JP4007570B2 - ポジ型レジスト組成物 - Google Patents

ポジ型レジスト組成物 Download PDF

Info

Publication number
JP4007570B2
JP4007570B2 JP27533499A JP27533499A JP4007570B2 JP 4007570 B2 JP4007570 B2 JP 4007570B2 JP 27533499 A JP27533499 A JP 27533499A JP 27533499 A JP27533499 A JP 27533499A JP 4007570 B2 JP4007570 B2 JP 4007570B2
Authority
JP
Japan
Prior art keywords
group
acid
compound
fluorine atom
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP27533499A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000187330A5 (enExample
JP2000187330A (ja
Inventor
邦彦 児玉
利明 青合
一也 上西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP27533499A priority Critical patent/JP4007570B2/ja
Priority to KR1019990044865A priority patent/KR100571314B1/ko
Priority to US09/419,905 priority patent/US6265135B1/en
Publication of JP2000187330A publication Critical patent/JP2000187330A/ja
Publication of JP2000187330A5 publication Critical patent/JP2000187330A5/ja
Application granted granted Critical
Publication of JP4007570B2 publication Critical patent/JP4007570B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/02—Monomers containing only one unsaturated aliphatic radical
    • C08F12/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F12/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing heteroatoms
    • C08F12/22—Oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/143—Electron beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
JP27533499A 1998-10-16 1999-09-28 ポジ型レジスト組成物 Expired - Fee Related JP4007570B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP27533499A JP4007570B2 (ja) 1998-10-16 1999-09-28 ポジ型レジスト組成物
KR1019990044865A KR100571314B1 (ko) 1998-10-16 1999-10-16 포지티브 전자빔 또는 x선 레지스트 조성물
US09/419,905 US6265135B1 (en) 1998-10-16 1999-10-18 Positive-working electron beam or X-ray resist composition

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-295609 1998-10-16
JP29560998 1998-10-16
JP27533499A JP4007570B2 (ja) 1998-10-16 1999-09-28 ポジ型レジスト組成物

Publications (3)

Publication Number Publication Date
JP2000187330A JP2000187330A (ja) 2000-07-04
JP2000187330A5 JP2000187330A5 (enExample) 2005-07-07
JP4007570B2 true JP4007570B2 (ja) 2007-11-14

Family

ID=26551420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27533499A Expired - Fee Related JP4007570B2 (ja) 1998-10-16 1999-09-28 ポジ型レジスト組成物

Country Status (3)

