JP4007911B2 - 硬化性樹脂組成物 - Google Patents

硬化性樹脂組成物 Download PDF

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Publication number
JP4007911B2
JP4007911B2 JP2002524003A JP2002524003A JP4007911B2 JP 4007911 B2 JP4007911 B2 JP 4007911B2 JP 2002524003 A JP2002524003 A JP 2002524003A JP 2002524003 A JP2002524003 A JP 2002524003A JP 4007911 B2 JP4007911 B2 JP 4007911B2
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JP
Japan
Prior art keywords
component
resin composition
curable resin
composite material
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002524003A
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English (en)
Japanese (ja)
Inventor
友裕 頼末
照雄 片寄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei EMD Corp
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Asahi Kasei EMD Corp
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Publication date
Application filed by Asahi Kasei EMD Corp filed Critical Asahi Kasei EMD Corp
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Publication of JP4007911B2 publication Critical patent/JP4007911B2/ja
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Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34928—Salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
JP2002524003A 2000-08-30 2000-08-30 硬化性樹脂組成物 Expired - Lifetime JP4007911B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/005883 WO2002018493A1 (fr) 2000-08-30 2000-08-30 Composition de resine durcissable

Publications (1)

Publication Number Publication Date
JP4007911B2 true JP4007911B2 (ja) 2007-11-14

Family

ID=11736411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002524003A Expired - Lifetime JP4007911B2 (ja) 2000-08-30 2000-08-30 硬化性樹脂組成物

Country Status (3)

Country Link
JP (1) JP4007911B2 (zh)
CN (1) CN1239615C (zh)
WO (1) WO2002018493A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7413791B2 (en) 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
JP3923441B2 (ja) 2003-03-25 2007-05-30 三光株式会社 難燃性合成樹脂組成物
DE602004014769D1 (de) * 2003-06-12 2008-08-14 Fuji Electric Holdings Reaktive flammschutzmittel und flammgeschützte harzprodukte
JP4189003B2 (ja) * 2003-10-03 2008-12-03 サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ 難燃性熱硬化性組成物、方法並びに製品
US7488766B2 (en) 2005-10-06 2009-02-10 Sabic Innovative Plastics Ip B.V. Polymer composition, method, and article
US7495047B2 (en) 2005-10-06 2009-02-24 At&T Intellectual Property, I, L.P. Poly(arylene ether) composition, method, and article
WO2009125623A1 (ja) * 2008-04-09 2009-10-15 住友電気工業株式会社 難燃性チューブ及びこれを用いた熱収縮チューブ
JP5165639B2 (ja) * 2009-05-26 2013-03-21 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
DE102010035103A1 (de) * 2010-08-23 2012-02-23 Catena Additives Gmbh & Co. Kg Flammschutzmittelzusammensetzungen enthaltend Triazin-interkalierte Metall-Phosphate
JP6219112B2 (ja) * 2013-09-27 2017-10-25 旭化成株式会社 Ｐｐｅ含有樹脂組成物
TWI557155B (zh) * 2013-11-20 2016-11-11 Asahi Kasei E Materials Corp And a cured product of a resin composition containing a polyphenyl ether
DE102014014098A1 (de) 2014-09-30 2016-03-31 Mankiewicz Gebr. & Co. Gmbh & Co. Kg Sperrschicht und deren Verwendung in Beschichtungssystemen auf Kunststoffsubstraten
DE102017215780A1 (de) * 2017-09-07 2019-03-07 Clariant Plastics & Coatings Ltd Synergistische Flammschutzmittelkombinationen für Polymerzusammensetzungen und deren Verwendung
US20190127576A1 (en) * 2017-10-27 2019-05-02 Frx Polymers, Inc. Phosphonate based halogen-free compositions for printed circuit board applications
KR20210090605A (ko) * 2018-11-08 2021-07-20 쇼와덴코머티리얼즈가부시끼가이샤 수지 조성물, 프리프레그, 적층판, 수지 필름, 다층 프린트 배선판 및 밀리파 레이더용 다층 프린트 배선판

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03157451A (ja) * 1989-11-15 1991-07-05 Asahi Chem Ind Co Ltd 樹脂組成物
JPH03185058A (ja) * 1989-12-14 1991-08-13 Asahi Chem Ind Co Ltd 熱可塑性樹脂組成物
JPH04370134A (ja) * 1991-06-19 1992-12-22 Asahi Chem Ind Co Ltd 非ハロゲン系難燃性樹脂組成物
JP2000248169A (ja) * 1999-03-01 2000-09-12 Asahi Chem Ind Co Ltd 難燃・硬化性樹脂組成物
JP2000290490A (ja) * 1999-04-01 2000-10-17 Asahi Chem Ind Co Ltd 難燃硬化性樹脂組成物
JP2000336261A (ja) * 1999-03-24 2000-12-05 Asahi Chem Ind Co Ltd 硬化性樹脂組成物
JP2001181371A (ja) * 1999-12-27 2001-07-03 Toshiba Chem Corp ビルドアップ型多層プリント配線板とそれに用いる樹脂組成物および樹脂フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900768A (en) * 1983-08-23 1990-02-13 General Electric Company Crosslinkable flame retardant composition of polyphenylene ether and elastomers
JPH0726014B2 (ja) * 1989-03-08 1995-03-22 旭化成工業株式会社 難燃化樹脂組成物
JPH03275761A (ja) * 1990-03-26 1991-12-06 Matsushita Electric Works Ltd ポリフェニレンオキサイド系樹脂組成物
JPH04117452A (ja) * 1990-09-06 1992-04-17 Mitsubishi Kasei Polytec Co ポリフェニレンエーテル系樹脂組成物
DE4130488A1 (de) * 1991-09-13 1993-03-18 Bayer Ag Phosphorhaltige polymerisate
JPH07316415A (ja) * 1994-05-23 1995-12-05 Sumitomo Bakelite Co Ltd 難燃性ポリフェニレンエーテル系樹脂組成物及びその製造方法
JPH08176450A (ja) * 1994-12-21 1996-07-09 Sumitomo Bakelite Co Ltd 熱可塑性樹脂組成物
JP2000129263A (ja) * 1998-10-27 2000-05-09 Rin Kagaku Kogyo Kk 低発煙性難燃剤組成物及び低発煙性難燃樹脂組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03157451A (ja) * 1989-11-15 1991-07-05 Asahi Chem Ind Co Ltd 樹脂組成物
JPH03185058A (ja) * 1989-12-14 1991-08-13 Asahi Chem Ind Co Ltd 熱可塑性樹脂組成物
JPH04370134A (ja) * 1991-06-19 1992-12-22 Asahi Chem Ind Co Ltd 非ハロゲン系難燃性樹脂組成物
JP2000248169A (ja) * 1999-03-01 2000-09-12 Asahi Chem Ind Co Ltd 難燃・硬化性樹脂組成物
JP2000336261A (ja) * 1999-03-24 2000-12-05 Asahi Chem Ind Co Ltd 硬化性樹脂組成物
JP2000290490A (ja) * 1999-04-01 2000-10-17 Asahi Chem Ind Co Ltd 難燃硬化性樹脂組成物
JP2001181371A (ja) * 1999-12-27 2001-07-03 Toshiba Chem Corp ビルドアップ型多層プリント配線板とそれに用いる樹脂組成物および樹脂フィルム

Also Published As

Publication number Publication date
WO2002018493A1 (fr) 2002-03-07
CN1239615C (zh) 2006-02-01
CN1454240A (zh) 2003-11-05

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