KR100987537B1 - 기판처리장치 - Google Patents
기판처리장치 Download PDFInfo
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- KR100987537B1 KR100987537B1 KR1020080078700A KR20080078700A KR100987537B1 KR 100987537 B1 KR100987537 B1 KR 100987537B1 KR 1020080078700 A KR1020080078700 A KR 1020080078700A KR 20080078700 A KR20080078700 A KR 20080078700A KR 100987537 B1 KR100987537 B1 KR 100987537B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
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Abstract
Description
Claims (7)
- 기판에 대해 소정의 처리를 행하는 1 이상의 처리유닛을 배치한 처리부와,미처리 기판을 외부로부터 받아들여 상기 처리부에 건네 줌과 아울러, 처리완료 기판을 상기 처리부로부터 받아서 외부로 반출하는 인덱서부(部)를 구비하며,상기 인덱서부가,상기 처리부에 건네주기 전의 기판 단면(端面)을 세정하는 단면세정부(端面洗淨部)와,복수의 기판을 수용하는 카세트를 재치하는 카세트재치부(載置部)와,소정의 지지수단으로 기판을 지지하여, 상기 카세트, 상기 처리부 및 상기 단면세정부 사이에서 기판을 반송하는 기판반송장치(基板搬送裝置)를 구비하며,상기 기판반송장치가,그 단면부(端面部)가 세정되기 전의 기판을 지지하는 제1 지지수단과,그 단면부가 세정된 후의 기판을 지지하는 제2 지지수단을 구비하는 것을 특징으로 하는 기판처리장치.
- 청구항 1에 있어서,상기 단면세정부가,소정의 세정액에 초음파진동을 부여하는 초음파진동(超音波振動)부여수단과,상기 초음파진동이 부여된 상기 세정액을 피세정 기판의 단면에 공급하는 토출(吐出)노즐을 구비하는 것을 특징으로 하는 기판처리장치.
- 청구항 2에 있어서,상기 단면세정부가,수평방향을 따른 양단부(兩端部)가 개방되고, 단면(斷面) ㄷ자형의 형상을 가진 액(液)고임부 형성부재를 더 구비하며,상기 액고임부 형성부재의 내측공간에 상기 토출노즐로부터 상기 세정액을 토출함으로써 형성된 액고임부에 상기 피세정 기판의 단부(端部)를 담가 상기 피세정 기판의 단면(端面)을 세정하는 것을 특징으로 하는 기판처리장치.
- 청구항 1에 있어서,상기 단면세정부가,세정액과 가압된 기체를 혼합해 세정액의 액적(液滴)을 생성하여 피세정 기판의 단면에 공급하는 이류체(二流體) 노즐을 구비하는 것을 특징으로 하는 기판처리장치.
- 청구항 1에 있어서,상기 단면세정부가,피세정 기판에 소정의 세정액을 공급하는 세정액공급수단과,상기 피세정 기판의 단면에 슬라이딩 접촉하는 세정브러시를 구비하는 것을 특징으로 하는 기판처리장치.
- 청구항 1 내지 5 중 어느 한 항에 있어서,상기 인덱서부가,상기 처리부에 건네주기 전의 기판 상하면을 반전시키는 반전부(反轉部)와,상기 처리부에 건네주기 전의 기판 이면을 세정하는 이면세정부(裏面洗淨部)를 더 구비하는 것을 특징으로 하는 기판처리장치.
- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007240919A JP2009071235A (ja) | 2007-09-18 | 2007-09-18 | 基板処理装置 |
JPJP-P-2007-00240919 | 2007-09-18 |
Publications (2)
Publication Number | Publication Date |
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KR20090029632A KR20090029632A (ko) | 2009-03-23 |
KR100987537B1 true KR100987537B1 (ko) | 2010-10-12 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020080078700A KR100987537B1 (ko) | 2007-09-18 | 2008-08-12 | 기판처리장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090070946A1 (ko) |
JP (1) | JP2009071235A (ko) |
KR (1) | KR100987537B1 (ko) |
TW (1) | TW200915403A (ko) |
Families Citing this family (39)
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JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP5128918B2 (ja) * | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP5531489B2 (ja) * | 2009-07-30 | 2014-06-25 | 富士通セミコンダクター株式会社 | ウェーハ端面の洗浄方法及び装置、並びに洗浄液供給装置 |
JP5490639B2 (ja) | 2010-07-14 | 2014-05-14 | 大日本スクリーン製造株式会社 | 基板処理装置および基板搬送方法 |
JP2014011370A (ja) * | 2012-07-02 | 2014-01-20 | Disco Abrasive Syst Ltd | 加工装置 |
WO2014033055A1 (en) | 2012-08-27 | 2014-03-06 | Aktiebolaget Electrolux | Robot positioning system |
WO2014169943A1 (en) | 2013-04-15 | 2014-10-23 | Aktiebolaget Electrolux | Robotic vacuum cleaner |
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JP5651744B1 (ja) | 2013-07-04 | 2015-01-14 | 株式会社カイジョー | 超音波洗浄装置及び超音波洗浄方法 |
US10209080B2 (en) | 2013-12-19 | 2019-02-19 | Aktiebolaget Electrolux | Robotic cleaning device |
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Citations (4)
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JP2000306878A (ja) * | 1999-04-19 | 2000-11-02 | Disco Abrasive Syst Ltd | 洗浄装置及び切削装置 |
KR100320585B1 (ko) * | 1993-11-05 | 2002-01-18 | 히가시 데쓰로 | 레지스트 처리장치 |
JP2004356298A (ja) * | 2003-05-28 | 2004-12-16 | Toshiba Mach Co Ltd | 気相成長装置 |
JP2006080403A (ja) * | 2004-09-10 | 2006-03-23 | Tokyo Electron Ltd | 塗布、現像装置、レジストパターン形成方法、露光装置及び洗浄装置 |
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JP4127866B2 (ja) * | 1996-05-21 | 2008-07-30 | 東京応化工業株式会社 | 基板端縁部被膜の除去方法 |
JP2003077871A (ja) * | 2001-09-04 | 2003-03-14 | Komatsu Machinery Corp | 半導体ウエハの平面研削システム及びその加工方法 |
JP2005191511A (ja) * | 2003-12-02 | 2005-07-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP4522329B2 (ja) * | 2005-06-24 | 2010-08-11 | 株式会社Sokudo | 基板処理装置 |
JP5132108B2 (ja) * | 2006-02-02 | 2013-01-30 | 株式会社Sokudo | 基板処理装置 |
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KR100320585B1 (ko) * | 1993-11-05 | 2002-01-18 | 히가시 데쓰로 | 레지스트 처리장치 |
JP2000306878A (ja) * | 1999-04-19 | 2000-11-02 | Disco Abrasive Syst Ltd | 洗浄装置及び切削装置 |
JP2004356298A (ja) * | 2003-05-28 | 2004-12-16 | Toshiba Mach Co Ltd | 気相成長装置 |
JP2006080403A (ja) * | 2004-09-10 | 2006-03-23 | Tokyo Electron Ltd | 塗布、現像装置、レジストパターン形成方法、露光装置及び洗浄装置 |
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JP2009071235A (ja) | 2009-04-02 |
TW200915403A (en) | 2009-04-01 |
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