JP4131164B2 - 基板固定方法および表示装置製造方法 - Google Patents

基板固定方法および表示装置製造方法 Download PDF

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Publication number
JP4131164B2
JP4131164B2 JP2002343955A JP2002343955A JP4131164B2 JP 4131164 B2 JP4131164 B2 JP 4131164B2 JP 2002343955 A JP2002343955 A JP 2002343955A JP 2002343955 A JP2002343955 A JP 2002343955A JP 4131164 B2 JP4131164 B2 JP 4131164B2
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substrate
suction
stage
holes
unit
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JP2004179399A (ja
JP2004179399A5 (enExample
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俊正 森
貴也 田中
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Seiko Epson Corp
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Seiko Epson Corp
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JP2002343955A 2002-11-27 2002-11-27 基板固定方法および表示装置製造方法 Expired - Fee Related JP4131164B2 (ja)

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JP2004179399A5 JP2004179399A5 (enExample) 2005-10-20
JP4131164B2 true JP4131164B2 (ja) 2008-08-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180052538A (ko) * 2016-11-10 2018-05-18 사이언테크 코포레이션 단일기판 처리장치

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060054514A (ko) * 2004-11-16 2006-05-22 삼성전자주식회사 건식 식각 장치
KR100607365B1 (ko) 2004-12-30 2006-08-01 동부일렉트로닉스 주식회사 진공 흡착식 승강 핀을 구비하는 웨이퍼 지지 장치
JP4486943B2 (ja) * 2006-05-31 2010-06-23 シャープ株式会社 被加工脆性板の切断装置および切断方法
JP5358239B2 (ja) * 2009-03-25 2013-12-04 ラピスセミコンダクタ株式会社 ウエハ保持装置、半導体製造装置およびウエハ吸着方法
JP5352329B2 (ja) * 2009-04-13 2013-11-27 株式会社日立ハイテクノロジーズ 実装処理作業装置及び実装処理作業方法並びに表示基板モジュール組立ライン
JP2011199218A (ja) * 2010-03-24 2011-10-06 Dainippon Screen Mfg Co Ltd 基板搬送装置およびそれを用いた基板検査システム
JP2012206476A (ja) * 2011-03-30 2012-10-25 Seiko Epson Corp 印刷装置
JP2014184998A (ja) * 2013-03-22 2014-10-02 Dainippon Screen Mfg Co Ltd 板状被搬送物の受渡方法、受渡装置およびパターン形成装置
KR102171583B1 (ko) * 2013-04-01 2020-10-30 삼성디스플레이 주식회사 기판 고정 장치 및 그 방법
KR101599812B1 (ko) * 2014-10-24 2016-03-07 제너셈(주) 반도체패키지의 흡착고정수단
TWI630059B (zh) * 2015-12-25 2018-07-21 日商三星鑽石工業股份有限公司 Substrate adsorption device and workbench
JP6867226B2 (ja) * 2017-05-01 2021-04-28 日本特殊陶業株式会社 真空吸着部材
JP6733966B2 (ja) * 2018-07-09 2020-08-05 Ａｉメカテック株式会社 基板組立装置及び基板組立方法
KR102161527B1 (ko) * 2019-06-11 2020-10-05 세메스 주식회사 스테이지 유닛 및 이를 포함하는 다이 본딩 장치
JP6836003B1 (ja) * 2020-08-27 2021-02-24 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
JP2023084205A (ja) * 2021-12-07 2023-06-19 古河電気工業株式会社 端子配置台及び端子配置方法
KR20240172557A (ko) * 2023-06-01 2024-12-10 앱솔릭스 인코포레이티드 기판 그리퍼 및 이를 이용한 기판 이송 방법
CN118491884B (zh) * 2024-07-09 2024-09-27 深圳宜美智科技股份有限公司 Pcb翘曲检测装置及pcb翘曲检测方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2691299B2 (ja) * 1989-06-12 1997-12-17 株式会社ニコン 基板ホルダ
JPH05190414A (ja) * 1992-01-17 1993-07-30 Nikon Corp 基板吸着装置
JPH069844U (ja) * 1992-07-13 1994-02-08 大日本スクリーン製造株式会社 基板搬送ステージおよびそれを用いたロールコータ
JP2000100913A (ja) * 1998-09-21 2000-04-07 Canon Inc 板状体の吸着装置及びその制御方法
JP2001267271A (ja) * 2000-03-22 2001-09-28 Yoshioka Seiko:Kk 吸着装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180052538A (ko) * 2016-11-10 2018-05-18 사이언테크 코포레이션 단일기판 처리장치
KR102039795B1 (ko) * 2016-11-10 2019-11-01 사이언테크 코포레이션 단일기판 처리장치

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