JP4393303B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4393303B2 JP4393303B2 JP2004230803A JP2004230803A JP4393303B2 JP 4393303 B2 JP4393303 B2 JP 4393303B2 JP 2004230803 A JP2004230803 A JP 2004230803A JP 2004230803 A JP2004230803 A JP 2004230803A JP 4393303 B2 JP4393303 B2 JP 4393303B2
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- inner lead
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- 239000004065 semiconductor Substances 0.000 title claims description 82
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims description 74
- 238000000034 method Methods 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 6
- 230000035882 stress Effects 0.000 description 21
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 238000007789 sealing Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Ink Jet (AREA)
Description
図1は、本発明におけるフレキシブルフィルム配線基板を、インクジェット方式を採用した印刷機に用いる場合の半導体装置を示す図である。図1(a)は要部の上面図であり、図1(b)は図1(a)のA−A断面図である。尚、以下に示す実施例においては、便宜上、半導体素子基板(ヒータボード)が1個の場合を用いて説明しているが、当然のことながら半導体素子基板(ヒータボード)の数がそれ以上であってもかまわない。
図3は、本発明の実施例2におけるフレキシブルフィルム配線基板を用いた半導体装置の要部の平面図である。図3において図1(a)と同じ部材には同じ符号を付し、その説明は省略する。本実施例は、インナーリード5に貫通孔9を形成することができない程インナーリード5の幅が細い揚合に有効な構成である。
図5は、本発明の実施例2におけるフレキシブルフィルム配線基板を用いた半導体装置の要部の平面図である。図5において図1(a)と同じ部材には同じ符号を付し、その説明は省略する。本実施例は、インナーリード5に貫通孔9を形成することができない程インナーリード5の幅が細い揚合に有効な構成である。
2,102 フレキシブルフィルム配線基板
3,103 デバイスホール
4,104 ベースフィル
5,105 インナーリード
6,106 電極パッド
7,107 スタッドバンプ
8,108 レジスト層
9 貫通孔
10 支持部材
11 支持板
12 ノズル部
13 第1封止樹脂
14 第2封止樹脂
15 第1接着剤
16 第2接着剤
17 第3接着剤
20 リード幅細部
21 切欠部
Claims (1)
- デバイスホールと、前記デバイスホールの開口内に延在して形成されたインナーリードとが形成されているフレキシブルフィルム配線基板と、前記デバイスホール内に収納され、複数の電極パッドと前記複数の電極パッド上にそれぞれ設けられた複数のバンプとを有する半導体素子基板と、前記フレキシブルフィルム配線基板と前記半導体素子基板とが固定される支持部材とからなり、前記インナーリードと前記バンプとが接合されている半導体装置の製造方法において、
前記半導体装置は、複数の前記半導体素子基板を有し、
前記フレキシブルフィルム配線基板は、前記複数の半導体素子基板に対応する複数のデバイスホールを有し、
前記支持部材に前記複数の半導体素子基板をそれぞれ接着固定させる工程と、
前記複数のデバイスホールにそれぞれ形成された前記インナーリードの先端部と、前記支持部材に固定された前記複数の半導体素子基板の前記電極パッド上に設けられた前記バンプとをそれぞれ位置決めして、前記フレキシブルフィルム配線基板を配置する工程と、
前記フレキシブルフィルム配線基板と前記複数の半導体素子基板とを加熱する工程と、
前記インナーリードの先端部と前記バンプとを接合する工程と、
前記接合状態のまま冷却する工程と、を有し、
前記インナーリードまたは前記バンプは、前記加熱工程時の前記フレキシブルフィルムの熱膨張による位置ずれを見越して形成され、
前記インナーリードは、前記インナーリードと前記バンプとの接合部と、前記フレキシブルフィルム配線基板との間の領域内において、他の部分よりも断面積が小さい小断面積領域を備え、前記冷却工程時に、前記インナーリードと前記バンプとの間で発生する応力を、前記インナーリードを変形させることにより解放することを特徴とする半導体装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004230803A JP4393303B2 (ja) | 2003-09-05 | 2004-08-06 | 半導体装置の製造方法 |
US10/928,162 US7115975B2 (en) | 2003-09-05 | 2004-08-30 | Semiconductor device, process of producing semiconductor device, and ink jet recording head |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003313735 | 2003-09-05 | ||
JP2004230803A JP4393303B2 (ja) | 2003-09-05 | 2004-08-06 | 半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005101546A JP2005101546A (ja) | 2005-04-14 |
JP2005101546A5 JP2005101546A5 (ja) | 2007-08-16 |
JP4393303B2 true JP4393303B2 (ja) | 2010-01-06 |
Family
ID=34467666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004230803A Expired - Fee Related JP4393303B2 (ja) | 2003-09-05 | 2004-08-06 | 半導体装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7115975B2 (ja) |
JP (1) | JP4393303B2 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4290154B2 (ja) * | 2004-12-08 | 2009-07-01 | キヤノン株式会社 | 液体吐出記録ヘッドおよびインクジェット記録装置 |
KR100702970B1 (ko) * | 2005-07-06 | 2007-04-03 | 삼성전자주식회사 | 이원 접속 방식을 가지는 반도체 패키지 및 그 제조 방법 |
US8438729B2 (en) * | 2006-03-09 | 2013-05-14 | Canon Kabushiki Kaisha | Method of producing liquid discharge head |
