JP3908549B2 - Ｒｆｉｄタグの製造方法 - Google Patents

Ｒｆｉｄタグの製造方法 Download PDF

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Publication number
JP3908549B2
JP3908549B2 JP2002024295A JP2002024295A JP3908549B2 JP 3908549 B2 JP3908549 B2 JP 3908549B2 JP 2002024295 A JP2002024295 A JP 2002024295A JP 2002024295 A JP2002024295 A JP 2002024295A JP 3908549 B2 JP3908549 B2 JP 3908549B2
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Japan
Prior art keywords
chip
rfid tag
base material
antenna pattern
recess
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Expired - Fee Related
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JP2002024295A
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English (en)
Japanese (ja)
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JP2003223626A5 (enExample
JP2003223626A (ja
Inventor
浩 山本
清 小口
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to JP2002024295A priority Critical patent/JP3908549B2/ja
Publication of JP2003223626A publication Critical patent/JP2003223626A/ja
Publication of JP2003223626A5 publication Critical patent/JP2003223626A5/ja
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Publication of JP3908549B2 publication Critical patent/JP3908549B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95136—Aligning the plurality of semiconductor or solid-state bodies involving guiding structures, e.g. shape matching, spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01072—Hafnium [Hf]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
JP2002024295A 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法 Expired - Fee Related JP3908549B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002024295A JP3908549B2 (ja) 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002024295A JP3908549B2 (ja) 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法

Publications (3)

Publication Number Publication Date
JP2003223626A JP2003223626A (ja) 2003-08-08
JP2003223626A5 JP2003223626A5 (enExample) 2005-08-11
JP3908549B2 true JP3908549B2 (ja) 2007-04-25

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JP2002024295A Expired - Fee Related JP3908549B2 (ja) 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法

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JP (1) JP3908549B2 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6867983B2 (en) 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
JP2006511969A (ja) * 2002-12-18 2006-04-06 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 液体の小滴でのマイクロメートル寸法の電子物体の操作
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US20040200061A1 (en) 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
JP4504694B2 (ja) * 2004-01-30 2010-07-14 トッパン・フォームズ株式会社 スレッドの製造方法及びｉｃチップ入りシートの製造方法、並びにこれらによって製造されたスレッド及びｉｃチップ入りシート
JP2006031336A (ja) * 2004-07-15 2006-02-02 Fujitsu Ltd Ｒｆｉｄタグの製造方法
JP4653440B2 (ja) * 2004-08-13 2011-03-16 富士通株式会社 Ｒｆｉｄタグおよびその製造方法
US7202790B2 (en) * 2004-08-13 2007-04-10 Sensormatic Electronics Corporation Techniques for tuning an antenna to different operating frequencies
US8698262B2 (en) 2004-09-14 2014-04-15 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and manufacturing method of the same
JP4845461B2 (ja) * 2004-09-14 2011-12-28 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP5057767B2 (ja) * 2006-01-10 2012-10-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20070158804A1 (en) 2006-01-10 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of semiconductor device, and RFID tag
JP2007274379A (ja) * 2006-03-31 2007-10-18 Sumitomo Chemical Co Ltd 無線タグ及びその製造方法
JP2008041005A (ja) * 2006-08-10 2008-02-21 Hitachi Ltd Ｒｆｉｄタグおよびその製造方法
EP2567995B1 (en) 2006-12-26 2014-02-19 Asahi Kasei E-materials Corporation Resin composition for printing plate
TWI423519B (zh) 2007-09-04 2014-01-11 Mitsubishi Electric Corp Radio frequency identification tag
JP5466381B2 (ja) * 2008-07-23 2014-04-09 株式会社沖データ 媒体搬送装置、印刷媒体、画像形成装置、及び画像形成方法
JP5114357B2 (ja) * 2008-10-09 2013-01-09 株式会社日立製作所 無線ｉｃタグ
JP5284858B2 (ja) * 2009-04-22 2013-09-11 富士通株式会社 Ｒｆｉｄタグ
WO2011055171A1 (en) * 2009-11-09 2011-05-12 Time Reversal Communications Device for receiving and / or emitting electromanetic waves
JP2014157180A (ja) * 2013-02-14 2014-08-28 Ricoh Co Ltd Ｒｆｉｄ粘着感熱ラベル
EP2767935A1 (fr) * 2013-02-18 2014-08-20 NagraID S.A. Couche plastique pour carte électronique
JP6079932B2 (ja) * 2014-04-28 2017-02-15 株式会社村田製作所 無線ｉｃデバイス、クリップ状ｒｆｉｄタグおよびｒｆｉｄタグ付き物品
JP7312355B2 (ja) * 2019-03-27 2023-07-21 大日本印刷株式会社 Ｉｃタグ、ｉｃタグの製造方法、及びｉｃ保持部の製造方法
CN114729246B (zh) * 2019-12-23 2024-05-28 三井化学株式会社 电子标签用粘接剂及电子标签

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