AU2002357241A1 - Semiconductor wafer carrier mapping sensor - Google Patents

Semiconductor wafer carrier mapping sensor

Info

Publication number
AU2002357241A1
AU2002357241A1 AU2002357241A AU2002357241A AU2002357241A1 AU 2002357241 A1 AU2002357241 A1 AU 2002357241A1 AU 2002357241 A AU2002357241 A AU 2002357241A AU 2002357241 A AU2002357241 A AU 2002357241A AU 2002357241 A1 AU2002357241 A1 AU 2002357241A1
Authority
AU
Australia
Prior art keywords
semiconductor wafer
wafer carrier
mapping sensor
carrier mapping
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002357241A
Other languages
English (en)
Other versions
AU2002357241A8 (en
Inventor
Felix J. Schuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cyberoptics Corp
Original Assignee
Cyberoptics Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Semiconductor Inc filed Critical Cyberoptics Semiconductor Inc
Publication of AU2002357241A1 publication Critical patent/AU2002357241A1/en
Publication of AU2002357241A8 publication Critical patent/AU2002357241A8/xx
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
AU2002357241A 2001-12-17 2002-12-16 Semiconductor wafer carrier mapping sensor Abandoned AU2002357241A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US34149401P 2001-12-17 2001-12-17
US60/341,494 2001-12-17
PCT/US2002/040104 WO2003052800A2 (en) 2001-12-17 2002-12-16 Semiconductor wafer carrier mapping sensor

Publications (2)

Publication Number Publication Date
AU2002357241A1 true AU2002357241A1 (en) 2003-06-30
AU2002357241A8 AU2002357241A8 (en) 2003-06-30

Family

ID=23337807

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002357241A Abandoned AU2002357241A1 (en) 2001-12-17 2002-12-16 Semiconductor wafer carrier mapping sensor

Country Status (7)

Country Link
US (1) US7095763B2 (https=)
JP (1) JP4303120B2 (https=)
KR (1) KR20040070216A (https=)
CN (1) CN100397557C (https=)
AU (1) AU2002357241A1 (https=)
DE (1) DE10297565T5 (https=)
WO (1) WO2003052800A2 (https=)

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US6897463B1 (en) * 2001-07-13 2005-05-24 Cyberoptics Semiconductor, Inc. Wafer carrier mapping sensor assembly
US6825486B1 (en) * 2001-07-13 2004-11-30 Cyberoptics Corporation System for mapping wafers using predictive dynamic lighting
US7418016B2 (en) * 2003-02-13 2008-08-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for modifying the spread of a laser beam
US20050086024A1 (en) * 2003-09-19 2005-04-21 Cyberoptics Semiconductor Inc. Semiconductor wafer location sensing via non contact methods
JP2007528615A (ja) * 2004-03-09 2007-10-11 サイバーオプティクス セミコンダクタ インコーポレイテッド 改良型の基板状無線センサ
DE112007002309T5 (de) * 2006-09-29 2009-07-30 Cyberoptics Semiconductor, Inc., Beaverton Substratähnlicher Teilchensensor
CN101206181B (zh) * 2006-12-22 2010-05-19 中芯国际集成电路制造(上海)有限公司 检测晶圆边缘洗边效果的装置及方法
JP2013093389A (ja) * 2011-10-24 2013-05-16 Hitachi High-Technologies Corp 光学式検査装置及びエッジ検査装置
DE102016101942B4 (de) 2016-02-04 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung
KR102181121B1 (ko) * 2016-09-20 2020-11-20 주식회사 원익아이피에스 기판 이송 장치 및 기판 이송 장치의 제어 방법
KR102342270B1 (ko) * 2021-06-03 2021-12-22 정병철 측정기를 이용한 반도체 웨이퍼의 티칭을 위한 측정방법
KR102342264B1 (ko) * 2021-06-03 2021-12-22 정병철 반도체 웨이퍼의 티칭을 위한 측정기
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置

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US3815998A (en) * 1972-10-30 1974-06-11 Ibm Surface contrast system and method
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JPS5917139A (ja) 1982-07-20 1984-01-28 Matsushita Electric Ind Co Ltd 反射率測定方法
US4701928A (en) * 1985-10-02 1987-10-20 Board Of Trustees, Leland J. Stanford University Diode laser pumped co-doped laser
US4786816A (en) * 1985-11-05 1988-11-22 Canon Kabushiki Kaisha Wafer detecting device wherein light receiver has an effective surface larger than the dimensional range covering all the wafers being detected
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US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation
JPH0677307A (ja) * 1992-08-24 1994-03-18 Tokyo Electron Tohoku Ltd 透明基板検出装置及び基板検出装置
US5479252A (en) * 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
JP3057998B2 (ja) * 1994-02-16 2000-07-04 キヤノン株式会社 照明装置及びそれを用いた投影露光装置
US5504345A (en) * 1994-04-14 1996-04-02 Hama Laboratories, Inc. Dual beam sensor and edge detection system and method
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US5710424A (en) * 1995-10-18 1998-01-20 Imra America, Inc. Multiple field of view detector with background cancellation
US5943130A (en) * 1996-10-21 1999-08-24 Insitec, Inc. In situ sensor for near wafer particle monitoring in semiconductor device manufacturing equipment
JPH11101624A (ja) * 1997-09-29 1999-04-13 Hitachi Ltd 欠陥評価装置およびその方法並びに半導体の製造方法
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JPH11237345A (ja) * 1998-02-24 1999-08-31 Hitachi Ltd 表面計測装置
US6592040B2 (en) * 1998-03-20 2003-07-15 Symbol Technologies, Inc. Hand-held bar code reader with single printed circuit board
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US6100976A (en) * 1998-09-21 2000-08-08 The Board Of Regents For Oklahoma State University Method and apparatus for fiber optic multiple scattering suppression
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TW409285B (en) * 1999-04-13 2000-10-21 United Microelectronics Corp Wafer position mapping device
JP2001091873A (ja) * 1999-09-24 2001-04-06 Toshiba Tec Corp 光走査装置
US7509048B2 (en) * 2001-07-20 2009-03-24 Essex Corporation Method and apparatus for optical signal processing using an optical tapped delay line
US6560265B2 (en) * 2001-09-11 2003-05-06 Applied Optoelectronics, Inc. Method and apparatus for polarizing light in a VCSEL
US6900451B2 (en) * 2001-11-08 2005-05-31 Multimextrixs, Llc Mapping sensor system for detecting positions of flat objects

Also Published As

Publication number Publication date
WO2003052800A2 (en) 2003-06-26
US7095763B2 (en) 2006-08-22
JP4303120B2 (ja) 2009-07-29
WO2003052800B1 (en) 2004-02-12
WO2003052800A3 (en) 2003-11-13
CN100397557C (zh) 2008-06-25
US20030141465A1 (en) 2003-07-31
DE10297565T5 (de) 2005-01-05
KR20040070216A (ko) 2004-08-06
AU2002357241A8 (en) 2003-06-30
CN1833308A (zh) 2006-09-13
JP2005513775A (ja) 2005-05-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase