JP4152335B2 - 機械部品を整備する方法および装置 - Google Patents
機械部品を整備する方法および装置 Download PDFInfo
- Publication number
- JP4152335B2 JP4152335B2 JP2004067549A JP2004067549A JP4152335B2 JP 4152335 B2 JP4152335 B2 JP 4152335B2 JP 2004067549 A JP2004067549 A JP 2004067549A JP 2004067549 A JP2004067549 A JP 2004067549A JP 4152335 B2 JP4152335 B2 JP 4152335B2
- Authority
- JP
- Japan
- Prior art keywords
- gripper
- internal space
- substrate
- load lock
- machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 41
- 239000000758 substrate Substances 0.000 claims description 144
- 230000005855 radiation Effects 0.000 claims description 29
- 238000012423 maintenance Methods 0.000 claims description 13
- 238000000059 patterning Methods 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 8
- 230000007613 environmental effect Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 description 20
- 239000002245 particle Substances 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 6
- 238000001459 lithography Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41C—CORSETS; BRASSIERES
- A41C3/00—Brassieres
- A41C3/10—Brassieres with stiffening or bust-forming inserts
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41B—SHIRTS; UNDERWEAR; BABY LINEN; HANDKERCHIEFS
- A41B17/00—Selection of special materials for underwear
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41C—CORSETS; BRASSIERES
- A41C3/00—Brassieres
- A41C3/0007—Brassieres with stay means
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41C—CORSETS; BRASSIERES
- A41C3/00—Brassieres
- A41C3/12—Component parts
- A41C3/122—Stay means
- A41C3/128—Stay means using specific materials
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41C—CORSETS; BRASSIERES
- A41C3/00—Brassieres
- A41C3/12—Component parts
- A41C3/14—Stiffening or bust-forming inserts
- A41C3/142—Stiffening inserts
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41C—CORSETS; BRASSIERES
- A41C3/00—Brassieres
- A41C3/12—Component parts
- A41C3/14—Stiffening or bust-forming inserts
- A41C3/144—Pads
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Textile Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP03075703 | 2003-03-11 | ||
| EP03076702 | 2003-06-02 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004343069A JP2004343069A (ja) | 2004-12-02 |
| JP2004343069A5 JP2004343069A5 (enExample) | 2006-07-20 |
| JP4152335B2 true JP4152335B2 (ja) | 2008-09-17 |
Family
ID=33542553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004067549A Expired - Fee Related JP4152335B2 (ja) | 2003-03-11 | 2004-03-10 | 機械部品を整備する方法および装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7576831B2 (enExample) |
| JP (1) | JP4152335B2 (enExample) |
| KR (1) | KR100696737B1 (enExample) |
| CN (1) | CN1530754A (enExample) |
| SG (1) | SG115629A1 (enExample) |
| TW (1) | TWI259333B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG115631A1 (en) * | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Lithographic projection assembly, load lock and method for transferring objects |
| US9939728B2 (en) | 2011-09-12 | 2018-04-10 | Mapper Lithography Ip B.V. | Vacuum chamber with a thick aluminum base plate |
Family Cites Families (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8300220A (nl) | 1983-01-21 | 1984-08-16 | Philips Nv | Inrichting voor het stralingslithografisch behandelen van een dun substraat. |
