JP2005513775A - 半導体ウェハキャリア用マッピングセンサ - Google Patents
半導体ウェハキャリア用マッピングセンサ Download PDFInfo
- Publication number
- JP2005513775A JP2005513775A JP2003553603A JP2003553603A JP2005513775A JP 2005513775 A JP2005513775 A JP 2005513775A JP 2003553603 A JP2003553603 A JP 2003553603A JP 2003553603 A JP2003553603 A JP 2003553603A JP 2005513775 A JP2005513775 A JP 2005513775A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- laser
- laser source
- detector
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000013507 mapping Methods 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 title description 3
- 230000003287 optical effect Effects 0.000 claims abstract description 22
- 238000001514 detection method Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 11
- 235000012431 wafers Nutrition 0.000 description 55
- 238000010586 diagram Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Semiconductor Lasers (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
Description
102……ウェハ
104……キャリア
106,108……レーザダイオード
110,112……検出器
114……レーザ駆動回路
116……DSP論理素子
118……ウェハの縁
119……増幅回路
Claims (21)
- 発散レーザビームを発生するように構成された少なくとも一つのレーザ源と、
前記発散レーザビームを受光しウェハの縁の近くに集束させるように配置された集束レンズと、
前記ビームを受光し、かつ該ビームを第1の方向に発散させて、縞を発生させるように配置されたシリンドリカルレンズと、
前記ウェハの縁で反射したレーザ光を受光しセンサ出力信号を生成するように構成された検出器と、
少なくとも一つのレーザ源の前に配置された少なくとも一つの光学的絞りとからなるウェハキャリア用マッピングセンサ。 - 前記集束レンズの焦点距離が少なくとも約8mmである請求項1のセンサ。
- 前記少なくとも一つの光学的絞りが三つの光学的絞りを含んでいる請求項1のセンサ。
- 前記少なくとも一つの光学的絞りが前記少なくとも一つのレーザ源の物理的パッケージ上に直接配置された請求項1のセンサ。
- 前記少なくとも一つのレーザ源がレーザダイオードチップを含み、前記少なくとも一つの光学的絞りが該チップから約300ミクロン以内に配置されている請求項1のセンサ。
- 前記少なくとも一つの光学的絞りが約200ミクロンより大きくない直径の開口を含んでいる請求項1のセンサ。
- 前記検出器がピーク検出波長を有し、前記少なくとも一つのレーザ源が、該ピーク検出波長に匹敵するレーザ光を提供するように構成された請求項1のセンサ。
- 前記ピーク検出波長が約850nmである請求項7のセンサ。
- 前記少なくとも一つのレーザ源が、少なくともCDRH第1級およびIEC−80625−1第1級の一つにおける最大許容パワーで動作するように構成された請求項8のセンサ。
- 前記ピーク検出波長が約900nmである請求項7のセンサ。
- 前記少なくとも一つのレーザ源が、少なくともCDRH第1級およびIEC−80625−1第1級の一つにおける最大許容パワーで動作するように構成された請求項10のセンサ。
- 前記少なくとも一つのレーザ源が、少なくともCDRH第1級およびIEC−80625−1第1級の一つにおける最大許容パワーで動作するように構成された請求項1のセンサ。
- 前記検出器の前に配置されて、該検出器の光収集量を増やすレンズをさらに備えた請求項1のセンサ。
- 前記検出器の視野が、予想されるウェハのノッチのサイズより大きい請求項13のセンサ。
- 前記視野が約6.0mmである請求項14のセンサ。
- 前記検出器がフォトトランジスタを含んでいる請求項1のセンサ。
- 前記少なくとも一つのレーザ源がレーザダイオードを含んでいる請求項1のセンサ。
- 前記少なくとも一つのレーザ源がエッジエミッタを含んでいる請求項1のセンサ。
- 前記エッジエミッタが約4×20ミクロンの能動的放出面積を有している請求項18のセンサ。
- 前記検出器の前に配置された周囲光のフィルタをさらに備えた請求項1のセンサ。
- ウェハの縁でレーザ縞を感知しそれを示す信号を提供するように構成された検出器と、
第2方向の高さより大きい第1方向の幅、中央部、および該中央部でピーク強度を有するレーザ縞を発生させるためのレーザ縞発生器とからなり、
前記縞が前記中央部から前記第2方向へ1mmの間隔をおいた領域を含み、該領域の強度が前記ピーク強度の約10000分の1以下であるウェハキャリア用マッピングセンサ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34149401P | 2001-12-17 | 2001-12-17 | |
PCT/US2002/040104 WO2003052800A2 (en) | 2001-12-17 | 2002-12-16 | Semiconductor wafer carrier mapping sensor |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005513775A true JP2005513775A (ja) | 2005-05-12 |
JP2005513775A5 JP2005513775A5 (ja) | 2006-02-09 |
JP4303120B2 JP4303120B2 (ja) | 2009-07-29 |
Family
ID=23337807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003553603A Expired - Fee Related JP4303120B2 (ja) | 2001-12-17 | 2002-12-16 | 半導体ウェハキャリア用マッピングセンサ |
Country Status (7)
Country | Link |
---|---|
US (1) | US7095763B2 (ja) |
JP (1) | JP4303120B2 (ja) |
KR (1) | KR20040070216A (ja) |
CN (1) | CN100397557C (ja) |
AU (1) | AU2002357241A1 (ja) |
DE (1) | DE10297565T5 (ja) |
WO (1) | WO2003052800A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102342270B1 (ko) * | 2021-06-03 | 2021-12-22 | 정병철 | 측정기를 이용한 반도체 웨이퍼의 티칭을 위한 측정방법 |
KR102342264B1 (ko) * | 2021-06-03 | 2021-12-22 | 정병철 | 반도체 웨이퍼의 티칭을 위한 측정기 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6825486B1 (en) * | 2001-07-13 | 2004-11-30 | Cyberoptics Corporation | System for mapping wafers using predictive dynamic lighting |
US6897463B1 (en) * | 2001-07-13 | 2005-05-24 | Cyberoptics Semiconductor, Inc. | Wafer carrier mapping sensor assembly |
US7418016B2 (en) * | 2003-02-13 | 2008-08-26 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Method and apparatus for modifying the spread of a laser beam |
US20050086024A1 (en) * | 2003-09-19 | 2005-04-21 | Cyberoptics Semiconductor Inc. | Semiconductor wafer location sensing via non contact methods |
WO2008042199A2 (en) * | 2006-09-29 | 2008-04-10 | Cyberoptics Semiconductor, Inc. | Particles sensor integrated with substrate |
CN101206181B (zh) * | 2006-12-22 | 2010-05-19 | 中芯国际集成电路制造(上海)有限公司 | 检测晶圆边缘洗边效果的装置及方法 |
JP2013093389A (ja) * | 2011-10-24 | 2013-05-16 | Hitachi High-Technologies Corp | 光学式検査装置及びエッジ検査装置 |
DE102016101942B4 (de) | 2016-02-04 | 2022-07-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung |
KR102181121B1 (ko) * | 2016-09-20 | 2020-11-20 | 주식회사 원익아이피에스 | 기판 이송 장치 및 기판 이송 장치의 제어 방법 |
TWI831162B (zh) * | 2022-03-24 | 2024-02-01 | 上銀科技股份有限公司 | 裝載埠及其映射裝置 |
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-
2002
- 2002-12-16 WO PCT/US2002/040104 patent/WO2003052800A2/en active Application Filing
- 2002-12-16 AU AU2002357241A patent/AU2002357241A1/en not_active Abandoned
- 2002-12-16 JP JP2003553603A patent/JP4303120B2/ja not_active Expired - Fee Related
- 2002-12-16 CN CNB028249461A patent/CN100397557C/zh not_active Expired - Fee Related
- 2002-12-16 US US10/320,756 patent/US7095763B2/en not_active Expired - Lifetime
- 2002-12-16 KR KR10-2004-7009061A patent/KR20040070216A/ko active Search and Examination
- 2002-12-16 DE DE10297565T patent/DE10297565T5/de not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102342270B1 (ko) * | 2021-06-03 | 2021-12-22 | 정병철 | 측정기를 이용한 반도체 웨이퍼의 티칭을 위한 측정방법 |
KR102342264B1 (ko) * | 2021-06-03 | 2021-12-22 | 정병철 | 반도체 웨이퍼의 티칭을 위한 측정기 |
Also Published As
Publication number | Publication date |
---|---|
JP4303120B2 (ja) | 2009-07-29 |
US7095763B2 (en) | 2006-08-22 |
WO2003052800A3 (en) | 2003-11-13 |
KR20040070216A (ko) | 2004-08-06 |
CN1833308A (zh) | 2006-09-13 |
US20030141465A1 (en) | 2003-07-31 |
WO2003052800A2 (en) | 2003-06-26 |
CN100397557C (zh) | 2008-06-25 |
AU2002357241A1 (en) | 2003-06-30 |
WO2003052800B1 (en) | 2004-02-12 |
DE10297565T5 (de) | 2005-01-05 |
AU2002357241A8 (en) | 2003-06-30 |
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