JP4222260B2 - リード形電子部品実装プリント配線基板及び空気調和機 - Google Patents
リード形電子部品実装プリント配線基板及び空気調和機 Download PDFInfo
- Publication number
- JP4222260B2 JP4222260B2 JP2004165621A JP2004165621A JP4222260B2 JP 4222260 B2 JP4222260 B2 JP 4222260B2 JP 2004165621 A JP2004165621 A JP 2004165621A JP 2004165621 A JP2004165621 A JP 2004165621A JP 4222260 B2 JP4222260 B2 JP 4222260B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- lead
- land
- electronic component
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
以下に、この発明の実施の形態1によるリード形電子部品実装プリント配線基板について、図1乃至図4により説明する。ここで、図1は、この発明の実施の形態1によるリード形電子部品実装プリント配線基板の裏から見た概略配置構成を示す平面図、図2は、この発明の実施の形態1によるリード形電子部品実装プリント配線基板のリード形電子部品水平配置を示す平面図、図3は、この発明の実施の形態1によるリード形電子部品実装プリント配線基板のリード形電子部品垂直配置を示す平面図、図4は、この発明の実施の形態1によるリード形電子部品実装プリント配線基板の半田付けランド群と後方半田引きランドの関係を示す要部拡大平面図である。
Claims (3)
- リード形電子部品が装着され、前記リード形電子部品の連続した半田付けランド群を有し、前記リード形電子部品を噴流式半田槽を用いた半田付により、実装着されるプリント配線基板において、前記連続した半田付けランド群を前記噴流式半田付け進行方向に対して前記連続した半田付けランド群の長手方向に沿って配置し、前記連続した半田付けランド群の前記噴流式半田付け進行方向最後尾にランドが格子状に形成された半田引き部を有するとともにこの半田引き部の後方にさらに半田ボイド除去用の平滑面ランドを有する後方半田引きランドを設けることを特徴とするリード形電子部品実装プリント配線基板。
- リード形電子部品が装着され、前記リード形電子部品の連続した半田付けランド群を有し、前記リード形電子部品を噴流式半田槽を用いた半田付により、実装着されるプリント配線基板において、前記連続した半田付けランド群を前記噴流式半田付け進行方向に対して前記連続した半田付けランド群の長手方向を垂直に配置し、前記連続した半田付けランド群の前記噴流式半田付け進行方向後方の一部にランドが格子状に形成された半田引き部を有するとともにこの半田引き部の後方にさらに半田ボイド除去用の平滑面ランドを有する後方半田引きランドを設けることを特徴とするリード形電子部品実装プリント配線基板。
- 送風機室と圧縮機室より成る空気調和機の室外機、前記圧縮機室上方に配置した電気品箱、この電気品箱を扁平形状にすると共に、この扁平形状箱体内に、請求項1または2のリード形電子部品実装プリント配線基板を備えたことを特徴とする空気調和機。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004165621A JP4222260B2 (ja) | 2004-06-03 | 2004-06-03 | リード形電子部品実装プリント配線基板及び空気調和機 |
ES05252366T ES2401585T3 (es) | 2004-06-03 | 2005-04-15 | Placa de circuito impreso, método de soldadura de componentes electrónicos y aparato de aire acondicionado con placa de circuito impreso |
EP05252366A EP1603375B1 (en) | 2004-06-03 | 2005-04-15 | Printed circuit board, method of soldering electronic components, and air conditioning apparatus with printed circuit board |
CNB2005100728005A CN100475002C (zh) | 2004-06-03 | 2005-05-20 | 印刷布线基板及锡焊方法以及装配有印刷布线基板的空调器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004165621A JP4222260B2 (ja) | 2004-06-03 | 2004-06-03 | リード形電子部品実装プリント配線基板及び空気調和機 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005347529A JP2005347529A (ja) | 2005-12-15 |
JP2005347529A5 JP2005347529A5 (ja) | 2006-10-12 |
JP4222260B2 true JP4222260B2 (ja) | 2009-02-12 |
Family
ID=34940856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004165621A Expired - Fee Related JP4222260B2 (ja) | 2004-06-03 | 2004-06-03 | リード形電子部品実装プリント配線基板及び空気調和機 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1603375B1 (ja) |
JP (1) | JP4222260B2 (ja) |
CN (1) | CN100475002C (ja) |
ES (1) | ES2401585T3 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4196979B2 (ja) * | 2005-09-07 | 2008-12-17 | 三菱電機株式会社 | リード形電子部品実装プリント配線基板、リード形電子部品の半田付方法、空気調和機。 |
JP5599151B2 (ja) | 2009-01-30 | 2014-10-01 | 三菱電機株式会社 | 二列リード形電子部品実装プリント配線基板、二列リード形電子部品の半田付け方法、空気調和機 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3211408A1 (de) * | 1982-03-27 | 1983-09-29 | Vdo Adolf Schindling Ag, 6000 Frankfurt | Substrat |
JPS62243393A (ja) | 1986-04-15 | 1987-10-23 | キヤノン株式会社 | プリント基板 |
JPS63157492A (ja) | 1986-12-22 | 1988-06-30 | 株式会社東芝 | プリント配線板 |
