KR100437980B1 - 디자인 룰 작성 방법, 디자인 룰 작성 시스템 및 기록 매체 - Google Patents

디자인 룰 작성 방법, 디자인 룰 작성 시스템 및 기록 매체 Download PDF

Info

Publication number
KR100437980B1
KR100437980B1 KR10-2001-0038245A KR20010038245A KR100437980B1 KR 100437980 B1 KR100437980 B1 KR 100437980B1 KR 20010038245 A KR20010038245 A KR 20010038245A KR 100437980 B1 KR100437980 B1 KR 100437980B1
Authority
KR
South Korea
Prior art keywords
design rule
design
compaction
prediction
compacted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2001-0038245A
Other languages
English (en)
Korean (ko)
Other versions
KR20020002323A (ko
Inventor
고따니도시야
다나까사또시
이노우에소이찌
Original Assignee
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20020002323A publication Critical patent/KR20020002323A/ko
Application granted granted Critical
Publication of KR100437980B1 publication Critical patent/KR100437980B1/ko
Assigned to 도시바 메모리 가부시키가이샤 reassignment 도시바 메모리 가부시키가이샤 권리의 전부이전등록 Assignors: 가부시끼가이샤 도시바
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
KR10-2001-0038245A 2000-06-30 2001-06-29 디자인 룰 작성 방법, 디자인 룰 작성 시스템 및 기록 매체 Expired - Fee Related KR100437980B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-199839 2000-06-30
JP2000199839A JP4077141B2 (ja) 2000-06-30 2000-06-30 デザインルール作成方法、デザインルール作成システム及び記録媒体

Publications (2)

Publication Number Publication Date
KR20020002323A KR20020002323A (ko) 2002-01-09
KR100437980B1 true KR100437980B1 (ko) 2004-07-02

Family

ID=18697788

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-0038245A Expired - Fee Related KR100437980B1 (ko) 2000-06-30 2001-06-29 디자인 룰 작성 방법, 디자인 룰 작성 시스템 및 기록 매체

Country Status (4)

