
US4304467A (en) * 1979-05-29 1981-12-08 International Business Machines Corporation Focussed laser beam optical system
JPS5917139A (ja) 1982-07-20 1984-01-28 Matsushita Electric Ind Co Ltd 反射率測定方法
US4701928A (en) * 1985-10-02 1987-10-20 Board Of Trustees, Leland J. Stanford University Diode laser pumped co-doped laser
US4786816A (en) * 1985-11-05 1988-11-22 Canon Kabushiki Kaisha Wafer detecting device wherein light receiver has an effective surface larger than the dimensional range covering all the wafers being detected
US5121160A (en) * 1989-03-09 1992-06-09 Canon Kabushiki Kaisha Exposure method and apparatus
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JP3278896B2 (ja) 1992-03-31 2002-04-30 キヤノン株式会社 照明装置及びそれを用いた投影露光装置
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation
JPH0677307A (ja) * 1992-08-24 1994-03-18 Tokyo Electron Tohoku Ltd 透明基板検出装置及び基板検出装置
US5479252A (en) * 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
JP3057998B2 (ja) * 1994-02-16 2000-07-04 キヤノン株式会社 照明装置及びそれを用いた投影露光装置
US5504345A (en) * 1994-04-14 1996-04-02 Hama Laboratories, Inc. Dual beam sensor and edge detection system and method
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US6130437A (en) * 1998-04-24 2000-10-10 Hama Sensors, Inc. Sensor and detection system having wide diverging beam optics
US6100976A (en) * 1998-09-21 2000-08-08 The Board Of Regents For Oklahoma State University Method and apparatus for fiber optic multiple scattering suppression
US6177989B1 (en) * 1999-03-01 2001-01-23 Advanced Micro Devices Laser induced current for semiconductor defect detection
US6091488A (en) * 1999-03-22 2000-07-18 Beltronics, Inc. Method of and apparatus for automatic high-speed optical inspection of semi-conductor structures and the like through fluorescent photoresist inspection
TW409285B (en) * 1999-04-13 2000-10-21 United Microelectronics Corp Wafer position mapping device
JP2001091873A (ja) * 1999-09-24 2001-04-06 Toshiba Tec Corp 光走査装置
US7509048B2 (en) * 2001-07-20 2009-03-24 Essex Corporation Method and apparatus for optical signal processing using an optical tapped delay line
US6560265B2 (en) * 2001-09-11 2003-05-06 Applied Optoelectronics, Inc. Method and apparatus for polarizing light in a VCSEL
US6900451B2 (en) * 2001-11-08 2005-05-31 Multimextrixs, Llc Mapping sensor system for detecting positions of flat objects

Also Published As

Publication number Publication date
WO2003052800A2 (en) 2003-06-26
US7095763B2 (en) 2006-08-22
WO2003052800B1 (en) 2004-02-12
WO2003052800A3 (en) 2003-11-13
AU2002357241A1 (en) 2003-06-30
CN100397557C (zh) 2008-06-25
US20030141465A1 (en) 2003-07-31
DE10297565T5 (de) 2005-01-05
KR20040070216A (ko) 2004-08-06
AU2002357241A8 (en) 2003-06-30
CN1833308A (zh) 2006-09-13
JP2005513775A (ja) 2005-05-12

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