JP2001329400A - Plating device and plating method - Google Patents

Plating device and plating method

Info

Publication number
JP2001329400A
JP2001329400A JP2000144873A JP2000144873A JP2001329400A JP 2001329400 A JP2001329400 A JP 2001329400A JP 2000144873 A JP2000144873 A JP 2000144873A JP 2000144873 A JP2000144873 A JP 2000144873A JP 2001329400 A JP2001329400 A JP 2001329400A
Authority
JP
Japan
Prior art keywords
plating
plate
plated
opening
shielding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000144873A
Other languages
Japanese (ja)
Inventor
Kunio Katsuyama
邦夫 勝山
Ryuichi Sugano
龍一 菅野
Hiromi Shiina
宏実 椎名
Takeya Eguchi
武也 江口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Kyowa Engineering Co Ltd
Original Assignee
Hitachi Kyowa Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kyowa Engineering Co Ltd filed Critical Hitachi Kyowa Engineering Co Ltd
Priority to JP2000144873A priority Critical patent/JP2001329400A/en
Publication of JP2001329400A publication Critical patent/JP2001329400A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a plating device and plating method which exhibit the performance, such as a plating film thickness distribution, equal to or higher than that of the conventional system by providing a plating tank which is simple the structure of the plating tank by taking advantage of a single sheet shielding plate system, is short and compact in length and is simple in the work for controlling and regulating the film thickness distribution. SOLUTION: This plating device has the plating tank and is pendently provided with an anode plate 7 in the plating tank 1. An object to be plated 8 is pendently disposed to face the anode plate and a sheet of the shielding plate 11 having an aperture 30 is disposed between the anode plate 7 and cathode holder 9 in the plating liquid in the plating tank. The opening area of this aperture is made adjustable.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、被めっき物、特に
半導体基板上に金属皮膜を形成するめっき装置に係り、
特にめっき液中に配置される陽極板と陰極板との間に遮
蔽板を有するめっき装置およびめっき方法に関する。
The present invention relates to a plating apparatus for forming a metal film on an object to be plated, particularly a semiconductor substrate,
In particular, the present invention relates to a plating apparatus and a plating method having a shielding plate between an anode plate and a cathode plate arranged in a plating solution.

【0002】[0002]

【従来の技術】めっき装置に関する開示された従来技術
としては、めっき膜厚分布を高精度に制御するを目的と
して、特公平4−43990号公報によれば、磁性合金
膜をめっきする際、陽極板と陰極板間に水平電流路を設
ける構造を採用している。
2. Description of the Related Art Japanese Patent Publication No. 43990/1992 discloses a conventional technique relating to a plating apparatus for controlling a plating film thickness distribution with high accuracy. A structure in which a horizontal current path is provided between the plate and the cathode plate is adopted.

【0003】さらに、めっき槽内の陽極板と陰極板間に
一対の遮蔽板を配設してめっき槽内を、陽極室・中間室
・陰極室に仕切り、遮蔽板開口部を電流分布制御用筒体
にて連結する比較的複雑な構造が採用されている。
Further, a pair of shielding plates are disposed between an anode plate and a cathode plate in the plating tank to partition the plating tank into an anode chamber, an intermediate chamber, and a cathode chamber. A relatively complicated structure of connecting with a cylindrical body is adopted.

【0004】[0004]

【発明が解決しようとする課題】従来の一枚遮蔽板方式
は、比較的構造も簡単なことから採用しやすいが、めっ
き膜厚分布精度やその制御性において最近の顧客側の要
求を満たすことができなくなってきている。
The conventional single shielding plate system is relatively simple in structure and therefore easy to adopt, but it has to meet recent customer requirements in plating film thickness distribution accuracy and controllability. Is no longer possible.

【0005】一方前述の筒型遮蔽板方式は、膜厚分布精
度においては、比較的性能を出しやすいがめっき槽構造
が複雑となり、また筒型電流路を長く(100mm程度)
設定する必要があり、その結果めっき槽の奥行きも長く
なり、めっき槽のコンパクト化の点でも劣る。
[0005] On the other hand, the above-mentioned cylindrical shielding plate system has relatively high performance in terms of film thickness distribution accuracy, but the plating tank structure becomes complicated, and the cylindrical current path becomes long (about 100 mm).
It is necessary to set, and as a result, the depth of the plating tank becomes long, and the plating tank is inferior in terms of downsizing.