Country Link
US (4) US6507931B2 (https=)
JP (1) JP4077141B2 (https=)
KR (1) KR100437980B1 (https=)
TW (1) TW516077B (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4077141B2 (ja) * 2000-06-30 2008-04-16 株式会社東芝 デザインルール作成方法、デザインルール作成システム及び記録媒体
JP2002368093A (ja) * 2001-06-12 2002-12-20 Mitsubishi Electric Corp レイアウト生成装置、レイアウト生成方法およびプログラム
TWI252516B (en) 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule
JP2003345854A (ja) * 2002-05-23 2003-12-05 Mitsubishi Electric Corp デザインルール作成システム
US7117456B2 (en) * 2003-12-03 2006-10-03 International Business Machines Corporation Circuit area minimization using scaling
JP2005181523A (ja) 2003-12-17 2005-07-07 Toshiba Corp 設計パターン補正方法、マスクパターン作成方法、半導体装置の製造方法、設計パターン補正システム、及び設計パターン補正プログラム
JP4488727B2 (ja) 2003-12-17 2010-06-23 株式会社東芝 設計レイアウト作成方法、設計レイアウト作成システム、マスクの製造方法、半導体装置の製造方法、及び設計レイアウト作成プログラム
JP4357287B2 (ja) 2003-12-18 2009-11-04 株式会社東芝 修正指針の発生方法、パターン作成方法、マスクの製造方法、半導体装置の製造方法及びプログラム
WO2005098686A2 (en) * 2004-04-02 2005-10-20 Clear Shape Technologies, Inc. Modeling resolution enhancement processes in integrated circuit fabrication
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
JP2006053248A (ja) * 2004-08-10 2006-02-23 Toshiba Corp 設計パターンデータ作成方法、マスクパターンデータ作成方法、マスク製造方法、半導体装置の方法およびプログラム
JP2006075884A (ja) 2004-09-10 2006-03-23 Nippon Steel Corp プレス成形加工システム、プレス成形加工方法、及びコンピュータプログラム
JP4817746B2 (ja) * 2005-07-27 2011-11-16 株式会社東芝 半導体装置の設計データ処理方法、そのプログラム、及び半導体装置の製造方法
US20070074142A1 (en) * 2005-09-27 2007-03-29 Applied Materials, Inc. Integrated circuit layout methods
US7934184B2 (en) * 2005-11-14 2011-04-26 Takumi Technology Corporation Integrated circuit design using modified cells
US7568179B1 (en) 2006-09-21 2009-07-28 Armen Kroyan Layout printability optimization method and system
JP4745256B2 (ja) 2007-01-26 2011-08-10 株式会社東芝 パターン作成方法、パターン作成・検証プログラム、および半導体装置の製造方法
US8010912B2 (en) * 2007-03-09 2011-08-30 Broadcom Corporation Method of shrinking semiconductor mask features for process improvement
JP4891817B2 (ja) * 2007-03-16 2012-03-07 株式会社日立製作所 設計ルール管理方法、設計ルール管理プログラム、ルール構築装置およびルールチェック装置
KR100898232B1 (ko) * 2007-09-03 2009-05-18 주식회사 동부하이텍 축소과정에서의 패턴 설계 방법
JP5194770B2 (ja) * 2007-12-20 2013-05-08 富士通セミコンダクター株式会社 半導体装置の製造方法及びそのプログラム
JP2009290150A (ja) * 2008-06-02 2009-12-10 Renesas Technology Corp 半導体装置の製造システムおよび製造方法
US8214771B2 (en) * 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
KR101044295B1 (ko) * 2010-01-07 2011-06-28 주식회사 엔타시스 자동화된 칩 면적 최적화를 위한 블록 패킹방법 및 표준 셀 패킹 방법
US20150067621A1 (en) * 2012-09-05 2015-03-05 Mentor Graphics Corporation Logic-Driven Layout Pattern Analysis
KR102227127B1 (ko) 2014-02-12 2021-03-12 삼성전자주식회사 리소그래피 시뮬레이션을 이용한 디자인룰 생성 장치 및 방법
US10628544B2 (en) 2017-09-25 2020-04-21 International Business Machines Corporation Optimizing integrated circuit designs based on interactions between multiple integration design rules
US11023648B2 (en) 2017-12-12 2021-06-01 Siemens Industry Software Inc. Puzzle-based pattern analysis and classification
KR102755274B1 (ko) 2024-07-05 2025-01-22 최병렬 압축기와 반응기와 촉매제 기반 에틸렌과 프로판과 고분자 재료 혼합 복합 생산 시스템 및 그 운용방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960035135A (ko) * 1995-03-22 1996-10-24 김주용 노광마스크의 제조방법
KR19990062811A (ko) * 1997-12-05 1999-07-26 다니구찌 이찌로오, 기타오카 다카시 패턴왜곡 검출장치 및 검출방법과 프로그램 기록매체

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2838834B2 (ja) 1989-09-22 1998-12-16 富士通株式会社 自動設計システムのパターン間隔縮小方法
EP0548391B1 (de) 1991-12-21 1997-07-23 Deutsche ITT Industries GmbH Offsetkompensierter Hallsensor
US5416722A (en) 1992-11-19 1995-05-16 Vlsi Technology, Inc. System and method for compacting integrated circuit layouts
US5682323A (en) * 1995-03-06 1997-10-28 Lsi Logic Corporation System and method for performing optical proximity correction on macrocell libraries
JPH08287959A (ja) 1995-04-11 1996-11-01 Hitachi Ltd 充電装置
JP3934719B2 (ja) * 1995-12-22 2007-06-20 株式会社東芝 光近接効果補正方法
US5984510A (en) 1996-11-01 1999-11-16 Motorola Inc. Automatic synthesis of standard cell layouts
US6209123B1 (en) * 1996-11-01 2001-03-27 Motorola, Inc. Methods of placing transistors in a circuit layout and semiconductor device with automatically placed transistors
US6006024A (en) * 1996-11-01 1999-12-21 Motorola, Inc. Method of routing an integrated circuit
US6470489B1 (en) * 1997-09-17 2002-10-22 Numerical Technologies, Inc. Design rule checking system and method
US6081658A (en) * 1997-12-31 2000-06-27 Avant! Corporation Proximity correction system for wafer lithography
US6691297B1 (en) * 1999-03-04 2004-02-10 Matsushita Electric Industrial Co., Ltd. Method for planning layout for LSI pattern, method for forming LSI pattern and method for generating mask data for LSI
JP3892205B2 (ja) 2000-04-14 2007-03-14 松下電器産業株式会社 レイアウトコンパクション方法
JP4077141B2 (ja) * 2000-06-30 2008-04-16 株式会社東芝 デザインルール作成方法、デザインルール作成システム及び記録媒体
US6578190B2 (en) * 2001-01-11 2003-06-10 International Business Machines Corporation Process window based optical proximity correction of lithographic images
TWI252516B (en) * 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960035135A (ko) * 1995-03-22 1996-10-24 김주용 노광마스크의 제조방법
KR19990062811A (ko) * 1997-12-05 1999-07-26 다니구찌 이찌로오, 기타오카 다카시 패턴왜곡 검출장치 및 검출방법과 프로그램 기록매체

Also Published As

Publication number Publication date
USRE43659E1 (en) 2012-09-11
USRE42302E1 (en) 2011-04-19
JP4077141B2 (ja) 2008-04-16
US20020002697A1 (en) 2002-01-03
TW516077B (en) 2003-01-01
USRE42294E1 (en) 2011-04-12
US6507931B2 (en) 2003-01-14
JP2002026126A (ja) 2002-01-25
KR20020002323A (ko) 2002-01-09

Similar Documents

Publication Publication Date Title
KR100437980B1 (ko) 디자인 룰 작성 방법, 디자인 룰 작성 시스템 및 기록 매체
CN100392662C (zh) 设计布局及掩膜的制作方法和系统、半导体器件的制造方法
US20030192013A1 (en) Method and apparatus for facilitating process-compliant layout optimization
CN116710843B (zh) 用于自由形状的光学邻近校正
US7526748B2 (en) Design pattern data preparing method, mask pattern data preparing method, mask manufacturing method, semiconductor device manufacturing method, and program recording medium
US8438506B2 (en) Method and system for implementing controlled breaks between features using sub-resolution assist features
CN1319120C (zh) 半导体器件用的图形制作方法
JP2005181523A (ja) 設計パターン補正方法、マスクパターン作成方法、半導体装置の製造方法、設計パターン補正システム、及び設計パターン補正プログラム
US7801709B2 (en) Simulation method using a simulation system that provides information on a transfer pattern of a predetermined mask pattern transferred to a wafer by optical photolithography and method of modifying mask pattern
JP2008176303A (ja) マスク生成方法、マスク形成方法、パターン形成方法および半導体装置
JP3914085B2 (ja) プロセスパラメータの作成方法、プロセスパラメータの作成システム及び半導体装置の製造方法
JP2005338650A (ja) パターンのデータ作成方法、及びパターン検証手法
US7313769B1 (en) Optimizing an integrated circuit layout by taking into consideration layout interactions as well as extra manufacturability margin
JP4195825B2 (ja) プロセスパラメータまたはデザインルールとプロセスパラメータとの両方を決定する方法、半導体集積回路装置の製造方法、プロセスパラメータまたはデザインルールとプロセスパラメータとの両方を決定するシステム、および、プログラム
JP2004163472A (ja) フォトマスクの設計方法、フォトマスク、及び半導体装置
US12541631B2 (en) Free-form layout feature retargeting
JPH11126824A (ja) パターン設計方法
JP2010135638A (ja) 電子線露光方法
KR100834234B1 (ko) 반도체 장치 제조용 마스크 패턴 결정 방법
JP2000066370A (ja) マスクパターン作成方法および装置
JP2007199234A (ja) フォトマスクの設計方法及び設計装置
JPH1079332A (ja) 集積回路用パタンレイアウト生成方法、集積回路用パタンレイアウト生成装置及び回路パタン形成方法
JP2000138159A (ja) マスクパターン作成方法および装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20130520

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20140516

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20150518

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20160520

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

FPAY Annual fee payment

Payment date: 20170522

Year of fee payment: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

FPAY Annual fee payment

Payment date: 20180516

Year of fee payment: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

FPAY Annual fee payment

Payment date: 20190515

Year of fee payment: 16

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 17

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20210619

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20210619

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000