KR100966938B1 - 전자재료조성물, 전자용품 및 전자재료조성물의 사용방법 - Google Patents

전자재료조성물, 전자용품 및 전자재료조성물의 사용방법 Download PDF

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KR100966938B1
KR100966938B1 KR1020057014115A KR20057014115A KR100966938B1 KR 100966938 B1 KR100966938 B1 KR 100966938B1 KR 1020057014115 A KR1020057014115 A KR 1020057014115A KR 20057014115 A KR20057014115 A KR 20057014115A KR 100966938 B1 KR100966938 B1 KR 100966938B1
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electronic
composition
cured
semi
article
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Korean (ko)
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KR20050096172A (ko
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다쿠로 호시오
다카히로 사마타
고이치로 와다
히데키 오가와
시게루 이시다
아쓰시 야마다
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다이요 유덴 가부시키가이샤
요코하마 고무 가부시키가이샤
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Publication of KR20050096172A publication Critical patent/KR20050096172A/ko
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Assigned to 시카 · 하마타이토 가부시키가이샤 reassignment 시카 · 하마타이토 가부시키가이샤 권리지분의 전부이전등록 Assignors: 요코하마 고무 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020057014115A 2003-01-30 2004-01-29 전자재료조성물, 전자용품 및 전자재료조성물의 사용방법 Expired - Lifetime KR100966938B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003021270A JP4099761B2 (ja) 2003-01-30 2003-01-30 電子材料用組成物、電子用品及び電子材料用組成物の使用方法
JPJP-P-2003-00021270 2003-01-30

Publications (2)

Publication Number Publication Date
KR20050096172A KR20050096172A (ko) 2005-10-05
KR100966938B1 true KR100966938B1 (ko) 2010-06-30

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KR1020057014115A Expired - Lifetime KR100966938B1 (ko) 2003-01-30 2004-01-29 전자재료조성물, 전자용품 및 전자재료조성물의 사용방법

Country Status (6)

Country Link
US (1) US20050167639A1 (https=)
JP (1) JP4099761B2 (https=)
KR (1) KR100966938B1 (https=)
CN (1) CN100430427C (https=)
TW (1) TW200504144A (https=)
WO (1) WO2004067600A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4705377B2 (ja) * 2004-03-03 2011-06-22 ソニー株式会社 配線基板
JP2006124478A (ja) * 2004-10-27 2006-05-18 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
TW200743434A (en) * 2006-05-11 2007-11-16 Delta Electronics Inc Packaged electronic component for shielding electromagnetic interference
JP4883706B2 (ja) * 2007-08-10 2012-02-22 Ｎｅｃトーキン株式会社 線輪部品
JP5769549B2 (ja) * 2011-08-25 2015-08-26 太陽誘電株式会社 電子部品及びその製造方法
WO2013146251A1 (ja) * 2012-03-29 2013-10-03 株式会社村田製作所 コイル部品
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
JP2018098334A (ja) * 2016-12-13 2018-06-21 Tdk株式会社 コイル部品及びその製造方法、並びに、コイル部品を備えた電子回路
CN107541017A (zh) * 2017-09-01 2018-01-05 张峰 一种具有屏蔽辐射作用的封装材料及其制备方法和应用
JP6984755B2 (ja) * 2018-07-25 2021-12-22 味の素株式会社 磁性ペースト
KR102617523B1 (ko) * 2018-07-25 2023-12-27 아지노모토 가부시키가이샤 자성 페이스트
KR102184559B1 (ko) 2019-07-05 2020-12-01 삼성전기주식회사 코일 부품

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02248423A (ja) * 1989-02-24 1990-10-04 Ciba Geigy Ag 強靭なエポキシ注型用樹脂
JPH03106927A (ja) * 1989-08-17 1991-05-07 Natl Starch & Chem Investment Holding Corp 改良された靭性を有する改質されたエポキシ配合物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3427255A (en) * 1966-11-15 1969-02-11 Leslie C Case Fluid compositions from maleic anhydride and carboxyl-terminated compositions
JPS6055535B2 (ja) * 1977-07-19 1985-12-05 鐘淵化学工業株式会社 液状エポキン樹脂
US4878978A (en) * 1986-06-19 1989-11-07 Ashland Oil, Inc. Bonding method employing high performance induction curable two-component structural adhesive with nonsagging behavior
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
JP2603375B2 (ja) * 1991-03-29 1997-04-23 住友ベークライト株式会社 半導体用導電性樹脂ペースト
EP0556351B1 (en) * 1991-09-06 1995-06-21 AT&T Corp. SURFACE MOUNT ASSEMBLY OF DEVICES USING AdCon INTERCONNECTIONS
EP0859021A3 (en) * 1991-10-31 1998-11-11 Daicel Chemical Industries, Ltd. Epoxidised compositions
JP3941033B2 (ja) * 2000-05-29 2007-07-04 太陽誘電株式会社 電子材料用ポリサルファイド系硬化性樹脂材料、電子用品及び電子材料用ポリサルファイド系硬化性樹脂材料の使用方法
KR100611878B1 (ko) * 1999-06-30 2006-08-11 다이요 유덴 가부시키가이샤 전자재료 조성물, 전자 용품 및 전자재료 조성물의 사용방법
JP2001040070A (ja) * 1999-07-26 2001-02-13 Yokohama Rubber Co Ltd:The 一液型熱硬化性樹脂組成物
JP2001089638A (ja) * 1999-09-22 2001-04-03 Toshiba Chem Corp 液状封止用樹脂組成物
JP2002294035A (ja) * 2001-04-03 2002-10-09 Nippon Kayaku Co Ltd エポキシ樹脂組成物及び粉体塗料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02248423A (ja) * 1989-02-24 1990-10-04 Ciba Geigy Ag 強靭なエポキシ注型用樹脂
JPH03106927A (ja) * 1989-08-17 1991-05-07 Natl Starch & Chem Investment Holding Corp 改良された靭性を有する改質されたエポキシ配合物

Also Published As

Publication number Publication date
CN1745118A (zh) 2006-03-08
WO2004067600A1 (ja) 2004-08-12
KR20050096172A (ko) 2005-10-05
CN100430427C (zh) 2008-11-05
TW200504144A (en) 2005-02-01
US20050167639A1 (en) 2005-08-04
JP4099761B2 (ja) 2008-06-11
TWI323271B (https=) 2010-04-11
JP2004262956A (ja) 2004-09-24

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