JP3980351B2 - 導電性パターン材料及び導電性パターンの形成方法 - Google Patents

導電性パターン材料及び導電性パターンの形成方法 Download PDF

Info

Publication number
JP3980351B2
JP3980351B2 JP2001398048A JP2001398048A JP3980351B2 JP 3980351 B2 JP3980351 B2 JP 3980351B2 JP 2001398048 A JP2001398048 A JP 2001398048A JP 2001398048 A JP2001398048 A JP 2001398048A JP 3980351 B2 JP3980351 B2 JP 3980351B2
Authority
JP
Japan
Prior art keywords
group
hydrophilic
pattern
conductive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001398048A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003114525A5 (enrdf_load_stackoverflow
JP2003114525A (ja
Inventor
浩一 川村
純明 山崎
美紀 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2001398048A priority Critical patent/JP3980351B2/ja
Priority to US10/208,820 priority patent/US6919158B2/en
Priority to EP02016949A priority patent/EP1282175A3/en
Publication of JP2003114525A publication Critical patent/JP2003114525A/ja
Publication of JP2003114525A5 publication Critical patent/JP2003114525A5/ja
Application granted granted Critical
Publication of JP3980351B2 publication Critical patent/JP3980351B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
JP2001398048A 2001-08-03 2001-12-27 導電性パターン材料及び導電性パターンの形成方法 Expired - Fee Related JP3980351B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001398048A JP3980351B2 (ja) 2001-08-03 2001-12-27 導電性パターン材料及び導電性パターンの形成方法
US10/208,820 US6919158B2 (en) 2001-08-03 2002-08-01 Conductive pattern material and method for forming conductive pattern
EP02016949A EP1282175A3 (en) 2001-08-03 2002-08-01 Conductive pattern material and method for forming conductive pattern

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-236893 2001-08-03
JP2001236893 2001-08-03
JP2001398048A JP3980351B2 (ja) 2001-08-03 2001-12-27 導電性パターン材料及び導電性パターンの形成方法

Publications (3)

Publication Number Publication Date
JP2003114525A JP2003114525A (ja) 2003-04-18
JP2003114525A5 JP2003114525A5 (enrdf_load_stackoverflow) 2005-08-04
JP3980351B2 true JP3980351B2 (ja) 2007-09-26

Family

ID=26619954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001398048A Expired - Fee Related JP3980351B2 (ja) 2001-08-03 2001-12-27 導電性パターン材料及び導電性パターンの形成方法

Country Status (1)

Country Link
JP (1) JP3980351B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003076004A (ja) * 2001-09-04 2003-03-14 Fuji Photo Film Co Ltd パターン形成方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684632B2 (ja) * 2003-11-27 2011-05-18 富士フイルム株式会社 金属パターン形成方法、金属パターン及びプリント配線板
MY148655A (en) 2003-11-27 2013-05-15 Fuji Photo Film Co Ltd Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same
JPWO2005116763A1 (ja) * 2004-05-31 2008-04-03 富士フイルム株式会社 グラフトパターン形成方法、グラフトパターン材料、リソグラフィ方法、導電性パターン形成方法、導電性パターン、カラーフィルタの製造方法、カラーフィルタ、及びマイクロレンズの製造方法
JP2005347424A (ja) * 2004-06-01 2005-12-15 Fuji Photo Film Co Ltd 多層配線板及びその製造方法
EP1802184B1 (en) * 2004-08-26 2010-11-03 FUJIFILM Corporation Method for manufacturing an electro-conductive pattern material
JP2006078600A (ja) * 2004-09-07 2006-03-23 Fuji Photo Film Co Ltd 電気光学装置の製造方法
KR100955860B1 (ko) 2005-02-08 2010-05-06 후지필름 가부시키가이샤 금속패턴 형성방법
JP5085043B2 (ja) * 2005-02-25 2012-11-28 富士フイルム株式会社 導電膜の形成方法、及び導電パターン形成方法
JP2007017910A (ja) * 2005-07-11 2007-01-25 Fujifilm Holdings Corp グラフトパターン材料、導電性パターン材料及びこれらの形成方法
JP6149466B2 (ja) * 2013-03-29 2017-06-21 Jsr株式会社 導電性パターン形成方法、樹脂組成物、導電性パターンおよび電子回路
TWI617629B (zh) 2013-05-01 2018-03-11 Jsr股份有限公司 具有凹圖案的基材的製造方法、組成物、導電膜的形成方法、電子電路及電子元件
JP6414203B2 (ja) 2014-03-14 2018-10-31 Jsr株式会社 配線の製造方法、電子回路の製造方法および電子デバイスの製造方法
JP6528776B2 (ja) 2014-09-12 2019-06-12 Jsr株式会社 凹パターンを有する構造体の製造方法、樹脂組成物、導電膜の形成方法、電子回路及び電子デバイス
JP6561754B2 (ja) 2014-10-31 2019-08-21 Jsr株式会社 親液部と撥液部を有する基材の製造方法、組成物および導電膜の形成方法
JP6175205B1 (ja) * 2017-02-01 2017-08-02 太陽インキ製造株式会社 感光性フィルム、感光性フィルム積層体およびそれらを用いて形成された硬化物
JP6199524B1 (ja) * 2017-07-03 2017-09-20 太陽インキ製造株式会社 感光性フィルム、感光性フィルム積層体およびそれらを用いて形成された硬化物
JP6199525B1 (ja) * 2017-07-03 2017-09-20 太陽インキ製造株式会社 感光性フィルム、感光性フィルム積層体およびそれらを用いて形成された硬化物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147641A (ja) * 1984-08-15 1986-03-08 Toshiba Corp レジストパタ−ンの形成方法
JPS6396655A (ja) * 1986-10-14 1988-04-27 Matsushita Electric Ind Co Ltd パタ−ン形成方法
JPH0524951A (ja) * 1991-07-24 1993-02-02 Unitika Ltd 成形体表面の親水加工法
JPH0786125A (ja) * 1993-09-10 1995-03-31 Toshiba Corp パターン形成方法
JPH07252440A (ja) * 1994-03-15 1995-10-03 Kao Corp 所定の導電性パターンが施された製品及びその製造方法
JP3379420B2 (ja) * 1997-01-21 2003-02-24 信越化学工業株式会社 パターン形成方法
JPH11232940A (ja) * 1998-02-12 1999-08-27 Fuji Photo Film Co Ltd 透明導電体の製造方法および透明導電性フイルム
JP2001117223A (ja) * 1999-08-12 2001-04-27 Fuji Photo Film Co Ltd 平版印刷版用原版
JP2001183817A (ja) * 1999-10-13 2001-07-06 Fuji Photo Film Co Ltd 平版印刷版用原版
JP3836717B2 (ja) * 2001-12-19 2006-10-25 富士写真フイルム株式会社 導電性パターン材料及び導電性パターン形成方法
JP3768857B2 (ja) * 2001-10-11 2006-04-19 富士写真フイルム株式会社 パターン形成材料及び画像形成方法
JP4672233B2 (ja) * 2001-11-06 2011-04-20 大日本印刷株式会社 導電性パターン形成体の製造方法
JP4266596B2 (ja) * 2001-11-06 2009-05-20 大日本印刷株式会社 導電性パターン形成体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003076004A (ja) * 2001-09-04 2003-03-14 Fuji Photo Film Co Ltd パターン形成方法

Also Published As

Publication number Publication date
JP2003114525A (ja) 2003-04-18

Similar Documents

Publication Publication Date Title
JP3980351B2 (ja) 導電性パターン材料及び導電性パターンの形成方法
JP4408346B2 (ja) 導電性パターン材料、金属微粒子パターン材料及びパターン形成方法
JP4684632B2 (ja) 金属パターン形成方法、金属パターン及びプリント配線板
US6919158B2 (en) Conductive pattern material and method for forming conductive pattern
US6878470B2 (en) Visible image receiving material, conductive pattern material and organic electroluminescence element, using member having surface hydrophilicity
WO2007055223A1 (ja) 金属膜形成方法及び金属パターン形成方法
US7867688B2 (en) Laser ablation resist
KR101001248B1 (ko) 표면특성을 이용한 금속패턴 형성방법 및 이에 따라 형성된금속패턴
JP3836717B2 (ja) 導電性パターン材料及び導電性パターン形成方法
JP2005101554A (ja) 導電性パターン材料及び導電性パターンの形成方法
JP2004285325A (ja) パターン形成方法及び物質付着パターン材料
US7438950B2 (en) Metallic pattern forming method and conductive pattern material
JP2003076004A (ja) パターン形成方法
EP1271243A2 (en) Image forming material, color filter master plate, and color filter
WO1997015173A1 (en) Method for radiation-induced thermal transfer of resist for flexible printed circuitry
JP4606899B2 (ja) 金属パターン形成方法、金属パターン及びそれを用いたプリント配線板並びにｔｆｔ配線回路
JP2003009860A (ja) 区画培養基板及びそれを用いたｄｎａチップ
JP4606894B2 (ja) 金属パターン形成方法、金属パターン及びそれを用いたプリント配線板並びにｔｆｔ配線回路
JP2003215816A (ja) 導電性パターン材料及び導電性パターン形成方法
EP1580595A2 (en) Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material
JP4180004B2 (ja) パターン形成方法、グラフトパターン材料、導電性パターン形成方法、及び導電性パターン材料
JP4505261B2 (ja) 金属パターン形成方法
JP3768857B2 (ja) パターン形成材料及び画像形成方法
JP2001117223A (ja) 平版印刷版用原版
JP4262910B2 (ja) マイクロレンズの製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041227

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041227

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20061110

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061121

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070122

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20070122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070313

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070511

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070626

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070627

R150 Certificate of patent or registration of utility model

Ref document number: 3980351

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100706

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110706

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110706

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120706

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120706

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130706

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees