TW200735304A - Electronic spare parts of copper series composite substrate, electronic spare parts and the manufacturing method for electronic spare part of copper series composite substrate - Google Patents

Electronic spare parts of copper series composite substrate, electronic spare parts and the manufacturing method for electronic spare part of copper series composite substrate

Info

Publication number
TW200735304A
TW200735304A TW095143779A TW95143779A TW200735304A TW 200735304 A TW200735304 A TW 200735304A TW 095143779 A TW095143779 A TW 095143779A TW 95143779 A TW95143779 A TW 95143779A TW 200735304 A TW200735304 A TW 200735304A
Authority
TW
Taiwan
Prior art keywords
composite substrate
electronic spare
series composite
copper
copper series
Prior art date
Application number
TW095143779A
Other languages
Chinese (zh)
Other versions
TWI357641B (en
Inventor
Kazushi Hayashi
Yasushi Masago
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of TW200735304A publication Critical patent/TW200735304A/en
Application granted granted Critical
Publication of TWI357641B publication Critical patent/TWI357641B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C23C16/402—Silicon dioxide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • C23C16/0281—Deposition of sub-layers, e.g. to promote the adhesion of the main coating of metallic sub-layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42—Silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The invention provides an electronic spare parts of copper series composite substrate. The characteristic is covering tin or tin series alloy on the surface of copper substrate or copper alloy substrate to construct a covering layer of copper series composite substrate. It includes silicon oxide thin film containing hydrocarbon group and/or hydroxyl group adhering on the surface of the said covering layer. This type electronic spare part of copper series composite substrate is using resin to seal or adhere the copper series composite substrate. The sealing and adhering property between the substrate and the resin components is high.
TW095143779A 2005-12-15 2006-11-27 Electronic spare parts of copper series composite substrate, electronic spare parts and the manufacturing method for electronic spare part of copper series composite substrate TW200735304A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005361881A JP3984629B2 (en) 2005-12-15 2005-12-15 Copper-based composite substrate for electronic parts and electronic parts

Publications (2)

Publication Number Publication Date
TW200735304A true TW200735304A (en) 2007-09-16
TWI357641B TWI357641B (en) 2012-02-01

Family

ID=38162733

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143779A TW200735304A (en) 2005-12-15 2006-11-27 Electronic spare parts of copper series composite substrate, electronic spare parts and the manufacturing method for electronic spare part of copper series composite substrate

Country Status (5)

Country Link
JP (1) JP3984629B2 (en)
KR (1) KR20080050518A (en)
CN (1) CN101297066B (en)
TW (1) TW200735304A (en)
WO (1) WO2007069419A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5134343B2 (en) * 2007-11-20 2013-01-30 株式会社神戸製鋼所 Thin film forming apparatus and thin film forming method
CN102544131A (en) * 2012-03-12 2012-07-04 谢振华 Improved electrode structure for solar battery panel
JP2018204054A (en) * 2017-05-31 2018-12-27 住友金属鉱山株式会社 Method for manufacturing metal member, method for manufacturing printed circuit board, metal member, and printed circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63207158A (en) * 1987-02-23 1988-08-26 Mitsubishi Electric Corp Resin sealed type semiconductor device
JP4379854B2 (en) * 2001-10-30 2009-12-09 日鉱金属株式会社 Surface treated copper foil
CN1242092C (en) * 2001-11-19 2006-02-15 乐金电子(天津)电器有限公司 Method for anticorrosion treatment of metal by plasma technique
JP4453443B2 (en) * 2004-05-27 2010-04-21 パナソニック株式会社 Tin plating film and method for producing plating film

Also Published As

Publication number Publication date
WO2007069419A1 (en) 2007-06-21
TWI357641B (en) 2012-02-01
CN101297066B (en) 2010-06-09
KR20080050518A (en) 2008-06-05
JP2007162094A (en) 2007-06-28
JP3984629B2 (en) 2007-10-03
CN101297066A (en) 2008-10-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees