TWI248156B - Cleaning and drying apparatus for substrate holder chuck and method thereof - Google Patents

Cleaning and drying apparatus for substrate holder chuck and method thereof Download PDF

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Publication number
TWI248156B
TWI248156B TW093122615A TW93122615A TWI248156B TW I248156 B TWI248156 B TW I248156B TW 093122615 A TW093122615 A TW 093122615A TW 93122615 A TW93122615 A TW 93122615A TW I248156 B TWI248156 B TW I248156B
Authority
TW
Taiwan
Prior art keywords
gas
holding
holding member
cleaning
drying
Prior art date
Application number
TW093122615A
Other languages
English (en)
Chinese (zh)
Other versions
TW200509290A (en
Inventor
Hiromi Ohtsuka
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200509290A publication Critical patent/TW200509290A/zh
Application granted granted Critical
Publication of TWI248156B publication Critical patent/TWI248156B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093122615A 2003-08-19 2004-07-28 Cleaning and drying apparatus for substrate holder chuck and method thereof TWI248156B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003294792 2003-08-19
JP2004180094A JP4290075B2 (ja) 2003-08-19 2004-06-17 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法

Publications (2)

Publication Number Publication Date
TW200509290A TW200509290A (en) 2005-03-01
TWI248156B true TWI248156B (en) 2006-01-21

Family

ID=34197156

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122615A TWI248156B (en) 2003-08-19 2004-07-28 Cleaning and drying apparatus for substrate holder chuck and method thereof

Country Status (4)

Country Link
US (1) US7578304B2 (https=)
JP (1) JP4290075B2 (https=)
KR (1) KR100979976B1 (https=)
TW (1) TWI248156B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4347156B2 (ja) * 2004-07-28 2009-10-21 大日本スクリーン製造株式会社 基板処理装置
JP2006186263A (ja) * 2004-12-28 2006-07-13 Disco Abrasive Syst Ltd 被加工物保持装置
JP4979412B2 (ja) * 2007-02-26 2012-07-18 大日本スクリーン製造株式会社 基板処理装置のスケジュール作成方法及びそのプログラム
US7865553B1 (en) 2007-03-22 2011-01-04 Google Inc. Chat system without topic-specific rooms
US7899869B1 (en) 2007-03-22 2011-03-01 Google Inc. Broadcasting in chat system without topic-specific rooms
KR100958793B1 (ko) * 2007-09-28 2010-05-18 주식회사 실트론 웨이퍼 쉽핑박스의 세정을 위한 박스 크리너
KR100921520B1 (ko) * 2007-10-05 2009-10-12 세메스 주식회사 척 세정 장치 및 방법 그리고 이를 구비하는 기판 처리장치 및 그의 척 세정 방법
JP4950247B2 (ja) 2009-05-12 2012-06-13 東京エレクトロン株式会社 洗浄装置、基板処理システム、洗浄方法、プログラムおよび記憶媒体
JP2012004204A (ja) * 2010-06-15 2012-01-05 Disco Abrasive Syst Ltd パッド洗浄装置およびパッド洗浄方法
ITMI20110646A1 (it) 2011-04-15 2012-10-16 St Microelectronics Srl Apparecchiatura per la lavorazione di wafer semiconduttori, in particolare per realizzare una fase di processo di rimozione di polimeri.
CN106232247B (zh) 2014-04-22 2020-07-31 株式会社富士 吸嘴清洗装置及吸嘴干燥方法
CN106252258B (zh) * 2015-06-15 2018-12-07 株式会社思可林集团 基板处理装置
TWI729584B (zh) * 2019-11-22 2021-06-01 佳宸科技有限公司 濕製程用清潔機構
JP7841860B2 (ja) * 2021-09-03 2026-04-07 株式会社ディスコ 加工装置
US20250341017A1 (en) * 2024-05-06 2025-11-06 Applied Materials, Inc. Gas atomized fluid clean of electroplating chuck in maintenance chamber

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4619845A (en) * 1985-02-22 1986-10-28 The United States Of America As Represented By The Secretary Of The Navy Method for generating fine sprays of molten metal for spray coating and powder making
US4957783A (en) * 1988-10-05 1990-09-18 Nordson Corporation Method and apparatus for dispensing droplets of molten thermoplastic adhesive
US5226437A (en) * 1990-11-28 1993-07-13 Tokyo Electron Limited Washing apparatus
US5253663A (en) * 1991-08-26 1993-10-19 Tokyo Electron Limited Transfer apparatus
US5379784A (en) * 1993-01-23 1995-01-10 Tokyo Electron Limited Apparatus for cleaning conveyor chuck
JPH0969509A (ja) * 1995-09-01 1997-03-11 Matsushita Electron Corp 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法
US6491764B2 (en) * 1997-09-24 2002-12-10 Interuniversitair Microelektronics Centrum (Imec) Method and apparatus for removing a liquid from a surface of a rotating substrate
JP3661075B2 (ja) 1998-06-23 2005-06-15 東京エレクトロン株式会社 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法
JP3613782B2 (ja) 1998-06-23 2005-01-26 東京エレクトロン株式会社 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法
JP2003224103A (ja) 2002-01-31 2003-08-08 Kakizaki Mamufacuturing Co Ltd ウエハキャリアの洗浄方法

Also Published As

Publication number Publication date
US20050039779A1 (en) 2005-02-24
JP4290075B2 (ja) 2009-07-01
KR20050021238A (ko) 2005-03-07
JP2005101524A (ja) 2005-04-14
US7578304B2 (en) 2009-08-25
KR100979976B1 (ko) 2010-09-03
TW200509290A (en) 2005-03-01

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MM4A Annulment or lapse of patent due to non-payment of fees