TWI323271B - - Google Patents

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Publication number
TWI323271B
TWI323271B TW093102057A TW93102057A TWI323271B TW I323271 B TWI323271 B TW I323271B TW 093102057 A TW093102057 A TW 093102057A TW 93102057 A TW93102057 A TW 93102057A TW I323271 B TWI323271 B TW I323271B
Authority
TW
Taiwan
Prior art keywords
electronic
composition
electronic material
epoxy
resin
Prior art date
Application number
TW093102057A
Other languages
English (en)
Chinese (zh)
Other versions
TW200504144A (en
Inventor
Takuro Hoshio
Takahiro Samata
Koichiro Wada
Hideki Ogawa
Shigeru Ishida
Atsushi Yamada
Original Assignee
Taiyo Yuden Kk
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Kk, Yokohama Rubber Co Ltd filed Critical Taiyo Yuden Kk
Publication of TW200504144A publication Critical patent/TW200504144A/zh
Application granted granted Critical
Publication of TWI323271B publication Critical patent/TWI323271B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW093102057A 2003-01-30 2004-01-29 Electronic material composition, electronic product and method of using electronic material composition TW200504144A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003021270A JP4099761B2 (ja) 2003-01-30 2003-01-30 電子材料用組成物、電子用品及び電子材料用組成物の使用方法

Publications (2)

Publication Number Publication Date
TW200504144A TW200504144A (en) 2005-02-01
TWI323271B true TWI323271B (https=) 2010-04-11

Family

ID=32820653

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102057A TW200504144A (en) 2003-01-30 2004-01-29 Electronic material composition, electronic product and method of using electronic material composition

Country Status (6)

Country Link
US (1) US20050167639A1 (https=)
JP (1) JP4099761B2 (https=)
KR (1) KR100966938B1 (https=)
CN (1) CN100430427C (https=)
TW (1) TW200504144A (https=)
WO (1) WO2004067600A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4705377B2 (ja) * 2004-03-03 2011-06-22 ソニー株式会社 配線基板
JP2006124478A (ja) * 2004-10-27 2006-05-18 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
TW200743434A (en) * 2006-05-11 2007-11-16 Delta Electronics Inc Packaged electronic component for shielding electromagnetic interference
JP4883706B2 (ja) * 2007-08-10 2012-02-22 Ｎｅｃトーキン株式会社 線輪部品
JP5769549B2 (ja) * 2011-08-25 2015-08-26 太陽誘電株式会社 電子部品及びその製造方法
WO2013146251A1 (ja) * 2012-03-29 2013-10-03 株式会社村田製作所 コイル部品
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
JP2018098334A (ja) * 2016-12-13 2018-06-21 Tdk株式会社 コイル部品及びその製造方法、並びに、コイル部品を備えた電子回路
CN107541017A (zh) * 2017-09-01 2018-01-05 张峰 一种具有屏蔽辐射作用的封装材料及其制备方法和应用
JP6984755B2 (ja) * 2018-07-25 2021-12-22 味の素株式会社 磁性ペースト
KR102617523B1 (ko) * 2018-07-25 2023-12-27 아지노모토 가부시키가이샤 자성 페이스트
KR102184559B1 (ko) 2019-07-05 2020-12-01 삼성전기주식회사 코일 부품

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3427255A (en) * 1966-11-15 1969-02-11 Leslie C Case Fluid compositions from maleic anhydride and carboxyl-terminated compositions
JPS6055535B2 (ja) * 1977-07-19 1985-12-05 鐘淵化学工業株式会社 液状エポキン樹脂
US4878978A (en) * 1986-06-19 1989-11-07 Ashland Oil, Inc. Bonding method employing high performance induction curable two-component structural adhesive with nonsagging behavior
EP0384896A1 (de) * 1989-02-24 1990-08-29 Ciba-Geigy Ag Zähe Epoxidgiessharze
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5034473A (en) * 1989-08-17 1991-07-23 National Starch And Chemical Investment Holding Company Composition of polyepoxide derived from alkoxy-substituted allylphenol and carboxy-terminated polyester or polyamide
JP2603375B2 (ja) * 1991-03-29 1997-04-23 住友ベークライト株式会社 半導体用導電性樹脂ペースト
EP0556351B1 (en) * 1991-09-06 1995-06-21 AT&T Corp. SURFACE MOUNT ASSEMBLY OF DEVICES USING AdCon INTERCONNECTIONS
EP0859021A3 (en) * 1991-10-31 1998-11-11 Daicel Chemical Industries, Ltd. Epoxidised compositions
JP3941033B2 (ja) * 2000-05-29 2007-07-04 太陽誘電株式会社 電子材料用ポリサルファイド系硬化性樹脂材料、電子用品及び電子材料用ポリサルファイド系硬化性樹脂材料の使用方法
KR100611878B1 (ko) * 1999-06-30 2006-08-11 다이요 유덴 가부시키가이샤 전자재료 조성물, 전자 용품 및 전자재료 조성물의 사용방법
JP2001040070A (ja) * 1999-07-26 2001-02-13 Yokohama Rubber Co Ltd:The 一液型熱硬化性樹脂組成物
JP2001089638A (ja) * 1999-09-22 2001-04-03 Toshiba Chem Corp 液状封止用樹脂組成物
JP2002294035A (ja) * 2001-04-03 2002-10-09 Nippon Kayaku Co Ltd エポキシ樹脂組成物及び粉体塗料

Also Published As

Publication number Publication date
CN1745118A (zh) 2006-03-08
WO2004067600A1 (ja) 2004-08-12
KR100966938B1 (ko) 2010-06-30
KR20050096172A (ko) 2005-10-05
CN100430427C (zh) 2008-11-05
TW200504144A (en) 2005-02-01
US20050167639A1 (en) 2005-08-04
JP4099761B2 (ja) 2008-06-11
JP2004262956A (ja) 2004-09-24

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