JP4110669B2 - 多孔質絶縁材料およびその積層体 - Google Patents

多孔質絶縁材料およびその積層体 Download PDF

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Publication number
JP4110669B2
JP4110669B2 JP13275599A JP13275599A JP4110669B2 JP 4110669 B2 JP4110669 B2 JP 4110669B2 JP 13275599 A JP13275599 A JP 13275599A JP 13275599 A JP13275599 A JP 13275599A JP 4110669 B2 JP4110669 B2 JP 4110669B2
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Japan
Prior art keywords
porous
film
polyimide precursor
polyimide
solvent
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Expired - Fee Related
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JP13275599A
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English (en)
Japanese (ja)
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JP2000319442A5 (enrdf_load_stackoverflow
JP2000319442A (ja
Inventor
滋 八尾
修生 大矢
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Ube Corp
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Ube Industries Ltd
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Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP13275599A priority Critical patent/JP4110669B2/ja
Priority to US09/539,929 priority patent/US20030129379A1/en
Publication of JP2000319442A publication Critical patent/JP2000319442A/ja
Priority to US10/784,982 priority patent/US20040241419A1/en
Priority to US10/785,413 priority patent/US7303811B2/en
Publication of JP2000319442A5 publication Critical patent/JP2000319442A5/ja
Priority to US11/516,045 priority patent/US7311966B2/en
Priority to US11/802,557 priority patent/US20070275222A1/en
Application granted granted Critical
Publication of JP4110669B2 publication Critical patent/JP4110669B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulating Bodies (AREA)
JP13275599A 1999-04-23 1999-05-13 多孔質絶縁材料およびその積層体 Expired - Fee Related JP4110669B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP13275599A JP4110669B2 (ja) 1999-05-13 1999-05-13 多孔質絶縁材料およびその積層体
US09/539,929 US20030129379A1 (en) 1999-04-23 2000-03-31 Porous insulating film and its laminates
US10/784,982 US20040241419A1 (en) 1999-04-23 2004-02-25 Porous insulating film and its laminates
US10/785,413 US7303811B2 (en) 1999-04-23 2004-02-25 Porous insulating film and its laminates
US11/516,045 US7311966B2 (en) 1999-04-23 2006-09-06 Porous insulating film and its laminates
US11/802,557 US20070275222A1 (en) 1999-04-23 2007-05-23 Porous insulating film and its laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13275599A JP4110669B2 (ja) 1999-05-13 1999-05-13 多孔質絶縁材料およびその積層体

Publications (3)

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JP2000319442A JP2000319442A (ja) 2000-11-21
JP2000319442A5 JP2000319442A5 (enrdf_load_stackoverflow) 2005-09-15
JP4110669B2 true JP4110669B2 (ja) 2008-07-02

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JP13275599A Expired - Fee Related JP4110669B2 (ja) 1999-04-23 1999-05-13 多孔質絶縁材料およびその積層体

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JP (1) JP4110669B2 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637042U (ja) * 1992-10-22 1994-05-17 三井造船株式会社 エアクッション艇の後部スカート構造
WO2010150794A1 (en) 2009-06-23 2010-12-29 Canon Kabushiki Kaisha Method of producing porous polymer film and porous polymer film produced by the method
CN108329689A (zh) * 2018-03-08 2018-07-27 哈尔滨理工大学 一种低介电常数聚酰亚胺多孔薄膜及其制备方法