【0006】また遮蔽板の変更等の制御調整法において
も複雑となり、最近要求されるコンパクトな装置で所要
の膜厚分布精度を出すには不満足な点がある。
Further, the control adjustment method such as the change of the shielding plate becomes complicated, and there is an unsatisfactory point in obtaining a required film thickness distribution accuracy with a compact device recently required.

【0007】本発明は、一枚遮蔽板方式の利点を生かし
めっき槽内構造が簡単で、且つ、奥行きが短くコンパク
トで、膜厚分布制御調整作業も簡単なめっき槽を提供
し、めっき膜厚分布精度も従来方式に比べ同等以上の性
能を発揮するめっき装置及びめっき方法を提供すること
を目的とする。
The present invention provides a plating tank having a simple structure in a plating tank, a short depth, a compact size, and a simple film thickness distribution control adjustment work, taking advantage of the advantage of a single shielding plate method. It is an object of the present invention to provide a plating apparatus and a plating method which exhibit a distribution accuracy equal to or higher than that of a conventional method.

【0008】[0008]

【課題を解決するための手段】前記課題を解決する本発
明の特徴は、めっき液中の陽極板と陰極板間に基板の形
状に応じた面積の開口部をもった一枚の遮蔽板を有し、
この開口部を中心として縮小,拡大する電流路を集束形
成せしめることにある。
The feature of the present invention that solves the above-mentioned problem is that one shielding plate having an opening having an area corresponding to the shape of the substrate between the anode plate and the cathode plate in the plating solution is provided. Have
The purpose is to focus and form a current path that contracts and expands around this opening.

【0009】さらに、電流路の集束形成を効果的に行う
ため、遮蔽板を陰極板に近接配置することにより、開口
部通過後の電流路を規制可能になる。
Further, in order to effectively form the current path, the shielding path is disposed close to the cathode plate, whereby the current path after passing through the opening can be regulated.

【0010】遮蔽板を被めっき物に充分近接配置(10
mm以下等)する。このため、樹脂製めっき槽寸法精度・
組立て精度や遮蔽板製作・取り付け精度向上のため嵌め
合い構造を採用した。
[0010] The shielding plate is placed sufficiently close to the object to be plated (10
mm or less). Therefore, the dimensional accuracy of the resin plating tank
A fitting structure was adopted to improve the assembly accuracy, shield plate production and mounting accuracy.

【0011】本発明は、具体的には次に掲げる装置およ
び方法を提供する。
The present invention specifically provides the following apparatus and method.

【0012】本発明は、めっき槽を備え、めっき槽内に
陽極板を垂設し、該陽極板に対向して被めっき物を垂設
しためっき装置において、めっき槽内のめっき液中の前
記陽極板と陰極フォルダとの間に開口部を有する一枚の
遮蔽板を配設し、該開口部の開口面積を調節せしめるめ
っき装置を提供する。
According to the present invention, there is provided a plating apparatus comprising a plating tank, wherein an anode plate is suspended in the plating tank, and an object to be plated is suspended in opposition to the anode plate. Provided is a plating apparatus in which one shielding plate having an opening is disposed between an anode plate and a cathode folder, and the opening area of the opening is adjusted.

【0013】前記遮蔽板の開口部を多孔板状にし、かつ
多孔板の多孔部の周囲に開口部を有し、取り外し自在の
遮蔽リング板を設けることができる。
The opening of the shielding plate may be formed in a perforated shape, and an opening may be provided around the perforated portion of the perforated plate, and a detachable shielding ring plate may be provided.

【0014】本発明は、めっき槽内に陽極板を垂設し、
該陽極板に対向して被めっき物を垂設することによって
行うめっき方法において、めっき槽内のめっき液中の陽
極板と陰極フォルダとの間に配設された遮蔽板の開口部
を、被めっき物の面積に対応した面積にして、電流路を
集束形成するめっき方法を提供する。
According to the present invention, an anode plate is suspended in a plating tank,
In a plating method performed by vertically suspending an object to be plated facing the anode plate, an opening of a shielding plate provided between the anode plate and the cathode folder in the plating solution in the plating tank is covered. Provided is a plating method that focuses and forms a current path with an area corresponding to the area of a plating object.

