JP3994809B2 - 電子回路部品の打ち抜き装置及びその供給リール交換方法 - Google Patents

電子回路部品の打ち抜き装置及びその供給リール交換方法 Download PDF

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Publication number
JP3994809B2
JP3994809B2 JP2002200090A JP2002200090A JP3994809B2 JP 3994809 B2 JP3994809 B2 JP 3994809B2 JP 2002200090 A JP2002200090 A JP 2002200090A JP 2002200090 A JP2002200090 A JP 2002200090A JP 3994809 B2 JP3994809 B2 JP 3994809B2
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JP
Japan
Prior art keywords
tape
supply reel
electronic circuit
supply
reel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002200090A
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English (en)
Japanese (ja)
Other versions
JP2004047553A (ja
JP2004047553A5 (enExample
Inventor
淳 斧城
憲也 和田
秀明 片保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2002200090A priority Critical patent/JP3994809B2/ja
Priority to US10/613,008 priority patent/US6887330B2/en
Priority to KR1020030046014A priority patent/KR101089187B1/ko
Publication of JP2004047553A publication Critical patent/JP2004047553A/ja
Publication of JP2004047553A5 publication Critical patent/JP2004047553A5/ja
Application granted granted Critical
Publication of JP3994809B2 publication Critical patent/JP3994809B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/889—Tool with either work holder or means to hold work supply
    • Y10T83/896—Rotatable wound package supply
    • Y10T83/902—Plural supply sources
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9423—Punching tool
    • Y10T83/9425—Tool pair

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP2002200090A 2002-07-09 2002-07-09 電子回路部品の打ち抜き装置及びその供給リール交換方法 Expired - Fee Related JP3994809B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002200090A JP3994809B2 (ja) 2002-07-09 2002-07-09 電子回路部品の打ち抜き装置及びその供給リール交換方法
US10/613,008 US6887330B2 (en) 2002-07-09 2003-07-07 Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape
KR1020030046014A KR101089187B1 (ko) 2002-07-09 2003-07-08 전자회로부품의 펀칭장치 및 그 공급릴 교환방법 및전자회로부품의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002200090A JP3994809B2 (ja) 2002-07-09 2002-07-09 電子回路部品の打ち抜き装置及びその供給リール交換方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007131939A Division JP2007221169A (ja) 2007-05-17 2007-05-17 電子回路部品の打ち抜き装置、電子回路部品の打ち抜き装置の供給リール交換方法及び電子回路部品の製造方法

Publications (3)

Publication Number Publication Date
JP2004047553A JP2004047553A (ja) 2004-02-12
JP2004047553A5 JP2004047553A5 (enExample) 2005-08-18
JP3994809B2 true JP3994809B2 (ja) 2007-10-24

Family

ID=31707046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002200090A Expired - Fee Related JP3994809B2 (ja) 2002-07-09 2002-07-09 電子回路部品の打ち抜き装置及びその供給リール交換方法

Country Status (3)

Country Link
US (1) US6887330B2 (enExample)
JP (1) JP3994809B2 (enExample)
KR (1) KR101089187B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007221169A (ja) * 2007-05-17 2007-08-30 Hitachi High-Technologies Corp 電子回路部品の打ち抜き装置、電子回路部品の打ち抜き装置の供給リール交換方法及び電子回路部品の製造方法