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4557376B2 (ja) * 2000-06-19 2010-10-06 日東電工株式会社 多孔質体の製造方法及び多孔質体
JP4557409B2 (ja) * 2000-11-13 2010-10-06 日東電工株式会社 多孔質ポリイミドの製造方法及び多孔質ポリイミド
JP2002201305A (ja) * 2001-01-05 2002-07-19 Teijin Ltd ポリイミド多孔膜およびその製造方法
JP4701339B2 (ja) * 2001-02-22 2011-06-15 日東電工株式会社 通気性接着シートの製造方法
JP4507419B2 (ja) * 2001-02-22 2010-07-21 日東電工株式会社 通気性接着シートの製造方法および通気性接着シート
JP2002337268A (ja) * 2001-05-21 2002-11-27 Nitto Denko Corp 金属箔積層板及びその製造方法
US7060349B2 (en) * 2002-09-24 2006-06-13 Fuji Xerox Co., Ltd. Resin composition, process for producing the same and electrophotographic fixing member
JP2003201596A (ja) 2002-01-10 2003-07-18 Nitto Denko Corp 金属層の形成方法および金属箔積層体
EP1561561B1 (en) 2002-11-12 2011-10-12 Daicel Chemical Industries, Ltd. Process for producing porous film and porous film
JP2004260038A (ja) * 2003-02-27 2004-09-16 Nitto Denko Corp 複合絶縁層の形成方法及び配線基板の製造方法
EP1672011A4 (en) 2003-09-25 2009-04-15 Daicel Chem CHEMICAL-RESISTANT POROUS FILM
TWI526485B (zh) * 2005-05-27 2016-03-21 富士軟片股份有限公司 自己組織化構造體之製法
KR20090003249A (ko) 2006-02-20 2009-01-09 다이셀 가가꾸 고교 가부시끼가이샤 다공성 필름 및 다공성 필름을 이용한 적층체
JP4821411B2 (ja) * 2006-04-05 2011-11-24 宇部興産株式会社 片面のみに熱融着性を有するポリイミドフィルム、片面銅張り積層板
CN100445322C (zh) * 2006-08-21 2008-12-24 浙江大学 一种超低介电常数聚酰亚胺膜及其制备方法
JP2009166378A (ja) * 2008-01-17 2009-07-30 Sun A Kaken Co Ltd 積層体および電子レンジ加熱用包装体
JP4656265B1 (ja) * 2009-08-20 2011-03-23 東洋紡績株式会社 電気絶縁シート及びその製造方法
JP5644151B2 (ja) * 2010-03-23 2014-12-24 宇部興産株式会社 積層体の製造方法及び積層体
JP5528250B2 (ja) 2010-07-30 2014-06-25 日東電工株式会社 配線回路基板の製造方法
JP2012182116A (ja) * 2011-02-03 2012-09-20 Nitto Denko Corp モーター用電気絶縁性樹脂シート及びその製造方法
JP5916498B2 (ja) * 2011-06-06 2016-05-11 日東電工株式会社 ポリイミド多孔質体及びその製造方法
JP2015015451A (ja) * 2013-06-03 2015-01-22 宇部興産株式会社 導電部材
KR101778739B1 (ko) 2016-01-22 2017-09-14 에스케이씨 주식회사 이방성 열전도 필름, 이를 사용한 적층시트 및 이의 제조방법
JP6700846B2 (ja) * 2016-02-23 2020-05-27 東京応化工業株式会社 配線基板用積層体、配線基板、及び配線基板用積層体の製造方法
JP6858902B2 (ja) * 2020-04-27 2021-04-14 東京応化工業株式会社 配線基板用積層体、配線基板、及び配線基板用積層体の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637042U (ja) * 1992-10-22 1994-05-17 三井造船株式会社 エアクッション艇の後部スカート構造
WO2010150794A1 (en) 2009-06-23 2010-12-29 Canon Kabushiki Kaisha Method of producing porous polymer film and porous polymer film produced by the method
JP2011006520A (ja) * 2009-06-23 2011-01-13 Canon Inc 多孔質高分子膜の製造方法及びその製造方法で製造した多孔質高分子膜
US8916619B2 (en) 2009-06-23 2014-12-23 Canon Kabushiki Kaisha Method of producing porous polymer film and porous polymer film produced by the method
CN108329689A (zh) * 2018-03-08 2018-07-27 哈尔滨理工大学 一种低介电常数聚酰亚胺多孔薄膜及其制备方法
CN108329689B (zh) * 2018-03-08 2020-09-15 哈尔滨理工大学 一种低介电常数聚酰亚胺多孔薄膜及其制备方法

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