| US5523193A (en) * | 1988-05-31 | 1996-06-04 | Texas Instruments Incorporated | Method and apparatus for patterning and imaging member |
| US5026239A (en) | 1988-09-06 | 1991-06-25 | Canon Kabushiki Kaisha | Mask cassette and mask cassette loading device |
| US5186718A (en) | 1989-05-19 | 1993-02-16 | Applied Materials, Inc. | Staged-vacuum wafer processing system and method |
| KR0155158B1 (ko) | 1989-07-25 | 1998-12-01 | 카자마 젠쥬 | 종형 처리 장치 및 처리방법 |
| JP2901193B2 (ja) | 1989-12-08 | 1999-06-07 | 三菱電機株式会社 | 露光装置における温度制御方法 |
| US5296891A (en) * | 1990-05-02 | 1994-03-22 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Illumination device |
| JPH0448716A (ja) | 1990-06-15 | 1992-02-18 | Canon Inc | 基板保持装置および該装置を有する露光装置 |
| JPH081923B2 (ja) | 1991-06-24 | 1996-01-10 | ティーディーケイ株式会社 | クリーン搬送方法及び装置 |
| US5229872A (en) * | 1992-01-21 | 1993-07-20 | Hughes Aircraft Company | Exposure device including an electrically aligned electronic mask for micropatterning |
| JPH0851143A (ja) * | 1992-07-20 | 1996-02-20 | Nikon Corp | 基板保持装置 |
| US5559584A (en) * | 1993-03-08 | 1996-09-24 | Nikon Corporation | Exposure apparatus |
| JP3308967B2 (ja) | 1993-07-21 | 2002-07-29 | キヤノン株式会社 | 処理システム及びデバイス製造方法 |
| JP3188363B2 (ja) | 1994-01-21 | 2001-07-16 | エフエスアイ・インターナショナル・インコーポレーテッド | 循環クーラントを用いた温度コントローラ及びそのための温度制御方法 |
| JP2850279B2 (ja) | 1994-02-22 | 1999-01-27 | ティーディーケイ株式会社 | クリーン搬送方法及び装置 |
| US5486080A (en) | 1994-06-30 | 1996-01-23 | Diamond Semiconductor Group, Inc. | High speed movement of workpieces in vacuum processing |
| JP3167089B2 (ja) * | 1994-12-27 | 2001-05-14 | キヤノン株式会社 | 露光装置及び方法 |
| US5825470A (en) * | 1995-03-14 | 1998-10-20 | Nikon Corporation | Exposure apparatus |
| US5510624A (en) | 1995-09-01 | 1996-04-23 | The University Of Chicago | Simultaneous specimen and stage cleaning device for analytical electron microscope |
| US5752796A (en) | 1996-01-24 | 1998-05-19 | Muka; Richard S. | Vacuum integrated SMIF system |
| JP2937846B2 (ja) | 1996-03-01 | 1999-08-23 | アプライド マテリアルズ インコーポレイテッド | マルチチャンバウェハ処理システム |
| WO1997033205A1 (en) * | 1996-03-06 | 1997-09-12 | Philips Electronics N.V. | Differential interferometer system and lithographic step-and-scan apparatus provided with such a system |
| US6342941B1 (en) * | 1996-03-11 | 2002-01-29 | Nikon Corporation | Exposure apparatus and method preheating a mask before exposing; a conveyance method preheating a mask before exposing; and a device manufacturing system and method manufacturing a device according to the exposure apparatus and method |
| JPH1092738A (ja) | 1996-09-18 | 1998-04-10 | Canon Inc | 基板保持装置およびこれを用いた露光装置 |
| SG76527A1 (en) * | 1996-09-24 | 2000-11-21 | Tokyo Electron Ltd | Method and apparatus for cleaning treatment |
| US6048154A (en) * | 1996-10-02 | 2000-04-11 | Applied Materials, Inc. | High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock |
| JPH10116760A (ja) * | 1996-10-08 | 1998-05-06 | Nikon Corp | 露光装置及び基板保持装置 |
| DE69735016T2 (de) * | 1996-12-24 | 2006-08-17 | Asml Netherlands B.V. | Lithographisches Gerät mit zwei Objekthaltern |
| WO1998033096A1 (en) | 1997-01-29 | 1998-07-30 | Micronic Laser Systems Ab | Method and apparatus for the production of a structure by focused laser radiation on a photosensitively coated substrate |
