JP3908549B2 - Ｒｆｉｄタグの製造方法 - Google Patents

Ｒｆｉｄタグの製造方法 Download PDF

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Publication number
JP3908549B2
JP3908549B2 JP2002024295A JP2002024295A JP3908549B2 JP 3908549 B2 JP3908549 B2 JP 3908549B2 JP 2002024295 A JP2002024295 A JP 2002024295A JP 2002024295 A JP2002024295 A JP 2002024295A JP 3908549 B2 JP3908549 B2 JP 3908549B2
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Japan
Prior art keywords
chip
rfid tag
base material
antenna pattern
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002024295A
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English (en)
Japanese (ja)
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JP2003223626A5 (enExample
JP2003223626A (ja
Inventor
浩 山本
清 小口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2002024295A priority Critical patent/JP3908549B2/ja
Publication of JP2003223626A publication Critical patent/JP2003223626A/ja
Publication of JP2003223626A5 publication Critical patent/JP2003223626A5/ja
Application granted granted Critical
Publication of JP3908549B2 publication Critical patent/JP3908549B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

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  • Support Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
JP2002024295A 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法 Expired - Fee Related JP3908549B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002024295A JP3908549B2 (ja) 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002024295A JP3908549B2 (ja) 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法

Publications (3)

Publication Number Publication Date
JP2003223626A JP2003223626A (ja) 2003-08-08
JP2003223626A5 JP2003223626A5 (enExample) 2005-08-11
JP3908549B2 true JP3908549B2 (ja) 2007-04-25

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JP2002024295A Expired - Fee Related JP3908549B2 (ja) 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法

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JP (1) JP3908549B2 (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6867983B2 (en) 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
WO2004055887A2 (en) * 2002-12-18 2004-07-01 Koninklijke Philips Electronics N.V. Manipulation of micrometer-sized electronic objects with liquid droplets
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
US20040200061A1 (en) 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
JP4504694B2 (ja) * 2004-01-30 2010-07-14 トッパン・フォームズ株式会社 スレッドの製造方法及びｉｃチップ入りシートの製造方法、並びにこれらによって製造されたスレッド及びｉｃチップ入りシート
JP2006031336A (ja) 2004-07-15 2006-02-02 Fujitsu Ltd Ｒｆｉｄタグの製造方法
JP4653440B2 (ja) 2004-08-13 2011-03-16 富士通株式会社 Ｒｆｉｄタグおよびその製造方法
US7202790B2 (en) * 2004-08-13 2007-04-10 Sensormatic Electronics Corporation Techniques for tuning an antenna to different operating frequencies
US8698262B2 (en) 2004-09-14 2014-04-15 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and manufacturing method of the same
JP4845461B2 (ja) * 2004-09-14 2011-12-28 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP5057767B2 (ja) * 2006-01-10 2012-10-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20070158804A1 (en) 2006-01-10 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of semiconductor device, and RFID tag
JP2007274379A (ja) * 2006-03-31 2007-10-18 Sumitomo Chemical Co Ltd 無線タグ及びその製造方法
JP2008041005A (ja) * 2006-08-10 2008-02-21 Hitachi Ltd Ｒｆｉｄタグおよびその製造方法
WO2008078699A1 (ja) 2006-12-26 2008-07-03 Asahi Kasei E-Materials Corporation 印刷版用樹脂組成物
TWI423519B (zh) 2007-09-04 2014-01-11 Mitsubishi Electric Corp Radio frequency identification tag
JP5466381B2 (ja) * 2008-07-23 2014-04-09 株式会社沖データ 媒体搬送装置、印刷媒体、画像形成装置、及び画像形成方法
JP5114357B2 (ja) * 2008-10-09 2013-01-09 株式会社日立製作所 無線ｉｃタグ
JP5284858B2 (ja) * 2009-04-22 2013-09-11 富士通株式会社 Ｒｆｉｄタグ
WO2011055171A1 (en) * 2009-11-09 2011-05-12 Time Reversal Communications Device for receiving and / or emitting electromanetic waves
JP2014157180A (ja) * 2013-02-14 2014-08-28 Ricoh Co Ltd Ｒｆｉｄ粘着感熱ラベル
EP2767935A1 (fr) * 2013-02-18 2014-08-20 NagraID S.A. Couche plastique pour carte électronique
WO2015166832A1 (ja) * 2014-04-28 2015-11-05 株式会社 村田製作所 無線ｉｃデバイス、クリップ状ｒｆｉｄタグおよびｒｆｉｄタグ付き物品
JP7312355B2 (ja) * 2019-03-27 2023-07-21 大日本印刷株式会社 Ｉｃタグ、ｉｃタグの製造方法、及びｉｃ保持部の製造方法
JP7696298B2 (ja) * 2019-12-23 2025-06-20 三井化学株式会社 電子タグ用接着剤および電子タグ
CN121098355A (zh) * 2024-08-02 2025-12-09 支付宝(杭州)数字服务技术有限公司 用于实现近场通信的电路单元和nfc设备

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JP2003223626A (ja) 2003-08-08

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