JP4099761B2 - 電子材料用組成物、電子用品及び電子材料用組成物の使用方法 - Google Patents

電子材料用組成物、電子用品及び電子材料用組成物の使用方法 Download PDF

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Publication number
JP4099761B2
JP4099761B2 JP2003021270A JP2003021270A JP4099761B2 JP 4099761 B2 JP4099761 B2 JP 4099761B2 JP 2003021270 A JP2003021270 A JP 2003021270A JP 2003021270 A JP2003021270 A JP 2003021270A JP 4099761 B2 JP4099761 B2 JP 4099761B2
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Japan
Prior art keywords
electronic
composition
cured
semi
article
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Expired - Lifetime
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JP2003021270A
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English (en)
Japanese (ja)
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JP2004262956A (ja
Inventor
拓郎 星尾
高弘 佐復
幸一郎 和田
秀樹 小川
茂 石田
淳 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Yokohama Rubber Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Yokohama Rubber Co Ltd
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Publication date
Application filed by Taiyo Yuden Co Ltd, Yokohama Rubber Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP2003021270A priority Critical patent/JP4099761B2/ja
Priority to TW093102057A priority patent/TW200504144A/zh
Priority to CNB2004800032897A priority patent/CN100430427C/zh
Priority to KR1020057014115A priority patent/KR100966938B1/ko
Priority to PCT/JP2004/000837 priority patent/WO2004067600A1/ja
Priority to US10/514,499 priority patent/US20050167639A1/en
Publication of JP2004262956A publication Critical patent/JP2004262956A/ja
Application granted granted Critical
Publication of JP4099761B2 publication Critical patent/JP4099761B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003021270A 2003-01-30 2003-01-30 電子材料用組成物、電子用品及び電子材料用組成物の使用方法 Expired - Lifetime JP4099761B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003021270A JP4099761B2 (ja) 2003-01-30 2003-01-30 電子材料用組成物、電子用品及び電子材料用組成物の使用方法
TW093102057A TW200504144A (en) 2003-01-30 2004-01-29 Electronic material composition, electronic product and method of using electronic material composition
CNB2004800032897A CN100430427C (zh) 2003-01-30 2004-01-29 电子材料组合物、电子用品及电子材料组合物的使用方法
KR1020057014115A KR100966938B1 (ko) 2003-01-30 2004-01-29 전자재료조성물, 전자용품 및 전자재료조성물의 사용방법
PCT/JP2004/000837 WO2004067600A1 (ja) 2003-01-30 2004-01-29 電子材料組成物、電子用品及び電子材料組成物の使用方法
US10/514,499 US20050167639A1 (en) 2003-01-30 2004-01-29 Electronic material composition, electronic product and method of using electronic material composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003021270A JP4099761B2 (ja) 2003-01-30 2003-01-30 電子材料用組成物、電子用品及び電子材料用組成物の使用方法

Publications (2)

Publication Number Publication Date
JP2004262956A JP2004262956A (ja) 2004-09-24
JP4099761B2 true JP4099761B2 (ja) 2008-06-11

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JP2003021270A Expired - Lifetime JP4099761B2 (ja) 2003-01-30 2003-01-30 電子材料用組成物、電子用品及び電子材料用組成物の使用方法

Country Status (6)

Country Link
US (1) US20050167639A1 (https=)
JP (1) JP4099761B2 (https=)
KR (1) KR100966938B1 (https=)
CN (1) CN100430427C (https=)
TW (1) TW200504144A (https=)
WO (1) WO2004067600A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4705377B2 (ja) * 2004-03-03 2011-06-22 ソニー株式会社 配線基板
JP2006124478A (ja) * 2004-10-27 2006-05-18 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
TW200743434A (en) * 2006-05-11 2007-11-16 Delta Electronics Inc Packaged electronic component for shielding electromagnetic interference
JP4883706B2 (ja) * 2007-08-10 2012-02-22 Ｎｅｃトーキン株式会社 線輪部品
JP5769549B2 (ja) * 2011-08-25 2015-08-26 太陽誘電株式会社 電子部品及びその製造方法
WO2013146251A1 (ja) * 2012-03-29 2013-10-03 株式会社村田製作所 コイル部品
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
JP2018098334A (ja) * 2016-12-13 2018-06-21 Tdk株式会社 コイル部品及びその製造方法、並びに、コイル部品を備えた電子回路
CN107541017A (zh) * 2017-09-01 2018-01-05 张峰 一种具有屏蔽辐射作用的封装材料及其制备方法和应用
JP6984755B2 (ja) * 2018-07-25 2021-12-22 味の素株式会社 磁性ペースト
KR102617523B1 (ko) * 2018-07-25 2023-12-27 아지노모토 가부시키가이샤 자성 페이스트
KR102184559B1 (ko) 2019-07-05 2020-12-01 삼성전기주식회사 코일 부품

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3427255A (en) * 1966-11-15 1969-02-11 Leslie C Case Fluid compositions from maleic anhydride and carboxyl-terminated compositions
JPS6055535B2 (ja) * 1977-07-19 1985-12-05 鐘淵化学工業株式会社 液状エポキン樹脂
US4878978A (en) * 1986-06-19 1989-11-07 Ashland Oil, Inc. Bonding method employing high performance induction curable two-component structural adhesive with nonsagging behavior
EP0384896A1 (de) * 1989-02-24 1990-08-29 Ciba-Geigy Ag Zähe Epoxidgiessharze
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5034473A (en) * 1989-08-17 1991-07-23 National Starch And Chemical Investment Holding Company Composition of polyepoxide derived from alkoxy-substituted allylphenol and carboxy-terminated polyester or polyamide
JP2603375B2 (ja) * 1991-03-29 1997-04-23 住友ベークライト株式会社 半導体用導電性樹脂ペースト
EP0556351B1 (en) * 1991-09-06 1995-06-21 AT&T Corp. SURFACE MOUNT ASSEMBLY OF DEVICES USING AdCon INTERCONNECTIONS
EP0859021A3 (en) * 1991-10-31 1998-11-11 Daicel Chemical Industries, Ltd. Epoxidised compositions
JP3941033B2 (ja) * 2000-05-29 2007-07-04 太陽誘電株式会社 電子材料用ポリサルファイド系硬化性樹脂材料、電子用品及び電子材料用ポリサルファイド系硬化性樹脂材料の使用方法
KR100611878B1 (ko) * 1999-06-30 2006-08-11 다이요 유덴 가부시키가이샤 전자재료 조성물, 전자 용품 및 전자재료 조성물의 사용방법
JP2001040070A (ja) * 1999-07-26 2001-02-13 Yokohama Rubber Co Ltd:The 一液型熱硬化性樹脂組成物
JP2001089638A (ja) * 1999-09-22 2001-04-03 Toshiba Chem Corp 液状封止用樹脂組成物
JP2002294035A (ja) * 2001-04-03 2002-10-09 Nippon Kayaku Co Ltd エポキシ樹脂組成物及び粉体塗料

Also Published As

Publication number Publication date
CN1745118A (zh) 2006-03-08
WO2004067600A1 (ja) 2004-08-12
KR100966938B1 (ko) 2010-06-30
KR20050096172A (ko) 2005-10-05
CN100430427C (zh) 2008-11-05
TW200504144A (en) 2005-02-01
US20050167639A1 (en) 2005-08-04
TWI323271B (https=) 2010-04-11
JP2004262956A (ja) 2004-09-24

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