Country Link
US (1) US6265135B1 (enExample)
JP (1) JP4007570B2 (enExample)
KR (1) KR100571314B1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6806022B1 (en) * 1998-04-22 2004-10-19 Fuji Photo Film Co., Ltd. Positive photosensitive resin composition
JP3963625B2 (ja) * 1999-02-24 2007-08-22 富士フイルム株式会社 ポジ型フォトレジスト組成物
JP3281612B2 (ja) * 1999-03-05 2002-05-13 松下電器産業株式会社 パターン形成方法
KR100538501B1 (ko) * 1999-08-16 2005-12-23 신에쓰 가가꾸 고교 가부시끼가이샤 신규한 오늄염, 레지스트 재료용 광산발생제, 레지스트재료 및 패턴 형성 방법
JP4135276B2 (ja) * 1999-10-12 2008-08-20 Ｊｓｒ株式会社 感放射線性樹脂組成物
US6727036B2 (en) * 1999-12-27 2004-04-27 Fuji Photo Film Co., Ltd. Positive-working radiation-sensitive composition
TW548520B (en) * 2000-02-18 2003-08-21 Fuji Photo Film Co Ltd Positive resist composition for X-rays or electron beams
US6692883B2 (en) * 2000-04-21 2004-02-17 Fuji Photo Film Co., Ltd. Positive photoresist composition
JP2002006483A (ja) * 2000-06-20 2002-01-09 Sumitomo Chem Co Ltd フォトレジスト組成物
JP4150491B2 (ja) * 2000-07-13 2008-09-17 富士フイルム株式会社 ポジ型感光性組成物
JP3956088B2 (ja) * 2000-07-19 2007-08-08 信越化学工業株式会社 化学増幅ポジ型レジスト材料
JP3712047B2 (ja) * 2000-08-14 2005-11-02 信越化学工業株式会社 レジスト材料及びパターン形成方法
US6482567B1 (en) * 2000-08-25 2002-11-19 Shipley Company, L.L.C. Oxime sulfonate and N-oxyimidosulfonate photoacid generators and photoresists comprising same
TWI226509B (en) * 2000-09-12 2005-01-11 Fuji Photo Film Co Ltd Positive resist composition
US6727039B2 (en) * 2000-09-25 2004-04-27 Fuji Photo Film Co., Ltd. Positive photoresist composition
JP4190167B2 (ja) * 2000-09-26 2008-12-03 富士フイルム株式会社 ポジ型レジスト組成物
JP4438218B2 (ja) * 2000-11-16 2010-03-24 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP4190146B2 (ja) * 2000-12-28 2008-12-03 富士フイルム株式会社 電子線またはｘ線用ポジ型レジスト組成物
TW594383B (en) * 2001-02-21 2004-06-21 Fuji Photo Film Co Ltd Positive resist composition for electron beam
TW562999B (en) * 2001-05-09 2003-11-21 Fuji Photo Film Co Ltd Positive resist composition for electronic or X-rays
CN100339767C (zh) * 2001-06-22 2007-09-26 和光纯药工业株式会社 抗蚀剂组合物
US6949329B2 (en) 2001-06-22 2005-09-27 Matsushita Electric Industrial Co., Ltd. Pattern formation method
JP2003186197A (ja) * 2001-12-19 2003-07-03 Sony Corp レジスト材料及び露光方法
JP2003186198A (ja) * 2001-12-19 2003-07-03 Sony Corp レジスト材料及び露光方法
US7214465B2 (en) 2002-01-10 2007-05-08 Fujifilm Corporation Positive photosensitive composition
JP4025075B2 (ja) * 2002-01-10 2007-12-19 富士フイルム株式会社 ポジ型感光性組成物
US7521168B2 (en) * 2002-02-13 2009-04-21 Fujifilm Corporation Resist composition for electron beam, EUV or X-ray
JP2004004561A (ja) * 2002-02-19 2004-01-08 Sumitomo Chem Co Ltd ポジ型レジスト組成物
US6806026B2 (en) * 2002-05-31 2004-10-19 International Business Machines Corporation Photoresist composition
KR100973799B1 (ko) * 2003-01-03 2010-08-03 삼성전자주식회사 Ｍｍｎ 헤드 코터용 포토레지스트 조성물
US7820369B2 (en) 2003-12-04 2010-10-26 International Business Machines Corporation Method for patterning a low activation energy photoresist
US7193023B2 (en) * 2003-12-04 2007-03-20 International Business Machines Corporation Low activation energy photoresists
US7217496B2 (en) 2004-11-12 2007-05-15 International Business Machines Corporation Fluorinated photoresist materials with improved etch resistant properties
JP4562537B2 (ja) * 2005-01-28 2010-10-13 富士フイルム株式会社 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法
US8173348B2 (en) 2006-06-27 2012-05-08 Jsr Corporation Method of forming pattern and composition for forming of organic thin-film for use therein
KR101429309B1 (ko) 2006-08-04 2014-08-11 제이에스알 가부시끼가이샤 패턴 형성 방법, 상층막 형성용 조성물, 및 하층막 형성용 조성물
JP5522906B2 (ja) * 2008-05-23 2014-06-18 日本カーバイド工業株式会社 新規な光酸発生剤及びそれを含むレジスト材料
JP5544098B2 (ja) 2008-09-26 2014-07-09 富士フイルム株式会社 感活性光線性または感放射線性樹脂組成物、及び該感光性組成物を用いたパターン形成方法
JP5514583B2 (ja) * 2009-03-13 2014-06-04 富士フイルム株式会社 感活性光線性または感放射線性樹脂組成物及び該組成物を用いたパターン形成方法
JP5740322B2 (ja) 2012-02-06 2015-06-24 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、それを用いた感活性光線性又は感放射線性膜及びパターン形成方法、半導体デバイスの製造方法及び半導体デバイス、並びに、化合物
JP6637676B2 (ja) * 2015-05-11 2020-01-29 住友化学株式会社 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法
KR102134381B1 (ko) * 2017-07-31 2020-07-15 주식회사 엘지화학 포지티브형 포토레지스트 조성물, 이로부터 제조되는 패턴, 및 패턴 제조방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4112971A1 (de) * 1991-04-20 1992-10-22 Hoechst Ag Sulfonsaeureester von 2,4,6-tris-(2-hydroxy-ethoxy)-(1,3,5)triazin, ein damit hergestelltes positiv arbeitendes strahlungsempfindliches gemisch und aufzeichnungsmaterial
JPH08110635A (ja) * 1994-10-07 1996-04-30 Shin Etsu Chem Co Ltd 化学増幅ポジ型レジスト材料
TW530192B (en) * 1997-01-27 2003-05-01 Shinetsu Chemical Co Partially hydrogenated polymer compound and chemically sensitized positive resist material
TW574629B (en) * 1997-02-28 2004-02-01 Shinetsu Chemical Co Polystyrene derivative chemically amplified positive resist compositions, and patterning method
KR100571313B1 (ko) * 1998-03-17 2006-04-17 후지 샤신 필름 가부시기가이샤 포지티브 감광성 조성물

