JP4290154B2 - 液体吐出記録ヘッドおよびインクジェット記録装置 - Google Patents

液体吐出記録ヘッドおよびインクジェット記録装置 Download PDF

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Publication number
JP4290154B2
JP4290154B2 JP2005320984A JP2005320984A JP4290154B2 JP 4290154 B2 JP4290154 B2 JP 4290154B2 JP 2005320984 A JP2005320984 A JP 2005320984A JP 2005320984 A JP2005320984 A JP 2005320984A JP 4290154 B2 JP4290154 B2 JP 4290154B2
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JP
Japan
Prior art keywords
recording head
sealant
liquid discharge
wiring board
bonding hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005320984A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007055221A5 (enExample
JP2007055221A (ja
Inventor
省吾 河村
利浩 森
恒 深井
直樹 中條
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2005320984A priority Critical patent/JP4290154B2/ja
Priority to CN2005800423626A priority patent/CN101076449B/zh
Priority to EP05816531A priority patent/EP1833678B1/en
Priority to PCT/JP2005/022990 priority patent/WO2006062244A1/en
Priority to US11/358,203 priority patent/US7547094B2/en
Publication of JP2007055221A publication Critical patent/JP2007055221A/ja
Publication of JP2007055221A5 publication Critical patent/JP2007055221A5/ja
Application granted granted Critical
Publication of JP4290154B2 publication Critical patent/JP4290154B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2005320984A 2004-12-08 2005-11-04 液体吐出記録ヘッドおよびインクジェット記録装置 Expired - Lifetime JP4290154B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005320984A JP4290154B2 (ja) 2004-12-08 2005-11-04 液体吐出記録ヘッドおよびインクジェット記録装置
CN2005800423626A CN101076449B (zh) 2004-12-08 2005-12-08 液体排出记录头及喷墨记录装置
EP05816531A EP1833678B1 (en) 2004-12-08 2005-12-08 Liquid discharge recording head and ink jet recording device
PCT/JP2005/022990 WO2006062244A1 (en) 2004-12-08 2005-12-08 Liquid discharge recording head and ink jet recording device
US11/358,203 US7547094B2 (en) 2004-12-08 2006-02-22 Liquid discharge recording head and ink jet recording apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004354793 2004-12-08
JP2004359934 2004-12-13
JP2005214675 2005-07-25
JP2005320984A JP4290154B2 (ja) 2004-12-08 2005-11-04 液体吐出記録ヘッドおよびインクジェット記録装置

Publications (3)

Publication Number Publication Date
JP2007055221A JP2007055221A (ja) 2007-03-08
JP2007055221A5 JP2007055221A5 (enExample) 2008-12-18
JP4290154B2 true JP4290154B2 (ja) 2009-07-01

Family

ID=36578052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005320984A Expired - Lifetime JP4290154B2 (ja) 2004-12-08 2005-11-04 液体吐出記録ヘッドおよびインクジェット記録装置

Country Status (5)

Country Link
US (1) US7547094B2 (enExample)
EP (1) EP1833678B1 (enExample)
JP (1) JP4290154B2 (enExample)
CN (1) CN101076449B (enExample)
WO (1) WO2006062244A1 (enExample)

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US7691675B2 (en) * 2005-10-24 2010-04-06 Hewlett-Packard Development Company, L.P. Encapsulating electrical connections
CN101287606B (zh) * 2006-03-03 2010-11-03 西尔弗布鲁克研究有限公司 脉冲阻尼射流结构
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JP5335611B2 (ja) * 2009-08-18 2013-11-06 キヤノン株式会社 液体吐出ヘッド及び液体吐出ヘッドの製造方法
JP5528071B2 (ja) * 2009-11-25 2014-06-25 キヤノン株式会社 液体噴射記録ヘッドおよび液体噴射記録ヘッドの製造方法
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JP5867985B2 (ja) * 2010-03-01 2016-02-24 キヤノン株式会社 記録ヘッド
JP5783683B2 (ja) * 2010-05-17 2015-09-24 キヤノン株式会社 液体噴射ヘッド及び液体噴射ヘッドの製造方法
JP5843444B2 (ja) * 2011-01-07 2016-01-13 キヤノン株式会社 液体吐出ヘッドの製造方法および液体吐出ヘッド
JP5632795B2 (ja) 2011-05-10 2014-11-26 パナソニック株式会社 電極接合構造体、および電極接合構造体の製造方法
JP5825885B2 (ja) * 2011-07-04 2015-12-02 キヤノン株式会社 インクジェット記録ヘッド
JP6261623B2 (ja) 2013-02-28 2018-01-17 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． 成形式プリントバー
US9446587B2 (en) * 2013-02-28 2016-09-20 Hewlett-Packard Development Company, L.P. Molded printhead
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JP2014188814A (ja) * 2013-03-27 2014-10-06 Seiko Epson Corp 液体噴射ヘッド、および液体噴射装置
JP6324123B2 (ja) * 2013-03-29 2018-05-16 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
JP6198578B2 (ja) * 2013-11-13 2017-09-20 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP6107645B2 (ja) * 2013-12-26 2017-04-05 ブラザー工業株式会社 液体吐出ヘッド
US20170182786A1 (en) * 2014-02-04 2017-06-29 Hewlett-Packard Development Company, Lp. Encapsulants to retain wires at bond pads
JP6643073B2 (ja) * 2015-06-29 2020-02-12 東芝テック株式会社 液滴分注装置
JP6610117B2 (ja) * 2015-09-18 2019-11-27 コニカミノルタ株式会社 接続構造体、インクジェットヘッド、インクジェットヘッドの製造方法及びインクジェット記録装置
JP6806457B2 (ja) 2016-04-05 2021-01-06 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法
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JP7433797B2 (ja) * 2019-07-29 2024-02-20 キヤノン株式会社 インクジェットヘッドおよびその製造方法
JP7346150B2 (ja) 2019-08-09 2023-09-19 キヤノン株式会社 インクジェット記録ヘッドおよびインクジェット記録装置
EP4196350B1 (en) * 2020-08-13 2025-09-24 Memjet Technology Limited Inkjet printhead having robust encapsulation of wirebonds
JP7618503B2 (ja) * 2021-05-21 2025-01-21 キヤノン株式会社 液体吐出ヘッド
JP7730674B2 (ja) * 2021-06-25 2025-08-28 キヤノン株式会社 液体吐出ヘッド
JP7781588B2 (ja) 2021-10-14 2025-12-08 キヤノン株式会社 液体吐出ヘッド及びその製造方法

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Also Published As

Publication number Publication date
EP1833678A1 (en) 2007-09-19
WO2006062244A1 (en) 2006-06-15
US20060139410A1 (en) 2006-06-29
CN101076449A (zh) 2007-11-21
US7547094B2 (en) 2009-06-16
CN101076449B (zh) 2010-06-09
EP1833678B1 (en) 2012-04-04
EP1833678A4 (en) 2009-04-22
JP2007055221A (ja) 2007-03-08

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