【0015】[0015]

【発明の実施の形態】以下本発明の実施の形態につい
て、図面を参照し説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0016】図1は、本発明による一実施例のめっき装
置を示すめっき槽部と全体構成図である。
FIG. 1 is a diagram showing a plating tank section and an entire configuration of a plating apparatus according to an embodiment of the present invention.

【0017】めっき槽1は樹脂製の長方形態に形成され
ており、その内部に間仕切り板2を有し、槽内は2つに
区割され、一方の部屋3にめっき液の排出管4が、そし
て他方の部屋5にめっき液の導入管6が接続される。
The plating tank 1 is formed in a rectangular shape made of resin, has a partition plate 2 inside, and the inside of the tank is divided into two, and a plating solution discharge pipe 4 is provided in one room 3. A plating solution introduction pipe 6 is connected to the other chamber 5.

【0018】めっき槽内仕切り板2近傍に陽極板7が設
置され、その反対側の壁面近傍に、被めっき物8を取り
付けた陰極フォルダ(陰極板)9が設置される。
An anode plate 7 is installed in the vicinity of the partition plate 2 in the plating tank, and a cathode folder (cathode plate) 9 having an object 8 to be plated is installed in the vicinity of the opposite wall surface.

【0019】更に被めっき物面近傍にめっき液を横方向
に攪拌するスキージ棒10である液攪拌部材とめっき厚
分布を高精度に制御するための一枚の多孔遮蔽板11が
陰極フォルダ9と陽極板7との間に配置されている。
Further, a liquid stirring member, which is a squeegee rod 10 for stirring the plating solution in the lateral direction, near the surface of the object to be plated, and a single porous shielding plate 11 for controlling the plating thickness distribution with high precision are provided on the cathode folder 9. It is arranged between the anode plate 7.

【0020】陽極板7と陰極フォルダ9はめっき電流を
流す定電流電源17に電気的に接続されている。またス
キージ棒10はスキージ棒駆動装置12に接続されてい
る。
The anode plate 7 and the cathode folder 9 are electrically connected to a constant current power supply 17 for supplying a plating current. The squeegee bar 10 is connected to a squeegee bar driving device 12.

【0021】めっき槽内のめっき液13は、外部のめっ
き液貯槽14から循環ポンプ15によりフィルタ16を
介してめっき槽1に送られ、循環する。
The plating solution 13 in the plating tank is sent from the external plating solution storage tank 14 to the plating tank 1 via the filter 16 by the circulation pump 15 and circulates.

【0022】めっき膜厚分布精度を左右する被めっき物
8の面と遮蔽板11の間の距離は10mm以下,6mm以上
で一例として8mmが採用されており、また陽極−陰極間
距離も充分短かい35mm以内の採用で、奥行きの短い,
コンパクトな構造となっている。
The distance between the surface of the object 8 to be plated and the shielding plate 11 which affects the plating film thickness distribution accuracy is 10 mm or less, 6 mm or more, 8 mm as an example, and the distance between the anode and the cathode is sufficiently short. Shorter depth by adoption within 35mm
It has a compact structure.

【0023】図2および図3は本実施例に関わるめっき
槽内に垂設される遮蔽板構造図である。
FIG. 2 and FIG. 3 are structural diagrams of a shield plate vertically provided in a plating tank according to the present embodiment.

【0024】多孔遮蔽板11は中央部である多孔部30
が円形上に肉厚が薄く座ぐられており、この部は所要の
直径範囲内で蜂の巣状に孔31があいている。この孔3
1は樹脂製ねじ(図示せず)で任意の位置を塞ぐことが
できるようになっており、多孔部の孔を部分的に塞ぐこ
とによりめっき電流分布を制御し、めっき膜厚分布精度
の制御を行うこともできる。
The perforated shielding plate 11 has a perforated portion 30 at the center.
Is seated thinly on a circle, and this portion has a hole 31 in a honeycomb shape within a required diameter range. This hole 3
Reference numeral 1 denotes a resin screw (not shown) that can be closed at an arbitrary position. The plating current distribution is controlled by partially closing the holes of the porous portion, and the plating film thickness distribution accuracy is controlled. Can also be performed.