Also Published As

Publication number Publication date
KR100571314B1 (ko) 2006-04-17
US6265135B1 (en) 2001-07-24
JP2000187330A (ja) 2000-07-04
KR20000029118A (ko) 2000-05-25

Similar Documents

Publication Publication Date Title
JP4007570B2 (ja) ポジ型レジスト組成物
JP4187934B2 (ja) ポジ型レジスト組成物
JP4262402B2 (ja) ポジ型レジスト組成物
JP4177952B2 (ja) ポジ型レジスト組成物
JP4194259B2 (ja) ネガ型レジスト組成物
KR100651042B1 (ko) 네거티브 레지스트 조성물
JP4007569B2 (ja) ポジ型電子線又はｘ線レジスト組成物
JP4243029B2 (ja) ポジ型化学増幅レジスト組成物
US6720128B2 (en) Positive resist composition
JP4145017B2 (ja) 感放射線性レジスト組成物
US20020015916A1 (en) Positive resist composition
JP2002169295A (ja) ポジ型レジスト組成物
JP3992993B2 (ja) ポジ型電子線、ｘ線又はｅｕｖ用レジスト組成物
KR100788808B1 (ko) 포지티브 전자선 또는 엑스선 레지스트 조성물
JP4121309B2 (ja) ネガ型レジスト組成物
JP3741330B2 (ja) ポジ型フォトレジスト組成物及びそれを用いるパターン形成方法
JP2002049155A (ja) レジスト組成物
JP4049237B2 (ja) ポジ型電子線又はｘ線レジスト組成物
JP5075803B2 (ja) ポジ型レジスト組成物及びこれを用いたパターン形成方法
JP2002006480A (ja) ポジ型レジスト組成物
JP4139655B2 (ja) ネガ型レジスト組成物
JP4486768B2 (ja) ネガ型電子線又はｘ線用化学増幅レジスト組成物
EP1193556A1 (en) Positive resist composition
JP4272805B2 (ja) ポジ型感放射線性組成物
JP4139569B2 (ja) 電子線又はｘ線用ネガ型レジスト組成物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041026

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041026

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20060324

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20061106

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20061124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070530

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070727

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070822

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070827

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100907

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4007570

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100907

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110907

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120907

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130907

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees