KR101089187B1 - 전자회로부품의 펀칭장치 및 그 공급릴 교환방법 및전자회로부품의 제조방법 - Google Patents

전자회로부품의 펀칭장치 및 그 공급릴 교환방법 및전자회로부품의 제조방법 Download PDF

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Publication number
KR101089187B1
KR101089187B1 KR1020030046014A KR20030046014A KR101089187B1 KR 101089187 B1 KR101089187 B1 KR 101089187B1 KR 1020030046014 A KR1020030046014 A KR 1020030046014A KR 20030046014 A KR20030046014 A KR 20030046014A KR 101089187 B1 KR101089187 B1 KR 101089187B1
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South Korea
Prior art keywords
tape
supply reel
electronic circuit
punching
supply
Prior art date
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Expired - Fee Related
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KR1020030046014A
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English (en)
Korean (ko)
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KR20040005653A (ko
Inventor
오노시로준
와다겐야
가타호히데아키
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가부시키가이샤 히다치 하이테크놀로지즈
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Publication of KR20040005653A publication Critical patent/KR20040005653A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/889—Tool with either work holder or means to hold work supply
    • Y10T83/896—Rotatable wound package supply
    • Y10T83/902—Plural supply sources
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9423—Punching tool
    • Y10T83/9425—Tool pair

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
KR1020030046014A 2002-07-09 2003-07-08 전자회로부품의 펀칭장치 및 그 공급릴 교환방법 및전자회로부품의 제조방법 Expired - Fee Related KR101089187B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002200090A JP3994809B2 (ja) 2002-07-09 2002-07-09 電子回路部品の打ち抜き装置及びその供給リール交換方法
JPJP-P-2002-00200090 2002-07-09

Publications (2)

Publication Number Publication Date
KR20040005653A KR20040005653A (ko) 2004-01-16
KR101089187B1 true KR101089187B1 (ko) 2011-12-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030046014A Expired - Fee Related KR101089187B1 (ko) 2002-07-09 2003-07-08 전자회로부품의 펀칭장치 및 그 공급릴 교환방법 및전자회로부품의 제조방법

Country Status (3)

Country Link
US (1) US6887330B2 (enExample)
JP (1) JP3994809B2 (enExample)
KR (1) KR101089187B1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101351262B1 (ko) * 2013-02-07 2014-01-14 세광테크 주식회사 본딩장치용 원자재 자동교체 장치
KR101515720B1 (ko) * 2013-12-23 2015-04-27 세메스 주식회사 이형 필름 공급 장치

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KR100518296B1 (ko) * 1998-09-30 2005-11-25 삼성전자주식회사 분리형 보호시트 이송유닛을 가지는 본딩장치
JP4070135B2 (ja) * 2004-05-11 2008-04-02 沖電気工業株式会社 テープキャリア、半導体装置の製造方法および半導体装置
EP1814369A4 (en) * 2004-10-01 2008-10-29 Toray Industries LONG FILM PCB AND PRODUCTION PROCESS AND PRODUCTION DEVICE THEREFOR
JP4628765B2 (ja) * 2004-12-07 2011-02-09 富士機械製造株式会社 フィルム状テープの供給装置
KR20060069075A (ko) * 2004-12-17 2006-06-21 삼성전자주식회사 액정 표시 장치의 제조 시스템 및 제조 방법
DE102005045549A1 (de) * 2005-09-23 2007-04-05 Vorwerk & Co. Interholding Gmbh Verfahren zum Bestücken eines Teppichs mit elekronischen Bauteilen, Vorrichtung hierzu, sowie Teppich mit elektronischen Bauteilen
CN101267998B (zh) * 2005-12-16 2010-05-19 松下电器产业株式会社 粘合带粘贴装置及其粘贴方法
US7850040B2 (en) * 2006-10-23 2010-12-14 Hover-Davis, Inc. Component tape feeder
JP4514829B2 (ja) * 2007-03-30 2010-07-28 パナソニック株式会社 作業装置、粘着テープ貼付装置およびテープ部材の追加方法
JP2007221169A (ja) * 2007-05-17 2007-08-30 Hitachi High-Technologies Corp 電子回路部品の打ち抜き装置、電子回路部品の打ち抜き装置の供給リール交換方法及び電子回路部品の製造方法
KR100947359B1 (ko) * 2008-04-30 2010-03-15 한국생산기술연구원 오버런 방지디스크 및 이를 이용한 펀칭장치
CN101827681B (zh) * 2008-08-19 2014-12-10 日东电工株式会社 光学薄膜的切断方法以及采用该切断方法的装置
JP5274938B2 (ja) * 2008-08-28 2013-08-28 シャープ株式会社 Ｔａｂテープの梱包方法
KR101486048B1 (ko) * 2008-10-29 2015-01-26 삼성테크윈 주식회사 테이프 피더
KR101563306B1 (ko) 2009-01-19 2015-10-27 한화테크윈 주식회사 전자 부품 공급 장치 및 이를 갖는 칩 마운터
EP2316332A1 (en) * 2009-10-30 2011-05-04 General Electric Company Sensor for measuring amount of substance in blood and method of making the sensor
JP5912836B2 (ja) * 2012-05-14 2016-04-27 株式会社Ｏｋｉデータ・インフォテック インクジェットプリンター
JP6114509B2 (ja) * 2012-06-28 2017-04-12 ヤマハ発動機株式会社 部品供給装置及び部品実装装置
WO2014142389A1 (en) * 2013-03-12 2014-09-18 Samsung Techwin Co., Ltd. Automatic carrier tape feeding apparatus
KR101823926B1 (ko) * 2013-03-12 2018-01-31 한화테크윈 주식회사 캐리어 테이프의 자동 공급 장치
US10015919B2 (en) * 2016-02-26 2018-07-03 Panasonic Intellectual Property Management Co., Ltd. Component supply device
JP6496908B2 (ja) * 2016-10-28 2019-04-10 パナソニックＩｐマネジメント株式会社 部品実装システム
US11064638B2 (en) * 2016-11-10 2021-07-13 YAMAHA HATSUDOKI KABUSHIKl KAISHA Component supply device, surface-mounting machine, and component supply method
KR102678136B1 (ko) * 2018-02-01 2024-06-26 가부시끼가이샤 레조낙 부재 접속 방법 및 접착 테이프
JP7340732B2 (ja) * 2019-03-22 2023-09-08 パナソニックＩｐマネジメント株式会社 部品供給装置、部品実装装置、部品供給方法及び部品実装方法
JP7398724B2 (ja) * 2019-05-15 2023-12-15 パナソニックＩｐマネジメント株式会社 部品装着装置、および部品装着方法
JP7357268B2 (ja) * 2019-06-12 2023-10-06 パナソニックＩｐマネジメント株式会社 部品供給装置
JP7601622B2 (ja) * 2020-12-04 2024-12-17 株式会社ディスコ テープ剥離装置

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JP3865470B2 (ja) * 1997-07-22 2007-01-10 富士機械製造株式会社 テープの連結方法，連結部材および連結工具
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KR101351262B1 (ko) * 2013-02-07 2014-01-14 세광테크 주식회사 본딩장치용 원자재 자동교체 장치
KR101515720B1 (ko) * 2013-12-23 2015-04-27 세메스 주식회사 이형 필름 공급 장치

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US20040069112A1 (en) 2004-04-15
JP2004047553A (ja) 2004-02-12
US6887330B2 (en) 2005-05-03
JP3994809B2 (ja) 2007-10-24
KR20040005653A (ko) 2004-01-16

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