【0025】更に、図4および図5に示すように、任意
の円形開口部(第二の開口部となる。)32を有する遮
蔽リング板18を取り付けねじ穴33によってこの多孔
遮蔽板11に付加取り付ける。この場合この開口部面積
を調整することにより、更に微細にめっき膜厚分布精度
の制御が可能となる。
Further, as shown in FIGS. 4 and 5, a shielding ring plate 18 having an arbitrary circular opening (which becomes a second opening) 32 is added to the porous shielding plate 11 by a screw hole 33. Attach. In this case, by adjusting the opening area, it is possible to finely control the plating film thickness distribution accuracy.

【0026】このように、多孔遮蔽板11の開口部をね
じ穴の開いた多孔板状にし、かつその多孔部の周囲を任
意の開口部を有し、取り外し・取り付け自由のリング状
の遮蔽リング板18により遮蔽する。
As described above, the opening of the perforated shielding plate 11 is formed into a perforated plate having a threaded hole, and the perimeter of the perforated portion is provided with an arbitrary opening so that the ring-shaped shielding ring can be freely removed and attached. Shielded by plate 18.

【0027】めっき薄膜を基板上に電気めっきするに際
し、めっき槽内に陽極板を垂設し、該陽極板に対向して
被めっき物を垂設しためっき槽において、めっき液中の
陽極板と陰極板との間に配置された一枚の遮蔽板の開口
部で、基板の形状に応じた断面積を有する電流路を集束
形成せしめられる。
When electroplating a plating thin film on a substrate, an anode plate is vertically provided in a plating tank, and an object to be plated is vertically provided facing the anode plate. A current path having a cross-sectional area corresponding to the shape of the substrate is focused and formed at the opening of one shielding plate disposed between the cathode plate and the cathode plate.

【0028】電流路の集束形成効果を高めるために遮蔽
板と陰極板の間隔を極力短くする。
The distance between the shielding plate and the cathode plate is reduced as much as possible in order to enhance the effect of forming a current path.

【0029】図6は、本発明に関わるめっき装置に遮蔽
板を設置する方法において、位置決め精度を高める構造
を示す。図7は比較のため従来タイプのめっき槽を示
す。従来タイプめっき槽19では、被めっき物が設置さ
れた陰極フォルダの取り付けガイド20や多孔遮蔽板取
り付けガイド21、又陽極板取り付けガイド22はめっ
き槽本体に接着構造40にて固定されていた。この方法
では位置決め精度に問題があり、これを改善するために
図6に示す改善タイプを採用した。位置決め精度改善タ
イプめっき槽23ではめっき槽の枠体41そのものを嵌
め合い構造42で構成し、上記各種部品の取り付けガイ
ド、すなわち陰極フォルダ取り付けガイド24,多孔遮
蔽板取り付けガイド25,陽極板取り付けガイド26も
嵌め合い構造43にてめっき槽本体に取り付けられてお
り、位置決め寸法精度を確保することができる。
FIG. 6 shows a structure for improving positioning accuracy in a method of installing a shielding plate in a plating apparatus according to the present invention. FIG. 7 shows a conventional plating tank for comparison. In the conventional type plating bath 19, the mounting guide 20 of the cathode folder, the mounting guide 21 for the perforated shielding plate, and the mounting guide 22 of the anode plate on which the object to be plated is mounted, are fixed to the plating bath main body by the adhesive structure 40. In this method, there is a problem in the positioning accuracy. To improve this, an improved type shown in FIG. 6 was adopted. In the positioning accuracy improving type plating tank 23, the plating tank frame 41 itself is constituted by a fitting structure 42, and the above-mentioned various component mounting guides, that is, the cathode folder mounting guide 24, the perforated shielding plate mounting guide 25, and the anode plate mounting guide 26. Also, it is attached to the plating tank main body by the fitting structure 43, and positioning dimensional accuracy can be secured.

【0030】前記遮蔽板の開口部は、実験,経験,計算
などにより基板の大きさ,形状に対応して定められ、こ
れらの違いにより、開口部の大きさ,形状は変わる。
The opening of the shielding plate is determined in accordance with the size and shape of the substrate by experiments, experiences, calculations, and the like, and the size and shape of the opening change depending on these differences.

