JP4222260B2 - リード形電子部品実装プリント配線基板及び空気調和機 - Google Patents

リード形電子部品実装プリント配線基板及び空気調和機 Download PDF

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Publication number
JP4222260B2
JP4222260B2 JP2004165621A JP2004165621A JP4222260B2 JP 4222260 B2 JP4222260 B2 JP 4222260B2 JP 2004165621 A JP2004165621 A JP 2004165621A JP 2004165621 A JP2004165621 A JP 2004165621A JP 4222260 B2 JP4222260 B2 JP 4222260B2
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JP
Japan
Prior art keywords
soldering
lead
land
electronic component
type electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004165621A
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English (en)
Japanese (ja)
Other versions
JP2005347529A (ja
JP2005347529A5 (enExample
Inventor
剛 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2004165621A priority Critical patent/JP4222260B2/ja
Priority to EP05252366A priority patent/EP1603375B1/en
Priority to ES05252366T priority patent/ES2401585T3/es
Priority to CNB2005100728005A priority patent/CN100475002C/zh
Publication of JP2005347529A publication Critical patent/JP2005347529A/ja
Publication of JP2005347529A5 publication Critical patent/JP2005347529A5/ja
Application granted granted Critical
Publication of JP4222260B2 publication Critical patent/JP4222260B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2004165621A 2004-06-03 2004-06-03 リード形電子部品実装プリント配線基板及び空気調和機 Expired - Fee Related JP4222260B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004165621A JP4222260B2 (ja) 2004-06-03 2004-06-03 リード形電子部品実装プリント配線基板及び空気調和機
EP05252366A EP1603375B1 (en) 2004-06-03 2005-04-15 Printed circuit board, method of soldering electronic components, and air conditioning apparatus with printed circuit board
ES05252366T ES2401585T3 (es) 2004-06-03 2005-04-15 Placa de circuito impreso, método de soldadura de componentes electrónicos y aparato de aire acondicionado con placa de circuito impreso
CNB2005100728005A CN100475002C (zh) 2004-06-03 2005-05-20 印刷布线基板及锡焊方法以及装配有印刷布线基板的空调器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004165621A JP4222260B2 (ja) 2004-06-03 2004-06-03 リード形電子部品実装プリント配線基板及び空気調和機

Publications (3)

Publication Number Publication Date
JP2005347529A JP2005347529A (ja) 2005-12-15
JP2005347529A5 JP2005347529A5 (enExample) 2006-10-12
JP4222260B2 true JP4222260B2 (ja) 2009-02-12

Family

ID=34940856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004165621A Expired - Fee Related JP4222260B2 (ja) 2004-06-03 2004-06-03 リード形電子部品実装プリント配線基板及び空気調和機

Country Status (4)

Country Link
EP (1) EP1603375B1 (enExample)
JP (1) JP4222260B2 (enExample)
CN (1) CN100475002C (enExample)
ES (1) ES2401585T3 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4196979B2 (ja) * 2005-09-07 2008-12-17 三菱電機株式会社 リード形電子部品実装プリント配線基板、リード形電子部品の半田付方法、空気調和機。
JP5599151B2 (ja) 2009-01-30 2014-10-01 三菱電機株式会社 二列リード形電子部品実装プリント配線基板、二列リード形電子部品の半田付け方法、空気調和機

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3211408A1 (de) * 1982-03-27 1983-09-29 Vdo Adolf Schindling Ag, 6000 Frankfurt Substrat
JPS62243393A (ja) 1986-04-15 1987-10-23 キヤノン株式会社 プリント基板
JPS63157492A (ja) 1986-12-22 1988-06-30 株式会社東芝 プリント配線板
US4835345A (en) * 1987-09-18 1989-05-30 Compaq Computer Corporation Printed wiring board having robber pads for excess solder
JPH01300588A (ja) 1988-05-28 1989-12-05 Nec Home Electron Ltd プリント配線板及びそのはんだ付け方法
US5243143A (en) * 1990-11-13 1993-09-07 Compaq Computer Corporation Solder snap bar
JP2675473B2 (ja) * 1992-01-13 1997-11-12 三洋電機株式会社 フラットパッケージｉｃ半田ディップ型プリント配線板
FR2714566B1 (fr) * 1993-12-24 1996-03-15 Marelli Autronica Plaque de circuit imprimé comportant des plages de drainage de soudure perfectionnées.
US5604333A (en) * 1994-11-30 1997-02-18 Intel Corporation Process and structure for a solder thief on circuit boards
JPH08307022A (ja) * 1995-05-10 1996-11-22 Fuji Electric Co Ltd プリント板
KR100319291B1 (ko) * 1999-03-13 2002-01-09 윤종용 회로 기판 및 회로 기판의 솔더링 방법
JP2002280717A (ja) * 2001-03-19 2002-09-27 Matsushita Graphic Communication Systems Inc プリント基板
JP3633505B2 (ja) * 2001-04-27 2005-03-30 松下電器産業株式会社 プリント配線基板およびプリント配線基板の半田付け方法
JP3988720B2 (ja) * 2003-12-11 2007-10-10 三菱電機株式会社 ４方向リードフラットパッケージｉｃ実装プリント配線基板及び４方向リードフラットパッケージｉｃの半田付け方法、４方向リードフラットパッケージｉｃ実装プリント配線基板を備えた空気調和機。

Also Published As

Publication number Publication date
JP2005347529A (ja) 2005-12-15
ES2401585T3 (es) 2013-04-22
EP1603375A1 (en) 2005-12-07
CN100475002C (zh) 2009-04-01
CN1705428A (zh) 2005-12-07
EP1603375B1 (en) 2013-03-06

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