JP2001024308A5 - - Google Patents

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Publication number
JP2001024308A5
JP2001024308A5 JP1999194922A JP19492299A JP2001024308A5 JP 2001024308 A5 JP2001024308 A5 JP 2001024308A5 JP 1999194922 A JP1999194922 A JP 1999194922A JP 19492299 A JP19492299 A JP 19492299A JP 2001024308 A5 JP2001024308 A5 JP 2001024308A5
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JP
Japan
Prior art keywords
plated
plating
plating solution
substrate
pores
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999194922A
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English (en)
Japanese (ja)
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JP3877911B2 (ja
JP2001024308A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP19492299A priority Critical patent/JP3877911B2/ja
Priority claimed from JP19492299A external-priority patent/JP3877911B2/ja
Publication of JP2001024308A publication Critical patent/JP2001024308A/ja
Publication of JP2001024308A5 publication Critical patent/JP2001024308A5/ja
Application granted granted Critical
Publication of JP3877911B2 publication Critical patent/JP3877911B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP19492299A 1999-07-08 1999-07-08 めっき装置 Expired - Fee Related JP3877911B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19492299A JP3877911B2 (ja) 1999-07-08 1999-07-08 めっき装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19492299A JP3877911B2 (ja) 1999-07-08 1999-07-08 めっき装置

Publications (3)

Publication Number Publication Date
JP2001024308A JP2001024308A (ja) 2001-01-26
JP2001024308A5 true JP2001024308A5 (enExample) 2004-12-02
JP3877911B2 JP3877911B2 (ja) 2007-02-07

Family

ID=16332586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19492299A Expired - Fee Related JP3877911B2 (ja) 1999-07-08 1999-07-08 めっき装置

Country Status (1)

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JP (1) JP3877911B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6585876B2 (en) * 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
JP4694008B2 (ja) * 2001-02-15 2011-06-01 イビデン株式会社 電解めっき装置、電気めっき装置用めっき液保持部材、銅配線半導体の製造方法
TWI229367B (en) 2002-12-26 2005-03-11 Canon Kk Chemical treatment apparatus and chemical treatment method
JP2005248277A (ja) * 2004-03-05 2005-09-15 Ebara Corp メッキ装置の電極構造
US7563348B2 (en) 2004-06-28 2009-07-21 Lam Research Corporation Electroplating head and method for operating the same

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