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KR100518296B1 (ko) * 1998-09-30 2005-11-25 삼성전자주식회사 분리형 보호시트 이송유닛을 가지는 본딩장치
JP4070135B2 (ja) * 2004-05-11 2008-04-02 沖電気工業株式会社 テープキャリア、半導体装置の製造方法および半導体装置
EP1814369A4 (en) * 2004-10-01 2008-10-29 Toray Industries LONG FILM PCB AND PRODUCTION PROCESS AND PRODUCTION DEVICE THEREFOR
JP4628765B2 (ja) * 2004-12-07 2011-02-09 富士機械製造株式会社 フィルム状テープの供給装置
KR20060069075A (ko) * 2004-12-17 2006-06-21 삼성전자주식회사 액정 표시 장치의 제조 시스템 및 제조 방법
DE102005045549A1 (de) * 2005-09-23 2007-04-05 Vorwerk & Co. Interholding Gmbh Verfahren zum Bestücken eines Teppichs mit elekronischen Bauteilen, Vorrichtung hierzu, sowie Teppich mit elektronischen Bauteilen
CN101267998B (zh) * 2005-12-16 2010-05-19 松下电器产业株式会社 粘合带粘贴装置及其粘贴方法
US7850040B2 (en) * 2006-10-23 2010-12-14 Hover-Davis, Inc. Component tape feeder
JP4514829B2 (ja) * 2007-03-30 2010-07-28 パナソニック株式会社 作業装置、粘着テープ貼付装置およびテープ部材の追加方法
KR100947359B1 (ko) * 2008-04-30 2010-03-15 한국생산기술연구원 오버런 방지디스크 및 이를 이용한 펀칭장치
CN101827681B (zh) * 2008-08-19 2014-12-10 日东电工株式会社 光学薄膜的切断方法以及采用该切断方法的装置
JP5274938B2 (ja) * 2008-08-28 2013-08-28 シャープ株式会社 Ｔａｂテープの梱包方法
KR101486048B1 (ko) * 2008-10-29 2015-01-26 삼성테크윈 주식회사 테이프 피더
KR101563306B1 (ko) 2009-01-19 2015-10-27 한화테크윈 주식회사 전자 부품 공급 장치 및 이를 갖는 칩 마운터
EP2316332A1 (en) * 2009-10-30 2011-05-04 General Electric Company Sensor for measuring amount of substance in blood and method of making the sensor
JP5912836B2 (ja) * 2012-05-14 2016-04-27 株式会社Ｏｋｉデータ・インフォテック インクジェットプリンター
JP6114509B2 (ja) * 2012-06-28 2017-04-12 ヤマハ発動機株式会社 部品供給装置及び部品実装装置
KR101351262B1 (ko) * 2013-02-07 2014-01-14 세광테크 주식회사 본딩장치용 원자재 자동교체 장치
WO2014142389A1 (en) * 2013-03-12 2014-09-18 Samsung Techwin Co., Ltd. Automatic carrier tape feeding apparatus
KR101823926B1 (ko) * 2013-03-12 2018-01-31 한화테크윈 주식회사 캐리어 테이프의 자동 공급 장치
KR101515720B1 (ko) * 2013-12-23 2015-04-27 세메스 주식회사 이형 필름 공급 장치
US10015919B2 (en) * 2016-02-26 2018-07-03 Panasonic Intellectual Property Management Co., Ltd. Component supply device
JP6496908B2 (ja) * 2016-10-28 2019-04-10 パナソニックＩｐマネジメント株式会社 部品実装システム
US11064638B2 (en) * 2016-11-10 2021-07-13 YAMAHA HATSUDOKI KABUSHIKl KAISHA Component supply device, surface-mounting machine, and component supply method
KR102678136B1 (ko) * 2018-02-01 2024-06-26 가부시끼가이샤 레조낙 부재 접속 방법 및 접착 테이프
JP7340732B2 (ja) * 2019-03-22 2023-09-08 パナソニックＩｐマネジメント株式会社 部品供給装置、部品実装装置、部品供給方法及び部品実装方法
JP7398724B2 (ja) * 2019-05-15 2023-12-15 パナソニックＩｐマネジメント株式会社 部品装着装置、および部品装着方法
JP7357268B2 (ja) * 2019-06-12 2023-10-06 パナソニックＩｐマネジメント株式会社 部品供給装置
JP7601622B2 (ja) * 2020-12-04 2024-12-17 株式会社ディスコ テープ剥離装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007221169A (ja) * 2007-05-17 2007-08-30 Hitachi High-Technologies Corp 電子回路部品の打ち抜き装置、電子回路部品の打ち抜き装置の供給リール交換方法及び電子回路部品の製造方法

Also Published As

Publication number Publication date
US20040069112A1 (en) 2004-04-15
JP2004047553A (ja) 2004-02-12
US6887330B2 (en) 2005-05-03
KR101089187B1 (ko) 2011-12-02
KR20040005653A (ko) 2004-01-16

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