CN100430427C - 电子材料组合物、电子用品及电子材料组合物的使用方法 - Google Patents

电子材料组合物、电子用品及电子材料组合物的使用方法 Download PDF

Info

Publication number
CN100430427C
CN100430427C CNB2004800032897A CN200480003289A CN100430427C CN 100430427 C CN100430427 C CN 100430427C CN B2004800032897 A CNB2004800032897 A CN B2004800032897A CN 200480003289 A CN200480003289 A CN 200480003289A CN 100430427 C CN100430427 C CN 100430427C
Authority
CN
China
Prior art keywords
electronic
material composition
electronic material
appliance
feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2004800032897A
Other languages
English (en)
Chinese (zh)
Other versions
CN1745118A (zh
Inventor
星尾拓郎
佐复高弘
和田幸一郎
小川秀树
石田茂
山田淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Sika Hamatite Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd, Yokohama Rubber Co Ltd filed Critical Taiyo Yuden Co Ltd
Publication of CN1745118A publication Critical patent/CN1745118A/zh
Application granted granted Critical
Publication of CN100430427C publication Critical patent/CN100430427C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CNB2004800032897A 2003-01-30 2004-01-29 电子材料组合物、电子用品及电子材料组合物的使用方法 Expired - Lifetime CN100430427C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003021270A JP4099761B2 (ja) 2003-01-30 2003-01-30 電子材料用組成物、電子用品及び電子材料用組成物の使用方法
JP21270/2003 2003-01-30

Publications (2)

Publication Number Publication Date
CN1745118A CN1745118A (zh) 2006-03-08
CN100430427C true CN100430427C (zh) 2008-11-05

Family

ID=32820653

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800032897A Expired - Lifetime CN100430427C (zh) 2003-01-30 2004-01-29 电子材料组合物、电子用品及电子材料组合物的使用方法

Country Status (6)

Country Link
US (1) US20050167639A1 (https=)
JP (1) JP4099761B2 (https=)
KR (1) KR100966938B1 (https=)
CN (1) CN100430427C (https=)
TW (1) TW200504144A (https=)
WO (1) WO2004067600A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4705377B2 (ja) * 2004-03-03 2011-06-22 ソニー株式会社 配線基板
JP2006124478A (ja) * 2004-10-27 2006-05-18 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
TW200743434A (en) * 2006-05-11 2007-11-16 Delta Electronics Inc Packaged electronic component for shielding electromagnetic interference
JP4883706B2 (ja) * 2007-08-10 2012-02-22 Ｎｅｃトーキン株式会社 線輪部品
JP5769549B2 (ja) * 2011-08-25 2015-08-26 太陽誘電株式会社 電子部品及びその製造方法
WO2013146251A1 (ja) * 2012-03-29 2013-10-03 株式会社村田製作所 コイル部品
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
JP2018098334A (ja) * 2016-12-13 2018-06-21 Tdk株式会社 コイル部品及びその製造方法、並びに、コイル部品を備えた電子回路
CN107541017A (zh) * 2017-09-01 2018-01-05 张峰 一种具有屏蔽辐射作用的封装材料及其制备方法和应用
JP6984755B2 (ja) * 2018-07-25 2021-12-22 味の素株式会社 磁性ペースト
KR102617523B1 (ko) * 2018-07-25 2023-12-27 아지노모토 가부시키가이샤 자성 페이스트
KR102184559B1 (ko) 2019-07-05 2020-12-01 삼성전기주식회사 코일 부품

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421498A (en) * 1977-07-19 1979-02-17 Kanegafuchi Chem Ind Co Ltd Liquid epoxy resin
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5034473A (en) * 1989-08-17 1991-07-23 National Starch And Chemical Investment Holding Company Composition of polyepoxide derived from alkoxy-substituted allylphenol and carboxy-terminated polyester or polyamide
US5140069A (en) * 1989-02-24 1992-08-18 Ciba-Geigy Corporation Tough epoxy casting resins based on polybutadiene-polyoxyalkleneglycol copolymers
JPH04303937A (ja) * 1991-03-29 1992-10-27 Sumitomo Bakelite Co Ltd 半導体用導電性樹脂ペースト
JP2001040070A (ja) * 1999-07-26 2001-02-13 Yokohama Rubber Co Ltd:The 一液型熱硬化性樹脂組成物
JP2001089638A (ja) * 1999-09-22 2001-04-03 Toshiba Chem Corp 液状封止用樹脂組成物
JP2001335689A (ja) * 2000-05-29 2001-12-04 Taiyo Yuden Co Ltd 電子材料用ポリサルファイド系硬化性樹脂組成物、電子用品及び電子材料用ポリサルファイド系硬化性樹脂組成物の使用方法
JP2002294035A (ja) * 2001-04-03 2002-10-09 Nippon Kayaku Co Ltd エポキシ樹脂組成物及び粉体塗料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3427255A (en) * 1966-11-15 1969-02-11 Leslie C Case Fluid compositions from maleic anhydride and carboxyl-terminated compositions
US4878978A (en) * 1986-06-19 1989-11-07 Ashland Oil, Inc. Bonding method employing high performance induction curable two-component structural adhesive with nonsagging behavior
EP0556351B1 (en) * 1991-09-06 1995-06-21 AT&T Corp. SURFACE MOUNT ASSEMBLY OF DEVICES USING AdCon INTERCONNECTIONS
EP0859021A3 (en) * 1991-10-31 1998-11-11 Daicel Chemical Industries, Ltd. Epoxidised compositions
KR100611878B1 (ko) * 1999-06-30 2006-08-11 다이요 유덴 가부시키가이샤 전자재료 조성물, 전자 용품 및 전자재료 조성물의 사용방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421498A (en) * 1977-07-19 1979-02-17 Kanegafuchi Chem Ind Co Ltd Liquid epoxy resin
US5140069A (en) * 1989-02-24 1992-08-18 Ciba-Geigy Corporation Tough epoxy casting resins based on polybutadiene-polyoxyalkleneglycol copolymers
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5034473A (en) * 1989-08-17 1991-07-23 National Starch And Chemical Investment Holding Company Composition of polyepoxide derived from alkoxy-substituted allylphenol and carboxy-terminated polyester or polyamide
JPH04303937A (ja) * 1991-03-29 1992-10-27 Sumitomo Bakelite Co Ltd 半導体用導電性樹脂ペースト
JP2001040070A (ja) * 1999-07-26 2001-02-13 Yokohama Rubber Co Ltd:The 一液型熱硬化性樹脂組成物
JP2001089638A (ja) * 1999-09-22 2001-04-03 Toshiba Chem Corp 液状封止用樹脂組成物
JP2001335689A (ja) * 2000-05-29 2001-12-04 Taiyo Yuden Co Ltd 電子材料用ポリサルファイド系硬化性樹脂組成物、電子用品及び電子材料用ポリサルファイド系硬化性樹脂組成物の使用方法
JP2002294035A (ja) * 2001-04-03 2002-10-09 Nippon Kayaku Co Ltd エポキシ樹脂組成物及び粉体塗料

Also Published As

Publication number Publication date
CN1745118A (zh) 2006-03-08
WO2004067600A1 (ja) 2004-08-12
KR100966938B1 (ko) 2010-06-30
KR20050096172A (ko) 2005-10-05
TW200504144A (en) 2005-02-01
US20050167639A1 (en) 2005-08-04
JP4099761B2 (ja) 2008-06-11
TWI323271B (https=) 2010-04-11
JP2004262956A (ja) 2004-09-24

Similar Documents

Publication Publication Date Title
CN100430427C (zh) 电子材料组合物、电子用品及电子材料组合物的使用方法
JP2001519838A (ja) エポキシシロキサン及びポリエポキシ樹脂のダイス接着剤又はカプセル材
JP3947296B2 (ja) シート状封止材料およびそれを用いた半導体装置の製法
JP4493929B2 (ja) 電子部品被覆用接着性フィルム
JP3911088B2 (ja) 半導体装置
JP2001207031A (ja) 半導体封止用樹脂組成物及び半導体装置
JP4899926B2 (ja) 液状エポキシ樹脂組成物
JPS6351447B2 (https=)
JP2000044774A (ja) 半導体封止用エポキシ樹脂組成物および半導体装置
JP2003268205A (ja) エポキシ系樹脂組成物およびそれを用いた半導体装置
JPH11335527A (ja) 半導体封止用エポキシ樹脂組成物
JPH05267371A (ja) 樹脂封止型半導体装置
JP2008085264A (ja) 半導体装置
JPH04320359A (ja) 半導体装置
JP2002144331A (ja) エポキシ樹脂組成物タブレットの製造方法およびそのタブレットを用いて得られる半導体装置
JP2005072399A (ja) アルミ電解コンデンサ装置およびアルミ電解コンデンサ封止用エポキシ樹脂封止材
JP2002003704A (ja) 封止用樹脂組成物および半導体封止装置
JP2002275246A (ja) エポキシ系樹脂組成物および半導体装置
JP2001114984A (ja) 封止用樹脂組成物および半導体封止装置
JP2003252961A (ja) エポキシ系樹脂組成物およびそれを用いた半導体装置
JPS62246920A (ja) 半導体封止用エポキシ樹脂組成物
JPH0977850A (ja) エポキシ樹脂組成物および樹脂封止型半導体装置
JP2002284965A (ja) エポキシ系樹脂組成物およびそれを用いた半導体装置
JP2002284961A (ja) エポキシ系樹脂組成物およびそれを用いた半導体装置
JPH02173155A (ja) 半導体封止用エポキシ含有組成物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20211214

Address after: Tokyo

Patentee after: TAIYO YUDEN Co.,Ltd.

Patentee after: Sika haumatete Co.,Ltd.

Address before: Tokyo

Patentee before: TAIYO YUDEN Co.,Ltd.

Patentee before: KYORAKU CO.,LTD.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20081105