KR20040070216A - 반도체 웨이퍼 캐리어 맵핑 센서 - Google Patents

반도체 웨이퍼 캐리어 맵핑 센서 Download PDF

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Publication number
KR20040070216A
KR20040070216A KR10-2004-7009061A KR20047009061A KR20040070216A KR 20040070216 A KR20040070216 A KR 20040070216A KR 20047009061 A KR20047009061 A KR 20047009061A KR 20040070216 A KR20040070216 A KR 20040070216A
Authority
KR
South Korea
Prior art keywords
wafer carrier
carrier mapping
mapping sensor
laser
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2004-7009061A
Other languages
English (en)
Korean (ko)
Inventor
펠릭스 제이. 슈다
Original Assignee
싸이버옵틱스 쎄미콘덕터 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 싸이버옵틱스 쎄미콘덕터 인코퍼레이티드 filed Critical 싸이버옵틱스 쎄미콘덕터 인코퍼레이티드
Publication of KR20040070216A publication Critical patent/KR20040070216A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Lasers (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
KR10-2004-7009061A 2001-12-17 2002-12-16 반도체 웨이퍼 캐리어 맵핑 센서 Ceased KR20040070216A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US34149401P 2001-12-17 2001-12-17
US60/341,494 2001-12-17
PCT/US2002/040104 WO2003052800A2 (en) 2001-12-17 2002-12-16 Semiconductor wafer carrier mapping sensor

Publications (1)

Publication Number Publication Date
KR20040070216A true KR20040070216A (ko) 2004-08-06

Family

ID=23337807

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7009061A Ceased KR20040070216A (ko) 2001-12-17 2002-12-16 반도체 웨이퍼 캐리어 맵핑 센서

Country Status (7)

Country Link
US (1) US7095763B2 (https=)
JP (1) JP4303120B2 (https=)
KR (1) KR20040070216A (https=)
CN (1) CN100397557C (https=)
AU (1) AU2002357241A1 (https=)
DE (1) DE10297565T5 (https=)
WO (1) WO2003052800A2 (https=)

Families Citing this family (13)

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US6897463B1 (en) * 2001-07-13 2005-05-24 Cyberoptics Semiconductor, Inc. Wafer carrier mapping sensor assembly
US6825486B1 (en) * 2001-07-13 2004-11-30 Cyberoptics Corporation System for mapping wafers using predictive dynamic lighting
US7418016B2 (en) * 2003-02-13 2008-08-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for modifying the spread of a laser beam
US20050086024A1 (en) * 2003-09-19 2005-04-21 Cyberoptics Semiconductor Inc. Semiconductor wafer location sensing via non contact methods
JP2007528615A (ja) * 2004-03-09 2007-10-11 サイバーオプティクス セミコンダクタ インコーポレイテッド 改良型の基板状無線センサ
DE112007002309T5 (de) * 2006-09-29 2009-07-30 Cyberoptics Semiconductor, Inc., Beaverton Substratähnlicher Teilchensensor
CN101206181B (zh) * 2006-12-22 2010-05-19 中芯国际集成电路制造(上海)有限公司 检测晶圆边缘洗边效果的装置及方法
JP2013093389A (ja) * 2011-10-24 2013-05-16 Hitachi High-Technologies Corp 光学式検査装置及びエッジ検査装置
DE102016101942B4 (de) 2016-02-04 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung
KR102181121B1 (ko) * 2016-09-20 2020-11-20 주식회사 원익아이피에스 기판 이송 장치 및 기판 이송 장치의 제어 방법
KR102342270B1 (ko) * 2021-06-03 2021-12-22 정병철 측정기를 이용한 반도체 웨이퍼의 티칭을 위한 측정방법
KR102342264B1 (ko) * 2021-06-03 2021-12-22 정병철 반도체 웨이퍼의 티칭을 위한 측정기
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置