【0031】また、遮蔽板の開口部には多数の孔が形成
された多孔板を設置し、任意の孔を塞ぐことにより、基
板への電流集中分散を制御することができ、陰極基板へ
のめっき膜厚分布精度を制御可能となる。
Further, by disposing a perforated plate having a large number of holes formed in the opening of the shielding plate and closing any holes, it is possible to control the concentration and distribution of current to the substrate, and the The plating film thickness distribution accuracy can be controlled.

【0032】一枚の多孔付き遮蔽板は比較的簡単にめっ
き槽から取り外し可能であり、且つこれに取り付けられ
ている任意の大きさの開口部を有する遮蔽リング板もこ
の遮蔽板から取り外し・取り付け可能としているので膜
厚分布調整作業が容易となる。
A single perforated shield plate can be relatively easily removed from the plating tank, and a shield ring plate having an opening of any size attached thereto is also removed and attached from the shield plate. Since it is possible, the work of adjusting the film thickness distribution becomes easy.

【0033】さらに、陰極板と遮蔽板との間を攪拌棒に
てめっき液を攪拌し、めっき液を乱流化させることによ
り、高精密微細パターンのめっきが可能となる。
Further, the plating solution is stirred between the cathode plate and the shielding plate with a stirring rod to make the plating solution turbulent, whereby a high-precision fine pattern can be plated.

【0034】図8は、本発明に関わるめっき装置でめっ
きを行った場合のめっき膜厚分布データである。
FIG. 8 shows plating film thickness distribution data when plating is performed by the plating apparatus according to the present invention.

【0035】比較のため、従来技術ベースの装置でめっ
きした場合の分布データも併記している。被めっき物と
遮蔽板間の距離を従来より充分短く、10mm以下、望ま
しくは8mm程度にすれば被めっき物面内のめっき膜厚分
布精度は従来技術に比べ同等以上の性能が出せることが
判る。
For comparison, the distribution data in the case of plating with an apparatus based on the prior art is also shown. It can be seen that if the distance between the object to be plated and the shielding plate is sufficiently shorter than the conventional one and is 10 mm or less, desirably about 8 mm, the plating film thickness distribution accuracy in the surface of the object to be plated can exhibit the same or better performance than the conventional technology. .

【0036】[0036]

【発明の効果】本発明のめっき槽およびめっき方法は下
記の効果を提供する。
The plating tank and plating method of the present invention provide the following effects.

【0037】1)被めっき物を垂設してめっきを行う縦
型ディップ式めっき装置に適用することにより、めっき
面への気泡の残留や、陽極板からのブラックフィルムの
剥離脱落によるめっき面への影響を制御することがで
き、高品質のめっき膜面の形成が可能となる。
1) By applying the present invention to a vertical dip type plating apparatus in which an object to be plated is vertically placed to perform plating, air bubbles remain on the plating surface, and the plating film is peeled off and dropped from the anode plate. Can be controlled, and a high quality plating film surface can be formed.

【0038】2)更に被めっき物とこれに対向垂設され
た陽極板との間に、めっき処理調整機構(遮蔽板,めっ
き液攪拌棒)を配置し、適正位置に調整することにより
めっき膜厚分布制御が容易なめっき方法およびめっき装
置となる。
2) Further, a plating adjustment mechanism (shielding plate, plating solution stirrer) is arranged between the object to be plated and the anode plate vertically installed opposite thereto, and the plating film is adjusted by adjusting it to an appropriate position. A plating method and a plating apparatus in which thickness distribution control is easy.

【0039】3)めっき膜厚分布を制御する遮蔽板に一
枚構造方式を採用することにより、めっき槽の奥行きを
短く纏められ、めっき装置のコンパクト化に寄与するこ
とができる。
3) By adopting the one-plate structure for the shielding plate for controlling the plating film thickness distribution, the depth of the plating tank can be shortened, which can contribute to the downsizing of the plating apparatus.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明による一実施例の全体構成図。FIG. 1 is an overall configuration diagram of an embodiment according to the present invention.

【図2】めっき槽内の遮蔽板構造図。FIG. 2 is a structural diagram of a shielding plate in a plating tank.

【図3】図2の側面図。FIG. 3 is a side view of FIG. 2;

【図4】遮蔽リング板構造図。FIG. 4 is a structural view of a shield ring plate.

【図5】図4の側面図。FIG. 5 is a side view of FIG. 4;

【図6】めっき槽内の遮蔽板他の位置決め構造図。FIG. 6 is a diagram showing a positioning structure of a shielding plate and other components in a plating tank.

【図7】従来タイプのめっき槽内の遮蔽板他の位置の構
造図。
FIG. 7 is a structural view of a shielding plate and other positions in a conventional plating bath.

【図8】本発明のめっき方法・めっき装置によるめっき
膜厚分布データ図。
FIG. 8 is a diagram showing a plating film thickness distribution data by a plating method and a plating apparatus of the present invention.

【符号の説明】[Explanation of symbols]

1…めっき槽、2…仕切り板、3,5…部屋、4…排出
管、6…導入管、7…陽極板、8…被めっき物、9…陰
極フォルダ、10…スキージ棒、11…多孔遮蔽板、1
2…スキージ棒駆動装置、13…めっき液、14…めっ
き液貯槽、15…循環ポンプ、16…フィルタ、17…
定電流電源、18…遮蔽リング板、19…従来タイプめ
っき槽、20,24…陰極フォルダ取り付けガイド、2
1,25…多孔遮蔽板取り付けガイド、22,26…陽
極板取り付けガイド、23…改善タイプめっき槽、30
…多孔板、31…孔、32…円形開口部、33…取り付
けねじ穴、40…接着構造、41…枠体、42,43…
嵌め合い構造。
DESCRIPTION OF SYMBOLS 1 ... Plating tank, 2 ... Partition board, 3, 5 ... Room, 4 ... Discharge pipe, 6 ... Introductory pipe, 7 ... Anode plate, 8 ... Plated object, 9 ... Cathode folder, 10 ... Squeegee rod, 11 ... Porous Shielding plate, 1
2 ... Squeegee rod drive device, 13 ... Plating solution, 14 ... Plating solution storage tank, 15 ... Circulation pump, 16 ... Filter, 17 ...
Constant current power supply, 18 ... Shielding ring plate, 19 ... Conventional plating bath, 20, 24 ... Cathode folder installation guide, 2
1, 25: Installation guide for perforated shielding plate, 22, 26: Installation guide for anode plate, 23: Improved plating bath, 30
... perforated plate, 31 ... hole, 32 ... circular opening, 33 ... mounting screw hole, 40 ... adhesive structure, 41 ... frame, 42, 43 ...
Fitting structure.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 椎名 宏実 茨城県日立市弁天町三丁目10番2号 日立 協和エンジニアリング株式会社内 (72)発明者 江口 武也 茨城県日立市弁天町三丁目10番2号 日立 協和エンジニアリング株式会社内 Fターム(参考) 4K024 BB12 CB12 CB21 CB26 GA02 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Hiromi Shiina 3-10-2 Bentencho, Hitachi City, Ibaraki Prefecture Within Hitachi Kyowa Engineering Co., Ltd. (72) Inventor Takeya Eguchi 3-chome Bentencho, Hitachi City, Ibaraki Prefecture No.2 F-term in Hitachi Kyowa Engineering Co., Ltd. (reference) 4K024 BB12 CB12 CB21 CB26 GA02