| US5914493A (en) * | 1997-02-21 | 1999-06-22 | Nikon Corporation | Charged-particle-beam exposure apparatus and methods with substrate-temperature control |
| SE509062C2 (sv) | 1997-02-28 | 1998-11-30 | Micronic Laser Systems Ab | Dataomvandlingsmetod för en laserskrivare med flera strålar för mycket komplexa mikrokolitografiska mönster |
| USRE40043E1 (en) | 1997-03-10 | 2008-02-05 | Asml Netherlands B.V. | Positioning device having two object holders |
| US6090176A (en) | 1997-03-18 | 2000-07-18 | Kabushiki Kaisha Toshiba | Sample transferring method and sample transfer supporting apparatus |
| US6059507A (en) | 1997-04-21 | 2000-05-09 | Brooks Automation, Inc. | Substrate processing apparatus with small batch load lock |
| US5944857A (en) | 1997-05-08 | 1999-08-31 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
| JPH11135416A (ja) | 1997-10-31 | 1999-05-21 | Nikon Corp | 被処理体載置テーブルおよびそれを備えた処理装置 |
| EP1049640A4 (en) | 1997-11-28 | 2008-03-12 | Mattson Tech Inc | METHOD AND APPARATUS FOR HANDLING WORKPIECES UNDER VACUUM WITH LOW CONTAMINATION AND HIGH THROUGHPUT |
| JP3966594B2 (ja) | 1998-01-26 | 2007-08-29 | 東京エレクトロン株式会社 | 予備真空室およびそれを用いた真空処理装置 |
| JPH11288995A (ja) | 1998-04-04 | 1999-10-19 | Tokyo Electron Ltd | 搬送システム及び処理装置 |
| US6083566A (en) | 1998-05-26 | 2000-07-04 | Whitesell; Andrew B. | Substrate handling and processing system and method |
| US6031598A (en) * | 1998-09-25 | 2000-02-29 | Euv Llc | Extreme ultraviolet lithography machine |
| JP2000195925A (ja) | 1998-12-28 | 2000-07-14 | Anelva Corp | 基板処理装置 |
| US6610150B1 (en) | 1999-04-02 | 2003-08-26 | Asml Us, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
| TW513617B (en) | 1999-04-21 | 2002-12-11 | Asml Corp | Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus |
| US6641349B1 (en) | 1999-04-30 | 2003-11-04 | Tdk Corporation | Clean box, clean transfer method and system |
| KR20010112496A (ko) * | 1999-05-20 | 2001-12-20 | 시마무라 테루오 | 홀더용 콘테이너, 노광장치 및 디바이스 제조방법, 그리고디바이스 제조장치 |
| KR100602104B1 (ko) * | 1999-05-25 | 2006-07-19 | 동경 엘렉트론 주식회사 | 레지스트 도포현상처리장치 |
| US6486444B1 (en) | 1999-06-03 | 2002-11-26 | Applied Materials, Inc. | Load-lock with external staging area |
| AU5651399A (en) | 1999-09-14 | 2001-04-17 | Nikon Corporation | Exposure system, exposure device, application device, development device, and method of controlling wafer treating environment in the exposure system |
| JP2001118904A (ja) | 1999-10-19 | 2001-04-27 | Canon Inc | ロードロック室を備えた基板処理装置および被処理基板の搬送方法 |
| KR100307825B1 (ko) * | 1999-10-23 | 2001-11-02 | 윤종용 | 웨이퍼 예비정렬 스테이지에 사용되는 웨이퍼 온도 제어장치 |
| JP2001127044A (ja) | 1999-10-29 | 2001-05-11 | Hitachi Ltd | 真空処理装置および真空処理システム |
| US6558509B2 (en) | 1999-11-30 | 2003-05-06 | Applied Materials, Inc. | Dual wafer load lock |
| US6429139B1 (en) | 1999-12-17 | 2002-08-06 | Eaton Corporation | Serial wafer handling mechanism |
| US20010016302A1 (en) * | 1999-12-28 | 2001-08-23 | Nikon Corporation | Wafer chucks allowing controlled reduction of substrate heating and rapid substrate exchange |
| JP2001210576A (ja) | 2000-01-25 | 2001-08-03 | Nikon Corp | 荷重キャンセル機構、真空チャンバ結合体、露光装置及び半導体デバイスの製造方法 |
| JP2001222099A (ja) | 2000-02-10 | 2001-08-17 | Toshiba Corp | 荷電ビーム描画装置および荷電ビーム描画方法 |
