JP4290075B2 - 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法 - Google Patents

基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法 Download PDF

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Publication number
JP4290075B2
JP4290075B2 JP2004180094A JP2004180094A JP4290075B2 JP 4290075 B2 JP4290075 B2 JP 4290075B2 JP 2004180094 A JP2004180094 A JP 2004180094A JP 2004180094 A JP2004180094 A JP 2004180094A JP 4290075 B2 JP4290075 B2 JP 4290075B2
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JP
Japan
Prior art keywords
holding
gas
cleaning
drying
supply nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004180094A
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English (en)
Japanese (ja)
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JP2005101524A (ja
JP2005101524A5 (https=
Inventor
博実 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004180094A priority Critical patent/JP4290075B2/ja
Priority to TW093122615A priority patent/TWI248156B/zh
Priority to KR1020040065530A priority patent/KR100979976B1/ko
Priority to US10/923,309 priority patent/US7578304B2/en
Publication of JP2005101524A publication Critical patent/JP2005101524A/ja
Publication of JP2005101524A5 publication Critical patent/JP2005101524A5/ja
Application granted granted Critical
Publication of JP4290075B2 publication Critical patent/JP4290075B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004180094A 2003-08-19 2004-06-17 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法 Expired - Lifetime JP4290075B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004180094A JP4290075B2 (ja) 2003-08-19 2004-06-17 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法
TW093122615A TWI248156B (en) 2003-08-19 2004-07-28 Cleaning and drying apparatus for substrate holder chuck and method thereof
KR1020040065530A KR100979976B1 (ko) 2003-08-19 2004-08-19 기판 유지용 척의 세정·건조 장치 및 기판 유지용 척의세정·건조 방법
US10/923,309 US7578304B2 (en) 2003-08-19 2004-08-19 Cleaning and drying apparatus for substrate holder chuck and method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003294792 2003-08-19
JP2004180094A JP4290075B2 (ja) 2003-08-19 2004-06-17 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法

Publications (3)

Publication Number Publication Date
JP2005101524A JP2005101524A (ja) 2005-04-14
JP2005101524A5 JP2005101524A5 (https=) 2006-09-21
JP4290075B2 true JP4290075B2 (ja) 2009-07-01

Family

ID=34197156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004180094A Expired - Lifetime JP4290075B2 (ja) 2003-08-19 2004-06-17 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法

Country Status (4)

Country Link
US (1) US7578304B2 (https=)
JP (1) JP4290075B2 (https=)
KR (1) KR100979976B1 (https=)
TW (1) TWI248156B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11949644B2 (en) 2007-03-22 2024-04-02 Google Llc Systems and methods for relaying messages in a communications system

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4347156B2 (ja) * 2004-07-28 2009-10-21 大日本スクリーン製造株式会社 基板処理装置
JP2006186263A (ja) * 2004-12-28 2006-07-13 Disco Abrasive Syst Ltd 被加工物保持装置
JP4979412B2 (ja) * 2007-02-26 2012-07-18 大日本スクリーン製造株式会社 基板処理装置のスケジュール作成方法及びそのプログラム
US7865553B1 (en) 2007-03-22 2011-01-04 Google Inc. Chat system without topic-specific rooms
KR100958793B1 (ko) * 2007-09-28 2010-05-18 주식회사 실트론 웨이퍼 쉽핑박스의 세정을 위한 박스 크리너
KR100921520B1 (ko) * 2007-10-05 2009-10-12 세메스 주식회사 척 세정 장치 및 방법 그리고 이를 구비하는 기판 처리장치 및 그의 척 세정 방법
JP4950247B2 (ja) 2009-05-12 2012-06-13 東京エレクトロン株式会社 洗浄装置、基板処理システム、洗浄方法、プログラムおよび記憶媒体
JP2012004204A (ja) * 2010-06-15 2012-01-05 Disco Abrasive Syst Ltd パッド洗浄装置およびパッド洗浄方法
ITMI20110646A1 (it) 2011-04-15 2012-10-16 St Microelectronics Srl Apparecchiatura per la lavorazione di wafer semiconduttori, in particolare per realizzare una fase di processo di rimozione di polimeri.
CN106232247B (zh) 2014-04-22 2020-07-31 株式会社富士 吸嘴清洗装置及吸嘴干燥方法
CN106252258B (zh) * 2015-06-15 2018-12-07 株式会社思可林集团 基板处理装置
TWI729584B (zh) * 2019-11-22 2021-06-01 佳宸科技有限公司 濕製程用清潔機構
JP7841860B2 (ja) * 2021-09-03 2026-04-07 株式会社ディスコ 加工装置
US20250341017A1 (en) * 2024-05-06 2025-11-06 Applied Materials, Inc. Gas atomized fluid clean of electroplating chuck in maintenance chamber

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4619845A (en) * 1985-02-22 1986-10-28 The United States Of America As Represented By The Secretary Of The Navy Method for generating fine sprays of molten metal for spray coating and powder making
US4957783A (en) * 1988-10-05 1990-09-18 Nordson Corporation Method and apparatus for dispensing droplets of molten thermoplastic adhesive
US5226437A (en) * 1990-11-28 1993-07-13 Tokyo Electron Limited Washing apparatus
US5253663A (en) * 1991-08-26 1993-10-19 Tokyo Electron Limited Transfer apparatus
US5379784A (en) * 1993-01-23 1995-01-10 Tokyo Electron Limited Apparatus for cleaning conveyor chuck
JPH0969509A (ja) * 1995-09-01 1997-03-11 Matsushita Electron Corp 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法
US6491764B2 (en) * 1997-09-24 2002-12-10 Interuniversitair Microelektronics Centrum (Imec) Method and apparatus for removing a liquid from a surface of a rotating substrate
JP3661075B2 (ja) 1998-06-23 2005-06-15 東京エレクトロン株式会社 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法
JP3613782B2 (ja) 1998-06-23 2005-01-26 東京エレクトロン株式会社 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法
JP2003224103A (ja) 2002-01-31 2003-08-08 Kakizaki Mamufacuturing Co Ltd ウエハキャリアの洗浄方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11949644B2 (en) 2007-03-22 2024-04-02 Google Llc Systems and methods for relaying messages in a communications system

Also Published As

Publication number Publication date
US20050039779A1 (en) 2005-02-24
KR20050021238A (ko) 2005-03-07
JP2005101524A (ja) 2005-04-14
US7578304B2 (en) 2009-08-25
KR100979976B1 (ko) 2010-09-03
TWI248156B (en) 2006-01-21
TW200509290A (en) 2005-03-01

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