JP3877911B2 - めっき装置 - Google Patents
めっき装置 Download PDFInfo
- Publication number
- JP3877911B2 JP3877911B2 JP19492299A JP19492299A JP3877911B2 JP 3877911 B2 JP3877911 B2 JP 3877911B2 JP 19492299 A JP19492299 A JP 19492299A JP 19492299 A JP19492299 A JP 19492299A JP 3877911 B2 JP3877911 B2 JP 3877911B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating solution
- substrate
- plated
- porous body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims description 222
- 239000000758 substrate Substances 0.000 claims description 108
- 239000011148 porous material Substances 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19492299A JP3877911B2 (ja) | 1999-07-08 | 1999-07-08 | めっき装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19492299A JP3877911B2 (ja) | 1999-07-08 | 1999-07-08 | めっき装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001024308A JP2001024308A (ja) | 2001-01-26 |
| JP2001024308A5 JP2001024308A5 (enExample) | 2004-12-02 |
| JP3877911B2 true JP3877911B2 (ja) | 2007-02-07 |
Family
ID=16332586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19492299A Expired - Fee Related JP3877911B2 (ja) | 1999-07-08 | 1999-07-08 | めっき装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3877911B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6585876B2 (en) * | 1999-04-08 | 2003-07-01 | Applied Materials Inc. | Flow diffuser to be used in electro-chemical plating system and method |
| JP4694008B2 (ja) * | 2001-02-15 | 2011-06-01 | イビデン株式会社 | 電解めっき装置、電気めっき装置用めっき液保持部材、銅配線半導体の製造方法 |
| TWI229367B (en) | 2002-12-26 | 2005-03-11 | Canon Kk | Chemical treatment apparatus and chemical treatment method |
| JP2005248277A (ja) * | 2004-03-05 | 2005-09-15 | Ebara Corp | メッキ装置の電極構造 |
| US7563348B2 (en) | 2004-06-28 | 2009-07-21 | Lam Research Corporation | Electroplating head and method for operating the same |
-
1999
- 1999-07-08 JP JP19492299A patent/JP3877911B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001024308A (ja) | 2001-01-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6599402B2 (en) | Electro-chemical deposition cell for face-up processing of single semiconductor substrates | |
| US7387717B2 (en) | Method of performing electrolytic treatment on a conductive layer of a substrate | |
| US10301738B2 (en) | Methods and apparatus for wetting pretreatment for through resist metal plating | |
| US20050145482A1 (en) | Apparatus and method for processing substrate | |
| JP4434948B2 (ja) | めっき装置及びめっき方法 | |
| KR102113883B1 (ko) | 관통 레지스트 금속 도금을 위한 웨팅 전처리의 방법들 및 장치 | |
| KR100802122B1 (ko) | 도금 장치 및 도금액 제거 방법 | |
| US7374646B2 (en) | Electrolytic processing apparatus and substrate processing method | |
| US6746589B2 (en) | Plating method and plating apparatus | |
| JPH11279797A (ja) | 基板メッキ装置 | |
| JP3877911B2 (ja) | めっき装置 | |
| US20050247567A1 (en) | Method of plating | |
| JP3877910B2 (ja) | めっき装置 | |
| JP3698596B2 (ja) | めっき装置及びめっき方法 | |
| JP3667224B2 (ja) | めっき装置 | |
| JP2004300462A (ja) | めっき方法及びめっき装置 | |
| JP2003119597A (ja) | メッキ装置及びメッキ方法 | |
| JP2001049498A (ja) | めっき装置 | |
| JP3836632B2 (ja) | めっき装置 | |
| JP3657173B2 (ja) | 基板めっき装置 | |
| JP3706770B2 (ja) | 基板メッキ装置 | |
| JP4553632B2 (ja) | 基板めっき方法及び基板めっき装置 | |
| JP2001049494A (ja) | めっき装置 | |
| JP3778239B2 (ja) | めっき装置及びそれを用いた基板の加工方法 | |
| JPH03202488A (ja) | メッキ装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20031211 Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20031211 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20031211 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060418 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060425 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060626 Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20060626 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20061031 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20061101 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091110 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101110 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111110 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121110 Year of fee payment: 6 |
|
| LAPS | Cancellation because of no payment of annual fees |