JP3984629B2 - 電子部品用銅系複合基材及び電子部品 - Google Patents

電子部品用銅系複合基材及び電子部品 Download PDF

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Publication number
JP3984629B2
JP3984629B2 JP2005361881A JP2005361881A JP3984629B2 JP 3984629 B2 JP3984629 B2 JP 3984629B2 JP 2005361881 A JP2005361881 A JP 2005361881A JP 2005361881 A JP2005361881 A JP 2005361881A JP 3984629 B2 JP3984629 B2 JP 3984629B2
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JP
Japan
Prior art keywords
copper
base material
based composite
substrate
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005361881A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007162094A (ja
Inventor
靖 真砂
和志 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP2005361881A priority Critical patent/JP3984629B2/ja
Priority to KR1020087009569A priority patent/KR20080050518A/ko
Priority to PCT/JP2006/322625 priority patent/WO2007069419A1/ja
Priority to CN2006800370267A priority patent/CN101297066B/zh
Priority to TW095143779A priority patent/TW200735304A/zh
Publication of JP2007162094A publication Critical patent/JP2007162094A/ja
Application granted granted Critical
Publication of JP3984629B2 publication Critical patent/JP3984629B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C23C16/402—Silicon dioxide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • C23C16/0281—Deposition of sub-layers, e.g. to promote the adhesion of the main coating of metallic sub-layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42—Silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP2005361881A 2005-12-15 2005-12-15 電子部品用銅系複合基材及び電子部品 Expired - Fee Related JP3984629B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005361881A JP3984629B2 (ja) 2005-12-15 2005-12-15 電子部品用銅系複合基材及び電子部品
KR1020087009569A KR20080050518A (ko) 2005-12-15 2006-11-14 전자 부품용 구리계 복합 기재, 전자 부품 및 전자 부품용구리계 복합 기재의 제조 방법
PCT/JP2006/322625 WO2007069419A1 (ja) 2005-12-15 2006-11-14 電子部品用銅系複合基材、電子部品及び電子部品用銅系複合基材の製造方法
CN2006800370267A CN101297066B (zh) 2005-12-15 2006-11-14 电子部件用铜系复合基材、电子部件及电子部件用铜系复合基材的制造方法
TW095143779A TW200735304A (en) 2005-12-15 2006-11-27 Electronic spare parts of copper series composite substrate, electronic spare parts and the manufacturing method for electronic spare part of copper series composite substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005361881A JP3984629B2 (ja) 2005-12-15 2005-12-15 電子部品用銅系複合基材及び電子部品

Publications (2)

Publication Number Publication Date
JP2007162094A JP2007162094A (ja) 2007-06-28
JP3984629B2 true JP3984629B2 (ja) 2007-10-03

Family

ID=38162733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005361881A Expired - Fee Related JP3984629B2 (ja) 2005-12-15 2005-12-15 電子部品用銅系複合基材及び電子部品

Country Status (5)

Country Link
JP (1) JP3984629B2 (zh)
KR (1) KR20080050518A (zh)
CN (1) CN101297066B (zh)
TW (1) TW200735304A (zh)
WO (1) WO2007069419A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5134343B2 (ja) * 2007-11-20 2013-01-30 株式会社神戸製鋼所 薄膜形成装置及び薄膜形成方法
CN102544131A (zh) * 2012-03-12 2012-07-04 谢振华 一种改进的太阳能电池板的电极结构
JP2018204054A (ja) * 2017-05-31 2018-12-27 住友金属鉱山株式会社 金属部材の製造方法、プリント基板の製造方法、金属部材及びプリント基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63207158A (ja) * 1987-02-23 1988-08-26 Mitsubishi Electric Corp 樹脂封止型半導体装置
JP4379854B2 (ja) * 2001-10-30 2009-12-09 日鉱金属株式会社 表面処理銅箔
CN1242092C (zh) * 2001-11-19 2006-02-15 乐金电子(天津)电器有限公司 一种利用等离子体技术的金属抗腐蚀处理方法
JP4453443B2 (ja) * 2004-05-27 2010-04-21 パナソニック株式会社 錫めっき皮膜及びめっき皮膜の製造方法

Also Published As

Publication number Publication date
WO2007069419A1 (ja) 2007-06-21
TWI357641B (zh) 2012-02-01
CN101297066B (zh) 2010-06-09
KR20080050518A (ko) 2008-06-05
TW200735304A (en) 2007-09-16
JP2007162094A (ja) 2007-06-28
CN101297066A (zh) 2008-10-29

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