JP4077141B2 - デザインルール作成方法、デザインルール作成システム及び記録媒体 - Google Patents

デザインルール作成方法、デザインルール作成システム及び記録媒体 Download PDF

Info

Publication number
JP4077141B2
JP4077141B2 JP2000199839A JP2000199839A JP4077141B2 JP 4077141 B2 JP4077141 B2 JP 4077141B2 JP 2000199839 A JP2000199839 A JP 2000199839A JP 2000199839 A JP2000199839 A JP 2000199839A JP 4077141 B2 JP4077141 B2 JP 4077141B2
Authority
JP
Japan
Prior art keywords
design rule
design
layout
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000199839A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002026126A5 (https=
JP2002026126A (ja
Inventor
敏也 小谷
聡 田中
壮一 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2000199839A priority Critical patent/JP4077141B2/ja
Priority to US09/892,572 priority patent/US6507931B2/en
Priority to TW090115957A priority patent/TW516077B/zh
Priority to KR10-2001-0038245A priority patent/KR100437980B1/ko
Publication of JP2002026126A publication Critical patent/JP2002026126A/ja
Priority to US10/819,338 priority patent/USRE42294E1/en
Publication of JP2002026126A5 publication Critical patent/JP2002026126A5/ja
Priority to US11/905,862 priority patent/USRE42302E1/en
Application granted granted Critical
Publication of JP4077141B2 publication Critical patent/JP4077141B2/ja
Priority to US12/945,672 priority patent/USRE43659E1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2000199839A 2000-06-30 2000-06-30 デザインルール作成方法、デザインルール作成システム及び記録媒体 Expired - Lifetime JP4077141B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2000199839A JP4077141B2 (ja) 2000-06-30 2000-06-30 デザインルール作成方法、デザインルール作成システム及び記録媒体
US09/892,572 US6507931B2 (en) 2000-06-30 2001-06-28 Semiconductor integrated circuit designing method and system
KR10-2001-0038245A KR100437980B1 (ko) 2000-06-30 2001-06-29 디자인 룰 작성 방법, 디자인 룰 작성 시스템 및 기록 매체
TW090115957A TW516077B (en) 2000-06-30 2001-06-29 Method of creating design rule, design rule creating system, and recording medium
US10/819,338 USRE42294E1 (en) 2000-06-30 2004-04-07 Semiconductor integrated circuit designing method and system using a design rule modification
US11/905,862 USRE42302E1 (en) 2000-06-30 2007-10-04 Method for making a design layout and mask
US12/945,672 USRE43659E1 (en) 2000-06-30 2010-11-12 Method for making a design layout of a semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000199839A JP4077141B2 (ja) 2000-06-30 2000-06-30 デザインルール作成方法、デザインルール作成システム及び記録媒体

Publications (3)

Publication Number Publication Date
JP2002026126A JP2002026126A (ja) 2002-01-25
JP2002026126A5 JP2002026126A5 (https=) 2005-07-07
JP4077141B2 true JP4077141B2 (ja) 2008-04-16

Family

ID=18697788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000199839A Expired - Lifetime JP4077141B2 (ja) 2000-06-30 2000-06-30 デザインルール作成方法、デザインルール作成システム及び記録媒体

Country Status (4)

