TW516077B - Method of creating design rule, design rule creating system, and recording medium - Google Patents

Method of creating design rule, design rule creating system, and recording medium Download PDF

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Publication number
TW516077B
TW516077B TW090115957A TW90115957A TW516077B TW 516077 B TW516077 B TW 516077B TW 090115957 A TW090115957 A TW 090115957A TW 90115957 A TW90115957 A TW 90115957A TW 516077 B TW516077 B TW 516077B
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TW
Taiwan
Prior art keywords
design
prediction
design rule
compression
completed shape
Prior art date
Application number
TW090115957A
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English (en)
Chinese (zh)
Inventor
Toshiya Kotani
Satoshi Tanaka
Soichi Inoue
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Toshiba Corp
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Publication date
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Publication of TW516077B publication Critical patent/TW516077B/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW090115957A 2000-06-30 2001-06-29 Method of creating design rule, design rule creating system, and recording medium TW516077B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000199839A JP4077141B2 (ja) 2000-06-30 2000-06-30 デザインルール作成方法、デザインルール作成システム及び記録媒体

Publications (1)

Publication Number Publication Date
TW516077B true TW516077B (en) 2003-01-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW090115957A TW516077B (en) 2000-06-30 2001-06-29 Method of creating design rule, design rule creating system, and recording medium

Country Status (4)

Country Link
US (4) US6507931B2 (https=)
JP (1) JP4077141B2 (https=)
KR (1) KR100437980B1 (https=)
TW (1) TW516077B (https=)

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* Cited by examiner, † Cited by third party
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US7886564B2 (en) 2004-09-10 2011-02-15 Nippon Steel Corporation System, method, software arrangement and computer-accessible medium for press-forming of materials
TWI393172B (zh) * 2007-12-20 2013-04-11 Fujitsu Semiconductor Ltd 半導體裝置、用於製造半導體裝置之方法及電腦可讀取媒體

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JP4077141B2 (ja) * 2000-06-30 2008-04-16 株式会社東芝 デザインルール作成方法、デザインルール作成システム及び記録媒体
JP2002368093A (ja) * 2001-06-12 2002-12-20 Mitsubishi Electric Corp レイアウト生成装置、レイアウト生成方法およびプログラム
TWI252516B (en) 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule
JP2003345854A (ja) * 2002-05-23 2003-12-05 Mitsubishi Electric Corp デザインルール作成システム
US7117456B2 (en) * 2003-12-03 2006-10-03 International Business Machines Corporation Circuit area minimization using scaling
JP2005181523A (ja) 2003-12-17 2005-07-07 Toshiba Corp 設計パターン補正方法、マスクパターン作成方法、半導体装置の製造方法、設計パターン補正システム、及び設計パターン補正プログラム
JP4488727B2 (ja) 2003-12-17 2010-06-23 株式会社東芝 設計レイアウト作成方法、設計レイアウト作成システム、マスクの製造方法、半導体装置の製造方法、及び設計レイアウト作成プログラム
JP4357287B2 (ja) 2003-12-18 2009-11-04 株式会社東芝 修正指針の発生方法、パターン作成方法、マスクの製造方法、半導体装置の製造方法及びプログラム
WO2005098686A2 (en) * 2004-04-02 2005-10-20 Clear Shape Technologies, Inc. Modeling resolution enhancement processes in integrated circuit fabrication
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
JP2006053248A (ja) * 2004-08-10 2006-02-23 Toshiba Corp 設計パターンデータ作成方法、マスクパターンデータ作成方法、マスク製造方法、半導体装置の方法およびプログラム
JP4817746B2 (ja) * 2005-07-27 2011-11-16 株式会社東芝 半導体装置の設計データ処理方法、そのプログラム、及び半導体装置の製造方法
US20070074142A1 (en) * 2005-09-27 2007-03-29 Applied Materials, Inc. Integrated circuit layout methods
US7934184B2 (en) * 2005-11-14 2011-04-26 Takumi Technology Corporation Integrated circuit design using modified cells
US7568179B1 (en) 2006-09-21 2009-07-28 Armen Kroyan Layout printability optimization method and system
JP4745256B2 (ja) 2007-01-26 2011-08-10 株式会社東芝 パターン作成方法、パターン作成・検証プログラム、および半導体装置の製造方法
US8010912B2 (en) * 2007-03-09 2011-08-30 Broadcom Corporation Method of shrinking semiconductor mask features for process improvement
JP4891817B2 (ja) * 2007-03-16 2012-03-07 株式会社日立製作所 設計ルール管理方法、設計ルール管理プログラム、ルール構築装置およびルールチェック装置
KR100898232B1 (ko) * 2007-09-03 2009-05-18 주식회사 동부하이텍 축소과정에서의 패턴 설계 방법
JP2009290150A (ja) * 2008-06-02 2009-12-10 Renesas Technology Corp 半導体装置の製造システムおよび製造方法
US8214771B2 (en) * 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
KR101044295B1 (ko) * 2010-01-07 2011-06-28 주식회사 엔타시스 자동화된 칩 면적 최적화를 위한 블록 패킹방법 및 표준 셀 패킹 방법
US20150067621A1 (en) * 2012-09-05 2015-03-05 Mentor Graphics Corporation Logic-Driven Layout Pattern Analysis
KR102227127B1 (ko) 2014-02-12 2021-03-12 삼성전자주식회사 리소그래피 시뮬레이션을 이용한 디자인룰 생성 장치 및 방법
US10628544B2 (en) 2017-09-25 2020-04-21 International Business Machines Corporation Optimizing integrated circuit designs based on interactions between multiple integration design rules
US11023648B2 (en) 2017-12-12 2021-06-01 Siemens Industry Software Inc. Puzzle-based pattern analysis and classification
KR102755274B1 (ko) 2024-07-05 2025-01-22 최병렬 압축기와 반응기와 촉매제 기반 에틸렌과 프로판과 고분자 재료 혼합 복합 생산 시스템 및 그 운용방법

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JP4077141B2 (ja) * 2000-06-30 2008-04-16 株式会社東芝 デザインルール作成方法、デザインルール作成システム及び記録媒体
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7886564B2 (en) 2004-09-10 2011-02-15 Nippon Steel Corporation System, method, software arrangement and computer-accessible medium for press-forming of materials
US8091395B2 (en) 2004-09-10 2012-01-10 Nippon Steel Corporation System, method, software arrangement and computer-accessible medium for press-forming of materials
TWI393172B (zh) * 2007-12-20 2013-04-11 Fujitsu Semiconductor Ltd 半導體裝置、用於製造半導體裝置之方法及電腦可讀取媒體

Also Published As

Publication number Publication date
USRE43659E1 (en) 2012-09-11
USRE42302E1 (en) 2011-04-19
KR100437980B1 (ko) 2004-07-02
JP4077141B2 (ja) 2008-04-16
US20020002697A1 (en) 2002-01-03
USRE42294E1 (en) 2011-04-12
US6507931B2 (en) 2003-01-14
JP2002026126A (ja) 2002-01-25
KR20020002323A (ko) 2002-01-09

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