JP4019068B2 - 回路付サスペンション基板 - Google Patents

回路付サスペンション基板 Download PDF

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Publication number
JP4019068B2
JP4019068B2 JP2004140319A JP2004140319A JP4019068B2 JP 4019068 B2 JP4019068 B2 JP 4019068B2 JP 2004140319 A JP2004140319 A JP 2004140319A JP 2004140319 A JP2004140319 A JP 2004140319A JP 4019068 B2 JP4019068 B2 JP 4019068B2
Authority
JP
Japan
Prior art keywords
layer
circuit
insulating layer
suspension board
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004140319A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005322336A (ja
JP2005322336A5 (enExample
Inventor
靖人 船田
徹也 大澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2004140319A priority Critical patent/JP4019068B2/ja
Priority to DE602005015508T priority patent/DE602005015508D1/de
Priority to EP05008760A priority patent/EP1596369B1/en
Priority to US11/123,181 priority patent/US7531753B2/en
Priority to CNB2005100714411A priority patent/CN100392517C/zh
Publication of JP2005322336A publication Critical patent/JP2005322336A/ja
Publication of JP2005322336A5 publication Critical patent/JP2005322336A5/ja
Application granted granted Critical
Publication of JP4019068B2 publication Critical patent/JP4019068B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • G11B5/6005—Specially adapted for spacing from a rotating disc using a fluid cushion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP2004140319A 2004-05-10 2004-05-10 回路付サスペンション基板 Expired - Fee Related JP4019068B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004140319A JP4019068B2 (ja) 2004-05-10 2004-05-10 回路付サスペンション基板
DE602005015508T DE602005015508D1 (de) 2004-05-10 2005-04-21 Aufhängungsplatte mit Schaltung
EP05008760A EP1596369B1 (en) 2004-05-10 2005-04-21 Suspension board with circuit
US11/123,181 US7531753B2 (en) 2004-05-10 2005-05-06 Suspension board with circuit
CNB2005100714411A CN100392517C (zh) 2004-05-10 2005-05-10 带有电路的悬挂基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004140319A JP4019068B2 (ja) 2004-05-10 2004-05-10 回路付サスペンション基板

Publications (3)

Publication Number Publication Date
JP2005322336A JP2005322336A (ja) 2005-11-17
JP2005322336A5 JP2005322336A5 (enExample) 2006-03-23
JP4019068B2 true JP4019068B2 (ja) 2007-12-05

Family

ID=34935530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004140319A Expired - Fee Related JP4019068B2 (ja) 2004-05-10 2004-05-10 回路付サスペンション基板

Country Status (5)

Country Link
US (1) US7531753B2 (enExample)
EP (1) EP1596369B1 (enExample)
JP (1) JP4019068B2 (enExample)
CN (1) CN100392517C (enExample)
DE (1) DE602005015508D1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4640802B2 (ja) 2005-07-07 2011-03-02 日東電工株式会社 回路付サスペンション基板
JP4187757B2 (ja) * 2006-06-22 2008-11-26 日東電工株式会社 配線回路基板
JP4865453B2 (ja) 2006-08-30 2012-02-01 日東電工株式会社 配線回路基板およびその製造方法
JP4162697B2 (ja) * 2006-11-21 2008-10-08 日東電工株式会社 回路付サスペンション基板およびその製造方法
US7813082B2 (en) * 2007-01-26 2010-10-12 Hutchinson Technology Incorporated Head suspension flexure with inline lead portions positioned at a level between levels of first and second surfaces of the spring metal layer
JP2008282995A (ja) 2007-05-10 2008-11-20 Nitto Denko Corp 配線回路基板
JP4938551B2 (ja) * 2007-05-21 2012-05-23 日本発條株式会社 配線付きフレキシャ、配線付きフレキシャの製造方法、及びヘッドサスペンション
JP4892453B2 (ja) * 2007-10-23 2012-03-07 日東電工株式会社 回路付サスペンション基板
US8045296B1 (en) * 2007-11-29 2011-10-25 Hutchinson Technology Incorporated Aligned coverlay and metal layer windows for integrated lead suspensions
JP4944829B2 (ja) * 2008-04-01 2012-06-06 ヒタチグローバルストレージテクノロジーズネザーランドビーブイ マイクロ・エレクトロ・メカニカル・システム及びヘッド・ジンバル・アセンブリ
JP4989572B2 (ja) 2008-07-07 2012-08-01 日東電工株式会社 回路付サスペンション基板およびその製造方法
US20100046351A1 (en) * 2008-08-22 2010-02-25 Nitto Denko Corporation Copper residual stress relaxation reduction means for hard disk drive slider gimbals
JP5609097B2 (ja) * 2009-12-16 2014-10-22 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法
JP5603657B2 (ja) * 2010-05-20 2014-10-08 日東電工株式会社 回路付サスペンション基板およびその製造方法
JP5772002B2 (ja) * 2011-01-18 2015-09-02 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法
JP6163363B2 (ja) * 2013-06-14 2017-07-12 日本発條株式会社 ディスク装置用サスペンション
JP6427063B2 (ja) 2015-04-24 2018-11-21 日本発條株式会社 薄板配線基板及びその製造方法
JP6511371B2 (ja) * 2015-09-10 2019-05-15 日本発條株式会社 ディスク装置用サスペンションのフレキシャと、フレキシャの配線部の製造方法
US12272387B2 (en) * 2023-02-13 2025-04-08 Western Digital Technologies, Inc. Multi-layer load beam flexure for magnetic storage device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5219640A (en) * 1991-02-08 1993-06-15 Rogers Corporation Flexible circuit having flexing section of reduced stiffness, and method of manufacture thereof
US5781379A (en) * 1994-03-15 1998-07-14 International Business Machines Corporation Single beam flexure for a head gimbal assembly
TW307863B (enExample) * 1994-03-15 1997-06-11 Ibm
JP3124909B2 (ja) 1994-07-05 2001-01-15 インターナショナル・ビジネス・マシーンズ・コーポレ−ション データ変換器支持サスペンション
JP2855414B2 (ja) * 1995-04-13 1999-02-10 日本メクトロン株式会社 磁気ヘッド用中継基板及びその製造法
JPH0954930A (ja) 1995-08-07 1997-02-25 Hitachi Ltd 磁気ヘッド支持機構
SG52916A1 (en) * 1996-02-13 1998-09-28 Nitto Denko Corp Circuit substrate circuit-formed suspension substrate and production method thereof
JPH10265572A (ja) 1996-02-13 1998-10-06 Nitto Denko Corp 回路基板、回路付きサスペンション基板及びそれらの製造方法
US5699212A (en) * 1996-05-01 1997-12-16 International Business Machines Corporation Method of electrostatic discharge protection of magnetic heads in a magnetic storage system
US5734523A (en) * 1996-07-24 1998-03-31 Pemstar, Inc. Conductive film connectors for use on head assemblies in drives
JP3605497B2 (ja) 1997-07-11 2004-12-22 日本発条株式会社 ディスク装置用サスペンション
KR100574278B1 (ko) * 1998-11-27 2006-09-22 삼성전자주식회사 테이프 캐리어 패키지 및 이를 이용한 액정표시기모듈
JP3274445B2 (ja) * 1998-12-16 2002-04-15 サンコール株式会社 磁気ヘッドサスペンション
US6147840A (en) * 1999-04-15 2000-11-14 Magnecomp Corp. One-piece load beam and gimbal flexure using flexible circuit
JP3803035B2 (ja) 2001-03-07 2006-08-02 サンコール株式会社 磁気ヘッドサスペンションの製造方法

Also Published As

Publication number Publication date
US20050248885A1 (en) 2005-11-10
US7531753B2 (en) 2009-05-12
CN1697027A (zh) 2005-11-16
JP2005322336A (ja) 2005-11-17
CN100392517C (zh) 2008-06-04
EP1596369B1 (en) 2009-07-22
EP1596369A1 (en) 2005-11-16
DE602005015508D1 (de) 2009-09-03

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