Country Link
US (4) US6507931B2 (https=)
JP (1) JP4077141B2 (https=)
KR (1) KR100437980B1 (https=)
TW (1) TW516077B (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4077141B2 (ja) * 2000-06-30 2008-04-16 株式会社東芝 デザインルール作成方法、デザインルール作成システム及び記録媒体
JP2002368093A (ja) * 2001-06-12 2002-12-20 Mitsubishi Electric Corp レイアウト生成装置、レイアウト生成方法およびプログラム
TWI252516B (en) 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule
JP2003345854A (ja) * 2002-05-23 2003-12-05 Mitsubishi Electric Corp デザインルール作成システム
US7117456B2 (en) * 2003-12-03 2006-10-03 International Business Machines Corporation Circuit area minimization using scaling
JP2005181523A (ja) 2003-12-17 2005-07-07 Toshiba Corp 設計パターン補正方法、マスクパターン作成方法、半導体装置の製造方法、設計パターン補正システム、及び設計パターン補正プログラム
JP4488727B2 (ja) 2003-12-17 2010-06-23 株式会社東芝 設計レイアウト作成方法、設計レイアウト作成システム、マスクの製造方法、半導体装置の製造方法、及び設計レイアウト作成プログラム
JP4357287B2 (ja) 2003-12-18 2009-11-04 株式会社東芝 修正指針の発生方法、パターン作成方法、マスクの製造方法、半導体装置の製造方法及びプログラム
WO2005098686A2 (en) * 2004-04-02 2005-10-20 Clear Shape Technologies, Inc. Modeling resolution enhancement processes in integrated circuit fabrication
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
JP2006053248A (ja) * 2004-08-10 2006-02-23 Toshiba Corp 設計パターンデータ作成方法、マスクパターンデータ作成方法、マスク製造方法、半導体装置の方法およびプログラム
JP2006075884A (ja) 2004-09-10 2006-03-23 Nippon Steel Corp プレス成形加工システム、プレス成形加工方法、及びコンピュータプログラム
JP4817746B2 (ja) * 2005-07-27 2011-11-16 株式会社東芝 半導体装置の設計データ処理方法、そのプログラム、及び半導体装置の製造方法
US20070074142A1 (en) * 2005-09-27 2007-03-29 Applied Materials, Inc. Integrated circuit layout methods
US7934184B2 (en) * 2005-11-14 2011-04-26 Takumi Technology Corporation Integrated circuit design using modified cells
US7568179B1 (en) 2006-09-21 2009-07-28 Armen Kroyan Layout printability optimization method and system
JP4745256B2 (ja) 2007-01-26 2011-08-10 株式会社東芝 パターン作成方法、パターン作成・検証プログラム、および半導体装置の製造方法
US8010912B2 (en) * 2007-03-09 2011-08-30 Broadcom Corporation Method of shrinking semiconductor mask features for process improvement
JP4891817B2 (ja) * 2007-03-16 2012-03-07 株式会社日立製作所 設計ルール管理方法、設計ルール管理プログラム、ルール構築装置およびルールチェック装置
KR100898232B1 (ko) * 2007-09-03 2009-05-18 주식회사 동부하이텍 축소과정에서의 패턴 설계 방법
JP5194770B2 (ja) * 2007-12-20 2013-05-08 富士通セミコンダクター株式会社 半導体装置の製造方法及びそのプログラム
JP2009290150A (ja) * 2008-06-02 2009-12-10 Renesas Technology Corp 半導体装置の製造システムおよび製造方法
US8214771B2 (en) * 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
KR101044295B1 (ko) * 2010-01-07 2011-06-28 주식회사 엔타시스 자동화된 칩 면적 최적화를 위한 블록 패킹방법 및 표준 셀 패킹 방법
US20150067621A1 (en) * 2012-09-05 2015-03-05 Mentor Graphics Corporation Logic-Driven Layout Pattern Analysis
KR102227127B1 (ko) 2014-02-12 2021-03-12 삼성전자주식회사 리소그래피 시뮬레이션을 이용한 디자인룰 생성 장치 및 방법
US10628544B2 (en) 2017-09-25 2020-04-21 International Business Machines Corporation Optimizing integrated circuit designs based on interactions between multiple integration design rules
US11023648B2 (en) 2017-12-12 2021-06-01 Siemens Industry Software Inc. Puzzle-based pattern analysis and classification
KR102755274B1 (ko) 2024-07-05 2025-01-22 최병렬 압축기와 반응기와 촉매제 기반 에틸렌과 프로판과 고분자 재료 혼합 복합 생산 시스템 및 그 운용방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2838834B2 (ja) 1989-09-22 1998-12-16 富士通株式会社 自動設計システムのパターン間隔縮小方法
EP0548391B1 (de) 1991-12-21 1997-07-23 Deutsche ITT Industries GmbH Offsetkompensierter Hallsensor
US5416722A (en) 1992-11-19 1995-05-16 Vlsi Technology, Inc. System and method for compacting integrated circuit layouts
US5682323A (en) * 1995-03-06 1997-10-28 Lsi Logic Corporation System and method for performing optical proximity correction on macrocell libraries
KR0172558B1 (ko) 1995-03-22 1999-03-20 김주용 노광 마스크의 제조방법
JPH08287959A (ja) 1995-04-11 1996-11-01 Hitachi Ltd 充電装置
JP3934719B2 (ja) * 1995-12-22 2007-06-20 株式会社東芝 光近接効果補正方法
US5984510A (en) 1996-11-01 1999-11-16 Motorola Inc. Automatic synthesis of standard cell layouts
US6209123B1 (en) * 1996-11-01 2001-03-27 Motorola, Inc. Methods of placing transistors in a circuit layout and semiconductor device with automatically placed transistors
US6006024A (en) * 1996-11-01 1999-12-21 Motorola, Inc. Method of routing an integrated circuit
US6470489B1 (en) * 1997-09-17 2002-10-22 Numerical Technologies, Inc. Design rule checking system and method
JP4076644B2 (ja) 1997-12-05 2008-04-16 株式会社ルネサステクノロジ パターン歪検出装置及び検出方法
US6081658A (en) * 1997-12-31 2000-06-27 Avant! Corporation Proximity correction system for wafer lithography
US6691297B1 (en) * 1999-03-04 2004-02-10 Matsushita Electric Industrial Co., Ltd. Method for planning layout for LSI pattern, method for forming LSI pattern and method for generating mask data for LSI
JP3892205B2 (ja) 2000-04-14 2007-03-14 松下電器産業株式会社 レイアウトコンパクション方法
JP4077141B2 (ja) * 2000-06-30 2008-04-16 株式会社東芝 デザインルール作成方法、デザインルール作成システム及び記録媒体
US6578190B2 (en) * 2001-01-11 2003-06-10 International Business Machines Corporation Process window based optical proximity correction of lithographic images
TWI252516B (en) * 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule

Also Published As

Publication number Publication date
USRE43659E1 (en) 2012-09-11
USRE42302E1 (en) 2011-04-19
KR100437980B1 (ko) 2004-07-02
US20020002697A1 (en) 2002-01-03
TW516077B (en) 2003-01-01
USRE42294E1 (en) 2011-04-12
US6507931B2 (en) 2003-01-14
JP2002026126A (ja) 2002-01-25
KR20020002323A (ko) 2002-01-09

Similar Documents

Publication Publication Date Title
JP4077141B2 (ja) デザインルール作成方法、デザインルール作成システム及び記録媒体
US7155689B2 (en) Design-manufacturing interface via a unified model
US7103870B2 (en) Method for planning layout for LSI pattern, method for forming LSI pattern and method for generating mask data for LSI
CN100392662C (zh) 设计布局及掩膜的制作方法和系统、半导体器件的制造方法
CN101288080B (zh) 设计掩模版图的方法、系统及传递光刻工艺设计参数的方法
US7526748B2 (en) Design pattern data preparing method, mask pattern data preparing method, mask manufacturing method, semiconductor device manufacturing method, and program recording medium
CN116710843B (zh) 用于自由形状的光学邻近校正
JP2011514654A (ja) 半導体パターン形成作業に対する均一性の改善
JP2005181523A (ja) 設計パターン補正方法、マスクパターン作成方法、半導体装置の製造方法、設計パターン補正システム、及び設計パターン補正プログラム
JP2003303742A (ja) プロセスパラメータの作成方法、プロセスパラメータの作成システム及び半導体装置の製造方法
JP4195825B2 (ja) プロセスパラメータまたはデザインルールとプロセスパラメータとの両方を決定する方法、半導体集積回路装置の製造方法、プロセスパラメータまたはデザインルールとプロセスパラメータとの両方を決定するシステム、および、プログラム
JP2004163472A (ja) フォトマスクの設計方法、フォトマスク、及び半導体装置
JP3286225B2 (ja) パターン設計方法
US12541631B2 (en) Free-form layout feature retargeting
JPH10239826A (ja) フォトマスクパターン設計装置およびフォトマスクパターン設計方法
JP4299853B2 (ja) 集積回路フィーチャを形成するための方法およびプログラム
JP2010135638A (ja) 電子線露光方法
CN222966132U (zh) 半导体装置
KR100834234B1 (ko) 반도체 장치 제조용 마스크 패턴 결정 방법
Pikus Decomposition technologies for advanced nodes
JPH1079332A (ja) 集積回路用パタンレイアウト生成方法、集積回路用パタンレイアウト生成装置及び回路パタン形成方法
JP2007199234A (ja) フォトマスクの設計方法及び設計装置
Pal A new approach in design for manufacturing for nanoscale VLSI circuits
JP2000138159A (ja) マスクパターン作成方法および装置
JPH10173056A (ja) 半導体装置の設計方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041028

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041028

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20051122

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080129

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080131

R151 Written notification of patent or utility model registration

Ref document number: 4077141

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110208

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120208

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120208

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130208

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140208

Year of fee payment: 6

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term