| JP2002057100A (ja) | 2000-05-31 | 2002-02-22 | Canon Inc | 露光装置、コートデベロップ装置、デバイス製造システム、デバイス製造方法、半導体製造工場および露光装置の保守方法 |
| JP2002075856A (ja) | 2000-06-13 | 2002-03-15 | Canon Inc | ロードロックチャンバ及びそれを用いた露光装置 |
| US6734950B2 (en) * | 2000-06-13 | 2004-05-11 | Canon Kabushiki Kaisha | Load-lock chamber and exposure apparatus using the same |
| US6562141B2 (en) | 2000-07-03 | 2003-05-13 | Andrew Peter Clarke | Dual degas/cool loadlock cluster tool |
| JP4560182B2 (ja) | 2000-07-06 | 2010-10-13 | キヤノン株式会社 | 減圧処理装置、半導体製造装置およびデバイス製造方法 |
| JP2002033264A (ja) | 2000-07-13 | 2002-01-31 | Hitachi Ltd | 投影露光装置 |
| TW512421B (en) | 2000-09-15 | 2002-12-01 | Applied Materials Inc | Double dual slot load lock for process equipment |
| US6609877B1 (en) | 2000-10-04 | 2003-08-26 | The Boc Group, Inc. | Vacuum chamber load lock structure and article transport mechanism |
| WO2002029495A1 (en) | 2000-10-05 | 2002-04-11 | Asml Us, Inc. | Mountable and removable sensor |
| US6485248B1 (en) | 2000-10-10 | 2002-11-26 | Applied Materials, Inc. | Multiple wafer lift apparatus and associated method |
| TW591342B (en) | 2000-11-30 | 2004-06-11 | Asml Netherlands Bv | Lithographic projection apparatus and integrated circuit manufacturing method using a lithographic projection apparatus |
| JP4096246B2 (ja) | 2000-12-22 | 2008-06-04 | 株式会社ニコン | マスク浄化方法及び装置、並びにデバイス製造システム |
| US6609869B2 (en) | 2001-01-04 | 2003-08-26 | Asm America | Transfer chamber with integral loadlock and staging station |
| JP2002246287A (ja) * | 2001-02-16 | 2002-08-30 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
| JP2002252155A (ja) * | 2001-02-22 | 2002-09-06 | Nikon Corp | 荷電粒子線装置及び方法 |
| US6918731B2 (en) | 2001-07-02 | 2005-07-19 | Brooks Automation, Incorporated | Fast swap dual substrate transport for load lock |
| JP2003023059A (ja) | 2001-07-10 | 2003-01-24 | Canon Inc | 基板搬入出方法及び露光装置 |
| JP2003031470A (ja) | 2001-07-16 | 2003-01-31 | Nikon Corp | 露光装置 |
| JP2003031639A (ja) | 2001-07-17 | 2003-01-31 | Canon Inc | 基板処理装置、基板の搬送方法及び露光装置 |
| JP2003045947A (ja) | 2001-07-27 | 2003-02-14 | Canon Inc | 基板処理装置及び露光装置 |
| JP2003045931A (ja) * | 2001-07-31 | 2003-02-14 | Sendai Nikon:Kk | 露光装置 |
| US6619903B2 (en) | 2001-08-10 | 2003-09-16 | Glenn M. Friedman | System and method for reticle protection and transport |
| US20030045098A1 (en) * | 2001-08-31 | 2003-03-06 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
| US6778258B2 (en) | 2001-10-19 | 2004-08-17 | Asml Holding N.V. | Wafer handling system for use in lithography patterning |
| JP2003173958A (ja) | 2001-12-06 | 2003-06-20 | Nikon Corp | 露光方法及び露光装置 |
| US7304720B2 (en) | 2002-02-22 | 2007-12-04 | Asml Holding N.V. | System for using a two part cover for protecting a reticle |
| US6866468B2 (en) | 2002-03-13 | 2005-03-15 | Peter Wolters Cmp-Systeme Gmbh & Co. Kg | Loading and unloading station for a device for the processing of circular flat work-pieces, especially semiconductor wafers |
| JP3469230B2 (ja) * | 2002-07-12 | 2003-11-25 | 株式会社日立製作所 | 真空処理装置 |
| SG115631A1 (en) | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Lithographic projection assembly, load lock and method for transferring objects |
| SG115632A1 (en) * | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate |
| SG115630A1 (en) | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock |
-
2004
- 2004-03-09 SG SG200401151A patent/SG115629A1/en unknown
- 2004-03-10 JP JP2004067549A patent/JP4152335B2/ja not_active Expired - Fee Related
- 2004-03-10 KR KR1020040016071A patent/KR100696737B1/ko not_active Expired - Fee Related
- 2004-03-10 TW TW093106321A patent/TWI259333B/zh not_active IP Right Cessation
- 2004-03-10 CN CNA2004100326869A patent/CN1530754A/zh active Pending
- 2004-03-11 US US10/797,664 patent/US7576831B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1530754A (zh) | 2004-09-22 |
| JP2004343069A (ja) | 2004-12-02 |
| US20050019709A1 (en) | 2005-01-27 |
| TWI259333B (en) | 2006-08-01 |
| KR20040080347A (ko) | 2004-09-18 |
| KR100696737B1 (ko) | 2007-03-20 |
| TW200508809A (en) | 2005-03-01 |
| US7576831B2 (en) | 2009-08-18 |
| SG115629A1 (en) | 2005-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7145643B2 (en) | Interface unit, lithographic projection apparatus comprising such an interface unit and a device manufacturing method | |
| JP4854530B2 (ja) | リソグラフィ投影装置、およびデバイス製造方法 | |
| JP4625059B2 (ja) | 支持構造体、リソグラフィ投影装置、ロボットおよびデバイス製造方法 | |
| JP4162617B2 (ja) | リソグラフィー投影組立体、ロード・ロック、および物体移送方法 | |
| US20050117142A1 (en) | Assembly of a reticle holder and a reticle | |
| KR20110004876A (ko) | 리소그래피 레티클용 급속 교환 디바이스 | |
| JP2001284440A (ja) | リソグラフ装置の基板ホルダ | |
| JP4204964B2 (ja) | リソグラフィ装置 | |
| KR100748445B1 (ko) | 리소그래피 패터닝 디바이스용 안전 메커니즘 | |
| JP5667620B2 (ja) | パターニングデバイスをロードする方法、高速交換デバイス、及び、半導体デバイスを製造するためのシステム | |
| JP4154380B2 (ja) | リソグラフィ装置およびデバイス製造方法 | |
| JP4152335B2 (ja) | 機械部品を整備する方法および装置 | |
| JP4332146B2 (ja) | リソグラフィ装置及びデバイス製造方法 | |
| JP4812796B2 (ja) | 基板をマスクするリソグラフィ装置及び方法 | |
| JP4392398B2 (ja) | リソグラフィ装置及びデバイス製造方法 | |
| JP4048205B2 (ja) | リトグラフ装置及びデバイス製造方法 | |
| JP2004274024A (ja) | リソグラフィ装置、デバイス製造方法、およびそれにより製造されたデバイス | |
| EP1457831A1 (en) | Method and apparatus for maintaining a machine part | |
| JP4669833B2 (ja) | リソグラフィ装置 | |
| JP3713479B2 (ja) | 平板投影装置および素子製造方法 | |
| EP1465012A2 (en) | Supporting structure for use in a lithographic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050330 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20050330 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050809 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20051109 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20051114 |
|
| A524 | Written submission of copy of amendment under section 19 (pct) |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20060209 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060901 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20060904 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061227 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20070109 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20070316 |
|
| RD05 | Notification of revocation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7425 Effective date: 20070530 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080529 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080701 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110711 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120711 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130711 Year of fee payment: 5 |
|
| LAPS | Cancellation because of no payment of annual fees |