CN100475002C - 印刷布线基板及锡焊方法以及装配有印刷布线基板的空调器 - Google Patents

印刷布线基板及锡焊方法以及装配有印刷布线基板的空调器 Download PDF

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Publication number
CN100475002C
CN100475002C CNB2005100728005A CN200510072800A CN100475002C CN 100475002 C CN100475002 C CN 100475002C CN B2005100728005 A CNB2005100728005 A CN B2005100728005A CN 200510072800 A CN200510072800 A CN 200510072800A CN 100475002 C CN100475002 C CN 100475002C
Authority
CN
China
Prior art keywords
solder
printed wiring
soldering
wiring board
jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2005100728005A
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English (en)
Chinese (zh)
Other versions
CN1705428A (zh
Inventor
三浦刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN1705428A publication Critical patent/CN1705428A/zh
Application granted granted Critical
Publication of CN100475002C publication Critical patent/CN100475002C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CNB2005100728005A 2004-06-03 2005-05-20 印刷布线基板及锡焊方法以及装配有印刷布线基板的空调器 Expired - Lifetime CN100475002C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004165621 2004-06-03
JP2004165621A JP4222260B2 (ja) 2004-06-03 2004-06-03 リード形電子部品実装プリント配線基板及び空気調和機

Publications (2)

Publication Number Publication Date
CN1705428A CN1705428A (zh) 2005-12-07
CN100475002C true CN100475002C (zh) 2009-04-01

Family

ID=34940856

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100728005A Expired - Lifetime CN100475002C (zh) 2004-06-03 2005-05-20 印刷布线基板及锡焊方法以及装配有印刷布线基板的空调器

Country Status (4)

Country Link
EP (1) EP1603375B1 (enExample)
JP (1) JP4222260B2 (enExample)
CN (1) CN100475002C (enExample)
ES (1) ES2401585T3 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4196979B2 (ja) 2005-09-07 2008-12-17 三菱電機株式会社 リード形電子部品実装プリント配線基板、リード形電子部品の半田付方法、空気調和機。
JP5599151B2 (ja) 2009-01-30 2014-10-01 三菱電機株式会社 二列リード形電子部品実装プリント配線基板、二列リード形電子部品の半田付け方法、空気調和機

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835345A (en) * 1987-09-18 1989-05-30 Compaq Computer Corporation Printed wiring board having robber pads for excess solder
US5243143A (en) * 1990-11-13 1993-09-07 Compaq Computer Corporation Solder snap bar
US5604333A (en) * 1994-11-30 1997-02-18 Intel Corporation Process and structure for a solder thief on circuit boards
US6407342B1 (en) * 1999-03-13 2002-06-18 Samsung Electronics Co., Ltd Printed circuit board capable of preventing electrical short during soldering process

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3211408A1 (de) * 1982-03-27 1983-09-29 Vdo Adolf Schindling Ag, 6000 Frankfurt Substrat
JPS62243393A (ja) 1986-04-15 1987-10-23 キヤノン株式会社 プリント基板
JPS63157492A (ja) 1986-12-22 1988-06-30 株式会社東芝 プリント配線板
JPH01300588A (ja) 1988-05-28 1989-12-05 Nec Home Electron Ltd プリント配線板及びそのはんだ付け方法
JP2675473B2 (ja) * 1992-01-13 1997-11-12 三洋電機株式会社 フラットパッケージｉｃ半田ディップ型プリント配線板
FR2714566B1 (fr) * 1993-12-24 1996-03-15 Marelli Autronica Plaque de circuit imprimé comportant des plages de drainage de soudure perfectionnées.
JPH08307022A (ja) * 1995-05-10 1996-11-22 Fuji Electric Co Ltd プリント板
JP2002280717A (ja) * 2001-03-19 2002-09-27 Matsushita Graphic Communication Systems Inc プリント基板
JP3633505B2 (ja) * 2001-04-27 2005-03-30 松下電器産業株式会社 プリント配線基板およびプリント配線基板の半田付け方法
JP3988720B2 (ja) * 2003-12-11 2007-10-10 三菱電機株式会社 ４方向リードフラットパッケージｉｃ実装プリント配線基板及び４方向リードフラットパッケージｉｃの半田付け方法、４方向リードフラットパッケージｉｃ実装プリント配線基板を備えた空気調和機。

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835345A (en) * 1987-09-18 1989-05-30 Compaq Computer Corporation Printed wiring board having robber pads for excess solder
US5243143A (en) * 1990-11-13 1993-09-07 Compaq Computer Corporation Solder snap bar
US5604333A (en) * 1994-11-30 1997-02-18 Intel Corporation Process and structure for a solder thief on circuit boards
US6407342B1 (en) * 1999-03-13 2002-06-18 Samsung Electronics Co., Ltd Printed circuit board capable of preventing electrical short during soldering process

Also Published As

Publication number Publication date
EP1603375A1 (en) 2005-12-07
EP1603375B1 (en) 2013-03-06
CN1705428A (zh) 2005-12-07
JP2005347529A (ja) 2005-12-15
JP4222260B2 (ja) 2009-02-12
ES2401585T3 (es) 2013-04-22

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Granted publication date: 20090401