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US3815998A (en) * 1972-10-30 1974-06-11 Ibm Surface contrast system and method
US4304467A (en) * 1979-05-29 1981-12-08 International Business Machines Corporation Focussed laser beam optical system
JPS5917139A (ja) 1982-07-20 1984-01-28 Matsushita Electric Ind Co Ltd 反射率測定方法
US4701928A (en) * 1985-10-02 1987-10-20 Board Of Trustees, Leland J. Stanford University Diode laser pumped co-doped laser
US4786816A (en) * 1985-11-05 1988-11-22 Canon Kabushiki Kaisha Wafer detecting device wherein light receiver has an effective surface larger than the dimensional range covering all the wafers being detected
US5121160A (en) * 1989-03-09 1992-06-09 Canon Kabushiki Kaisha Exposure method and apparatus
US4994666A (en) * 1989-12-21 1991-02-19 Disctronics Manufacturing, Inc. Optical disc counter
JP3278896B2 (ja) 1992-03-31 2002-04-30 キヤノン株式会社 照明装置及びそれを用いた投影露光装置
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation
JPH0677307A (ja) * 1992-08-24 1994-03-18 Tokyo Electron Tohoku Ltd 透明基板検出装置及び基板検出装置
US5479252A (en) * 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
JP3057998B2 (ja) * 1994-02-16 2000-07-04 キヤノン株式会社 照明装置及びそれを用いた投影露光装置
US5504345A (en) * 1994-04-14 1996-04-02 Hama Laboratories, Inc. Dual beam sensor and edge detection system and method
US5546179A (en) * 1994-10-07 1996-08-13 Cheng; David Method and apparatus for mapping the edge and other characteristics of a workpiece
US5710424A (en) * 1995-10-18 1998-01-20 Imra America, Inc. Multiple field of view detector with background cancellation
US5943130A (en) * 1996-10-21 1999-08-24 Insitec, Inc. In situ sensor for near wafer particle monitoring in semiconductor device manufacturing equipment
JPH11101624A (ja) * 1997-09-29 1999-04-13 Hitachi Ltd 欠陥評価装置およびその方法並びに半導体の製造方法
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JPH11237345A (ja) * 1998-02-24 1999-08-31 Hitachi Ltd 表面計測装置
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US6130437A (en) * 1998-04-24 2000-10-10 Hama Sensors, Inc. Sensor and detection system having wide diverging beam optics
US6100976A (en) * 1998-09-21 2000-08-08 The Board Of Regents For Oklahoma State University Method and apparatus for fiber optic multiple scattering suppression
US6177989B1 (en) * 1999-03-01 2001-01-23 Advanced Micro Devices Laser induced current for semiconductor defect detection
US6091488A (en) * 1999-03-22 2000-07-18 Beltronics, Inc. Method of and apparatus for automatic high-speed optical inspection of semi-conductor structures and the like through fluorescent photoresist inspection
TW409285B (en) * 1999-04-13 2000-10-21 United Microelectronics Corp Wafer position mapping device
JP2001091873A (ja) * 1999-09-24 2001-04-06 Toshiba Tec Corp 光走査装置
US7509048B2 (en) * 2001-07-20 2009-03-24 Essex Corporation Method and apparatus for optical signal processing using an optical tapped delay line
US6560265B2 (en) * 2001-09-11 2003-05-06 Applied Optoelectronics, Inc. Method and apparatus for polarizing light in a VCSEL
US6900451B2 (en) * 2001-11-08 2005-05-31 Multimextrixs, Llc Mapping sensor system for detecting positions of flat objects

Also Published As

Publication number Publication date
WO2003052800A2 (en) 2003-06-26
US7095763B2 (en) 2006-08-22
JP4303120B2 (ja) 2009-07-29
WO2003052800B1 (en) 2004-02-12
WO2003052800A3 (en) 2003-11-13
AU2002357241A1 (en) 2003-06-30
CN100397557C (zh) 2008-06-25
US20030141465A1 (en) 2003-07-31
DE10297565T5 (de) 2005-01-05
AU2002357241A8 (en) 2003-06-30
CN1833308A (zh) 2006-09-13
JP2005513775A (ja) 2005-05-12

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