US20090016036A1 (en) * | 2007-07-13 | 2009-01-15 | Wong Shaw Fong | Conductor reinforcement for circuit boards |
KR101358751B1 (ko) * | 2007-10-16 | 2014-02-07 | 삼성전자주식회사 | 반도체 패키지 |
JP2009239256A (ja) * | 2008-03-03 | 2009-10-15 | Panasonic Corp | 半導体装置及びその製造方法 |
JP2010023491A (ja) * | 2008-06-16 | 2010-02-04 | Canon Inc | 液体吐出記録ヘッド |
JP2009298118A (ja) | 2008-06-17 | 2009-12-24 | Canon Inc | 記録ヘッド及び記録ヘッドの製造方法 |
JP5173624B2 (ja) | 2008-06-20 | 2013-04-03 | キヤノン株式会社 | 記録ヘッド及び記録ヘッドの製造方法 |
US8426974B2 (en) | 2010-09-29 | 2013-04-23 | Sunpower Corporation | Interconnect for an optoelectronic device |
JP5632795B2 (ja) * | 2011-05-10 | 2014-11-26 | パナソニック株式会社 | 電極接合構造体、および電極接合構造体の製造方法 |
US8803185B2 (en) * | 2012-02-21 | 2014-08-12 | Peiching Ling | Light emitting diode package and method of fabricating the same |
US10596815B2 (en) | 2017-04-21 | 2020-03-24 | Canon Kabushiki Kaisha | Liquid ejection head and inkjet printing apparatus |
JP6953175B2 (ja) | 2017-05-16 | 2021-10-27 | キヤノン株式会社 | インクジェット記録ヘッドおよびインクジェット記録装置 |
Family Cites Families (18)
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FR2299724A1 (fr) * | 1975-01-29 | 1976-08-27 | Honeywell Bull Soc Ind | Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres |
US4331740A (en) * | 1980-04-14 | 1982-05-25 | National Semiconductor Corporation | Gang bonding interconnect tape process and structure for semiconductor device automatic assembly |
US4987474A (en) * | 1987-09-18 | 1991-01-22 | Hitachi, Ltd. | Semiconductor device and method of manufacturing the same |
US5081474A (en) | 1988-07-04 | 1992-01-14 | Canon Kabushiki Kaisha | Recording head having multi-layer matrix wiring |
JP2967603B2 (ja) * | 1991-04-30 | 1999-10-25 | 日本電気株式会社 | テープオートメイテッドボンディング半導体装置 |
US5250839A (en) * | 1990-09-26 | 1993-10-05 | Dai Nippon Printing Co., Ltd. | Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates |
EP0490668B1 (en) | 1990-12-12 | 1996-10-16 | Canon Kabushiki Kaisha | Ink jet recording |
EP0674995B1 (en) | 1994-03-29 | 2002-03-06 | Canon Kabushiki Kaisha | Substrate for ink jet head, ink jet head, ink jet pen, and ink jet apparatus |
US5929517A (en) * | 1994-12-29 | 1999-07-27 | Tessera, Inc. | Compliant integrated circuit package and method of fabricating the same |
JPH09109392A (ja) | 1995-10-13 | 1997-04-28 | Canon Inc | インクジェット記録ヘッドの製造方法および同方法により製造されたインクジェット記録ヘッド、並びにインクジェット記録装置 |
US6284563B1 (en) * | 1995-10-31 | 2001-09-04 | Tessera, Inc. | Method of making compliant microelectronic assemblies |
DE69732389T2 (de) | 1996-04-12 | 2005-12-22 | Canon K.K. | Tintenstrahldruckkopfherstellungsverfahren |
US6861735B2 (en) * | 1997-06-27 | 2005-03-01 | Matsushita Electric Industrial Co., Ltd. | Resin molded type semiconductor device and a method of manufacturing the same |
KR100282003B1 (ko) * | 1997-10-15 | 2001-02-15 | 윤종용 | 칩 스케일 패키지 |
JP2000043271A (ja) | 1997-11-14 | 2000-02-15 | Canon Inc | インクジェット記録ヘッド、その製造方法及び該インクジェット記録ヘッドを具備する記録装置 |
JP3592208B2 (ja) | 2000-07-10 | 2004-11-24 | キヤノン株式会社 | 液体噴射記録ヘッドおよびその製造方法 |
JP3652321B2 (ja) | 2001-05-08 | 2005-05-25 | キヤノン株式会社 | インクジェット記録ヘッド |
JP2003007765A (ja) | 2001-06-22 | 2003-01-10 | Canon Inc | Tabテープ及びボンディング方法 |
-
2004
- 2004-08-06 JP JP2004230803A patent/JP4393303B2/ja not_active Expired - Fee Related
- 2004-08-30 US US10/928,162 patent/US7115975B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7115975B2 (en) | 2006-10-03 |
US20050093128A1 (en) | 2005-05-05 |
JP2005101546A (ja) | 2005-04-14 |
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