US4835345A (en) * | 1987-09-18 | 1989-05-30 | Compaq Computer Corporation | Printed wiring board having robber pads for excess solder |
JPH01300588A (ja) | 1988-05-28 | 1989-12-05 | Nec Home Electron Ltd | プリント配線板及びそのはんだ付け方法 |
US5243143A (en) * | 1990-11-13 | 1993-09-07 | Compaq Computer Corporation | Solder snap bar |
JP2675473B2 (ja) * | 1992-01-13 | 1997-11-12 | 三洋電機株式会社 | フラットパッケージic半田ディップ型プリント配線板 |
FR2714566B1 (fr) * | 1993-12-24 | 1996-03-15 | Marelli Autronica | Plaque de circuit imprimé comportant des plages de drainage de soudure perfectionnées. |
US5604333A (en) * | 1994-11-30 | 1997-02-18 | Intel Corporation | Process and structure for a solder thief on circuit boards |
JPH08307022A (ja) * | 1995-05-10 | 1996-11-22 | Fuji Electric Co Ltd | プリント板 |
KR100319291B1 (ko) * | 1999-03-13 | 2002-01-09 | 윤종용 | 회로 기판 및 회로 기판의 솔더링 방법 |
JP2002280717A (ja) * | 2001-03-19 | 2002-09-27 | Matsushita Graphic Communication Systems Inc | プリント基板 |
JP3633505B2 (ja) * | 2001-04-27 | 2005-03-30 | 松下電器産業株式会社 | プリント配線基板およびプリント配線基板の半田付け方法 |
JP3988720B2 (ja) * | 2003-12-11 | 2007-10-10 | 三菱電機株式会社 | 4方向リードフラットパッケージic実装プリント配線基板及び4方向リードフラットパッケージicの半田付け方法、4方向リードフラットパッケージic実装プリント配線基板を備えた空気調和機。 |
-
2004
- 2004-06-03 JP JP2004165621A patent/JP4222260B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-15 EP EP05252366A patent/EP1603375B1/en not_active Not-in-force
- 2005-04-15 ES ES05252366T patent/ES2401585T3/es active Active
- 2005-05-20 CN CNB2005100728005A patent/CN100475002C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2005347529A (ja) | 2005-12-15 |
CN1705428A (zh) | 2005-12-07 |
ES2401585T3 (es) | 2013-04-22 |
EP1603375A1 (en) | 2005-12-07 |
EP1603375B1 (en) | 2013-03-06 |
CN100475002C (zh) | 2009-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4207934B2 (ja) | 4方向リードフラットパッケージic実装プリント配線基板、4方向リードフラットパッケージicの半田付方法、空気調和機。 | |
JP3988720B2 (ja) | 4方向リードフラットパッケージic実装プリント配線基板及び4方向リードフラットパッケージicの半田付け方法、4方向リードフラットパッケージic実装プリント配線基板を備えた空気調和機。 | |
JP5496118B2 (ja) | プリント配線基板、4方向リードフラットパッケージicの半田付方法および空気調和機 | |
JP5807145B2 (ja) | 実装構造体 | |
JP4222260B2 (ja) | リード形電子部品実装プリント配線基板及び空気調和機 | |
JP5599151B2 (ja) | 二列リード形電子部品実装プリント配線基板、二列リード形電子部品の半田付け方法、空気調和機 | |
JP4196979B2 (ja) | リード形電子部品実装プリント配線基板、リード形電子部品の半田付方法、空気調和機。 | |
CN211267300U (zh) | 一种钢网及焊接结构 | |
JP2009141106A (ja) | プリント配線基板、空気調和機、プリント配線基板の半田付け方法 | |
JP4041991B2 (ja) | プリント配線基板 | |
JP2009283983A (ja) | プリント配線基板、空気調和機、プリント配線基板の半田付け方法 | |
JP2009060006A (ja) | 半田付けパレット | |
JP5885162B2 (ja) | プリント配線基板 | |
JPH11177224A (ja) | メタルマスク及びプリント配線板 | |
JPH09232699A (ja) | 片面プリント基板のジャンパ回路 | |
JPH02194591A (ja) | プリント基板 | |
JP2004207421A (ja) | ジャンパ線のはんだ付け方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060830 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060830 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080620 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080715 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080910 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20081028 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20081110 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 4222260 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111128 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121128 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121128 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131128 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |