JP2001024308A5

JP2001024308A5 -

Info

Publication number: JP2001024308A5
Application number: JP1999194922A
Authority: JP
Filing date: 1999-07-08
Publication date: 2004-12-02
Anticipated expiration: 2019-07-08

Description

【０００８】
【課題を解決するための手段】
上記課題を解決するため、請求項１に記載の発明は、被めっき基板のめっきを施す面を上に向けて配置し、該被めっき基板に対向して上方にめっき液室を配置し、該めっき液室内に被めっき基板のめっきを施す面に対向して陽極電極板を配置し、該めっき室の下面に複数の細孔が形成された多孔体を設け、めっき液室に供給しためっき液を該多孔体の複数の細孔を通して被めっき基板のめっきを施す面に供給するように構成したことを特徴とする。[0008]
[Means for Solving the Problems]
In order to solve the above problems, the invention according to claim 1 is disposed with the surface to be plated of the substrate to be plated facing up, and the plating solution chamber is disposed above the substrate to be plated, An anodic electrode plate is disposed in the plating solution chamber opposite to the surface to be plated of the substrate to be plated, and a porous body provided with a plurality of pores is provided on the lower surface of the plating chamber, and the plating solution supplied to the plating solution chamber Are supplied to the surface to be plated of the substrate to be plated through the plurality of pores of the porous body.

【０００９】
上記のように、めっき室の下面に複数の細孔を有する多孔体を設けたことにより、めっき液室にめっき液の供給を停止しても多孔体の細孔内のめっき液の表面力によりめっき液をめっき液室内に保つことができ、陽極電極板に形成されたブラックフィルムは被めっき基板の交換時にもめっき液で覆われ、空気中に露出することがなく、ブラックフィルムの状態を安定した状態に維持することができるから、高品質のめっきを安定的に行うことができるめっき装置となる。しかも、被めっき基板のめっきを施す面を上に向けて配置しているから、めっき面に気泡が付着することがなくなる。[0009]
As described above, by providing the porous body having a plurality of pores on the lower surface of the plating chamber, even if the supply of the plating solution is stopped in the plating solution chamber, the surface force of the plating solution in the pores of the porous body The plating solution can be kept in the plating solution chamber, and the black film formed on the anode plate is covered with the plating solution even when the substrate to be plated is replaced, and is not exposed to air, and the black film is stable Therefore, the plating apparatus can stably perform high-quality plating. In addition, since the surface to be plated of the substrate to be plated is faced upward, the bubbles do not adhere to the plating surface.

Claims

The surface to be plated of the substrate to be plated is disposed upward, the plating solution chamber is disposed above the substrate to be plated, and the surface to be plated of the substrate to be plated is disposed in the plating solution chamber. an anode electrode plate arranged Te, the plating chamber lower surface porosity plurality of pores are formed in the body of disposed, the substrate-to-be-plated the plating solution supplied to the plating liquid chamber through a plurality of pores of the porous body A plating apparatus characterized in that it is supplied to a surface to be plated.

In the plating apparatus according to claim 1,
An inside diameter of pores of the porous body is 5 mm or less, and a length thereof is 3 times or more of the inside diameter.

In the plating apparatus according to claim 2,
An inner surface of pores of the porous body is hydrophobic.

The plating apparatus according to any one of claims 1 to 3
A plating apparatus characterized in that a closing valve is provided immediately before the plating solution chamber of a plating solution supply path for supplying a plating solution to the plating solution chamber.