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】めっき槽を備え、めっき槽内に陽極板を垂
設し、該陽極板に対向して被めっき物を垂設しためっき
装置において、 めっき槽内のめっき液中の前記陽極板と陰極フォルダと
の間に開口部を有する一枚の遮蔽板を配設し、該開口部
の開口面積を調節せしめることを特徴とするめっき装
置。
1. A plating apparatus comprising a plating tank, an anode plate suspended from the plating tank, and an object to be plated suspended from the anode plate, wherein the anode plate in a plating solution in the plating tank is provided. A plating apparatus, comprising: disposing a single shielding plate having an opening between the electrode and the cathode folder, and adjusting the opening area of the opening.
【請求項2】請求項1において、 前記遮蔽板の開口部を多孔板状にし、かつ多孔板の多孔
部の周囲に開口部を有した取り外し自在の遮蔽リング板
を設けることを特徴とするめっき装置。
2. The plating method according to claim 1, wherein the opening of the shielding plate is formed in a perforated plate shape, and a removable shielding ring plate having an opening around the perforated portion of the perforated plate is provided. apparatus.
【請求項3】請求項1において、 前記めっき槽内で、遮蔽板と被めっき物との間に位置
し、被めっき物に近接してめっき液攪拌部材を設けたこ
とを特徴とするめっき装置。
3. The plating apparatus according to claim 1, wherein a plating solution agitating member is provided in the plating tank between the shielding plate and the object to be plated and close to the object to be plated. .
【請求項4】請求項1において、 前記めっき槽を構成する枠体を嵌め合い構造とし、かつ
陽極板,陰極板および遮蔽板のそれぞれをそれぞれ保持
する保持部材を前記枠体に嵌め合い構造にて取り付ける
ことを特徴とするめっき装置。
4. The frame according to claim 1, wherein the frame constituting the plating tank has a fitting structure, and holding members respectively holding the anode plate, the cathode plate and the shielding plate are fitted to the frame. A plating apparatus characterized by being mounted by mounting.
【請求項5】めっき槽内に陽極板を垂設し、該陽極板に
対向して被めっき物を垂設することによって行うめっき
方法において、 めっき槽内のめっき液中の陽極板と陰極フォルダとの間
に配設された遮蔽板の開口部を、被めっき物の面積に対
応した面積にして、電流路を集束形成することを特徴と
するめっき方法。
5. A plating method performed by dropping an anode plate in a plating tank and dropping an object to be plated facing the anode plate, comprising: an anode plate and a cathode folder in a plating solution in the plating tank. A method of forming a current path by forming an opening corresponding to an area of an object to be plated by making an opening of a shielding plate disposed between the shielding plate and the substrate.
【請求項6】請求項5において、 被めっき物と遮蔽板との間の距離を10mm以下でめっき
を行うことを特徴とするめっき方法。
6. The plating method according to claim 5, wherein plating is performed with a distance between the object to be plated and the shielding plate being 10 mm or less.
JP2000144873A 2000-05-17 2000-05-17 Plating device and plating method Pending JP2001329400A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000144873A JP2001329400A (en) 2000-05-17 2000-05-17 Plating device and plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000144873A JP2001329400A (en) 2000-05-17 2000-05-17 Plating device and plating method

Publications (1)

Publication Number Publication Date
JP2001329400A true JP2001329400A (en) 2001-11-27

Family

ID=18651461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000144873A Pending JP2001329400A (en) 2000-05-17 2000-05-17 Plating device and plating method

Country Status (1)

Country Link
JP (1) JP2001329400A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003010365A1 (en) * 2001-07-25 2003-02-06 Sharp Kabushiki Kaisha Plating method and plating apparatus
EP1524338A4 (en) * 2002-07-18 2008-02-27 Ebara Corp Plating device
KR100855808B1 (en) * 2006-11-21 2008-09-01 삼성전기주식회사 Electroplating Apparatus
JP2009155727A (en) * 2007-12-04 2009-07-16 Ebara Corp Plating apparatus and plating method
US8177944B2 (en) 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
KR101198005B1 (en) * 2009-09-11 2012-11-05 삼성전기주식회사 Electroplating apparatus

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003010365A1 (en) * 2001-07-25 2003-02-06 Sharp Kabushiki Kaisha Plating method and plating apparatus
EP1524338A4 (en) * 2002-07-18 2008-02-27 Ebara Corp Plating device
KR100855808B1 (en) * 2006-11-21 2008-09-01 삼성전기주식회사 Electroplating Apparatus
JP2009155727A (en) * 2007-12-04 2009-07-16 Ebara Corp Plating apparatus and plating method
US8177944B2 (en) 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
US20120193220A1 (en) * 2007-12-04 2012-08-02 Nobutoshi Saito Plating apparatus and plating method
JP2013064202A (en) * 2007-12-04 2013-04-11 Ebara Corp Plating apparatus
US8486234B2 (en) 2007-12-04 2013-07-16 Ebara Corporation Plating apparatus and plating method
USRE45687E1 (en) 2007-12-04 2015-09-29 Ebara Corporation Plating apparatus and plating method
CN103060871B (en) * 2007-12-04 2015-11-25 株式会社荏原制作所 Electroplanting device and electro-plating method
KR101198005B1 (en) * 2009-09-11 2012-11-05 삼성전기주식회사 Electroplating apparatus

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