KR100855808B1 - Electroplating Apparatus - Google Patents

Abstract

The present invention relates to an electrolytic plating apparatus capable of forming a plating layer having a uniform thickness on a printed circuit board by making the current density distribution uniform.

According to the present invention, the outer edge of the shielding plate is formed to be bent to uniform the current density of the entire shielding plate so that the thickness of the plating layer formed on the printed circuit board is uniformly formed.

Shield plate, electroplating, perforation, current density

Description

Electroplating Apparatus {Electroplating Apparatus}

1 is a view showing a shield of a conventional printed circuit board.

2 is a view showing a shield plate according to a first embodiment of the present invention.

3 is a view showing a shielding plate according to a second embodiment of the present invention.

4A and 4B illustrate a shielding plate according to a third embodiment of the present invention.

5A and 5B illustrate a shielding plate according to a fourth embodiment of the present invention.

6A and 6B illustrate a shielding plate according to a fifth embodiment of the present invention.

7A and 7B illustrate a shielding plate according to a sixth embodiment of the present invention.

8A and 8B illustrate a shielding plate according to a seventh embodiment of the present invention.

9A and 9B illustrate a shielding plate according to an eighth embodiment of the present invention.

<Brief description of symbols for the main parts of the drawings>

10, 100: shielding plate 102, 102a, 102b, 104, 104a, 104b: through hole

110: current dispersion induction unit 110a: semicircular groove

110b: semicircular protrusion 112a: square groove

112b: square protrusion

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic plating apparatus, and more particularly, to an electrolytic plating apparatus capable of forming a plating layer having a uniform thickness on a printed circuit board by making the current density distribution uniform.

Printed Circuit Board (PCB) is a printed wiring board that forms conductors on insulating boards based on circuit design. The electrical wiring between electronic components is called a PCB board, printed circuit board, or printed wiring board. .

In general, a printed circuit board is formed by attaching a copper thin plate to a surface of a phenol resin insulator or an epoxy resin insulator, and then etching it according to the wiring pattern of the circuit to form a necessary circuit, and various electrical and electronic devices such as IC, capacitor, and resistor thereon. It is an insulating flat plate that allows compact mounting of parts.

That is, a circuit for connecting the electronic components with each other is formed in the shape of a wiring on the surface of the insulating plate. Printed circuit boards are classified into single-sided boards, double-sided boards, and multilayer boards according to the number of printed circuit boards. The higher the number of layers, the better the mounting force of the parts and the high-precision products.

The printed circuit board forms a plating layer through an electroplating process and then forms a circuit through an exposure and development process.

In this case, when electroplating the end surface or both sides of the printed circuit board, the anode and the printed circuit board as the plating target are disposed to face the plating bath in which the plating solution is accommodated, and a current flows from the anode toward the printed circuit board to form the plating layer.

However, in general, when the plating layer is formed by immersing the printed circuit board in the plating bath, the current density is concentrated at the edge of the printed circuit board, and thus the plating thickness of the center part and the edge part is different.

Accordingly, the shielding plate 10 shown in FIG. 1 is installed between the printed circuit board and the anode to prevent the current density from concentrating on the edge portion, thereby uniformly forming the plating layer.

However, even when the plating layer is formed on the printed circuit board by using the conventional shielding plate 10, the current from the anode is concentrated on the edge of the shielding plate 10 because the shielding plate 10 is formed in a rectangular shape. there is a problem.

In other words, since the edge of the shielding plate 10 is formed in a straight line and the length of the current is short, the plating layer and the central portion formed at the edge of the printed circuit board are formed even when the plating layer is formed using the shielding plate 10 shown in FIG. 1. There is a problem that the thickness of the plating layer formed on the different.

Accordingly, an object of the present invention is to provide an electroplating apparatus capable of forming a plating layer having a uniform thickness on a printed circuit board by making the current density distribution uniform.

In order to achieve the above object, an electrolytic plating apparatus according to an embodiment of the present invention is a plating bath containing a plating solution; A printed circuit board disposed to face the anode in the plating bath; And a shielding plate formed between the printed circuit board and the anode so as to be alternately formed to protrude outward so that the outer edge is curved, and a groove having a shape corresponding to the protrusion is concave toward the center.

Electrolytic plating apparatus according to another embodiment of the present invention is a plating bath containing a plating solution; A printed circuit board disposed to face the anode in the plating bath; And a current distributing induction part alternately formed in the center so that the protrusion protruding toward the center and the groove corresponding to the protrusion are formed in the groove shape, and is formed between the current dispersion induction part and the rectangular outer edge. The ball is characterized in that it comprises a shield plate formed in the form of a grid.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a view showing a shielding plate according to a first embodiment of the present invention.

Referring to FIG. 2, the shielding plate according to the first embodiment of the present invention is formed such that the current dispersion induction part 110 is bent at an outer edge for current dispersion. In this case, the current dispersion induction part 110 is formed so that the semi-circular semicircular protrusion 110b protrudes in the outward direction, and the semi-circular groove 110a is recessed in a form corresponding to the semicircular protrusion 110b, and the semicircular protrusion 110b. And semicircular grooves 110a are alternately formed to induce current dispersion. Accordingly, the boundary length through which the current per unit area reaches is increased, thereby lowering the current density distribution of the edge portion of the shielding plate 100.

In other words, the shielding plate according to the first exemplary embodiment of the present invention alternately forms a semicircular protrusion 110b having a semicircular shape and a semicircular groove 110a recessed in a semicircular shape at the outer edge thereof to widen the length of the current per unit area. By inducing the dispersion of the current it is possible to lower the current density distribution outside the shield plate (100).

The shielding plate 100 is installed between the printed circuit board and the anode during the electroplating process to uniformly distribute the current density at the edges and the center of the printed circuit board so that the thickness of the plated layer formed by the electroplating process is uniform. To form.

Referring to the method of electroplating a printed circuit board using the shielding plate according to the first embodiment of the present invention as follows. First, the printed circuit board, which is the plating target, and the anode are disposed to face the plating bath in which the plating liquid is accommodated. Thereafter, the shielding plate 100 is formed between the printed circuit board and the anode so that the current dispersion induction part 110 is bent at the outer edge. Thereafter, current flows from the anode toward the printed circuit board to form a plating layer on one or both surfaces of the printed circuit board.

In this case, the plating layer is uniformly formed because the shielding plate 100 formed to bend the outer edge prevents the current density from being concentrated on the edge portion of the printed circuit board.

3 is a view showing a shielding plate according to a second embodiment of the present invention.

Referring to FIG. 3, in the shielding plate according to the second embodiment of the present invention, the current dispersion induction unit 112 has an outer edge for current distribution in the same manner as the shielding plate according to the first embodiment of the present invention shown in FIG. It is formed to be curved. In this case, the current dispersion induction part 112 is formed such that the square protrusion 112b having a square shape protrudes in the outward direction, the square groove 112a is recessed in a shape corresponding to the square protrusion 112b, and the square protrusion 112b is provided. And square grooves 112a are alternately formed to induce dispersion of current. Accordingly, the boundary length through which the current per unit area reaches is increased, thereby lowering the current density distribution of the edge portion of the shielding plate 100.

In other words, in the shielding plate according to the second embodiment of the present invention, a rectangular protrusion 112b protruding in the outward direction in a square shape and a square groove 112a concaved in the square shape alternately form a current on a periphery edge. By widening the length of the contact to induce the dispersion of the current it is possible to lower the current density distribution of the outside of the shield plate (100).

The shielding plate 100 is installed between the printed circuit board and the anode during the electroplating process to uniformly distribute the current density at the edges and the center of the printed circuit board so that the thickness of the plated layer formed by the electroplating process is uniform. To form.

Since the electroplating method on the printed circuit board using the shielding plate according to the second embodiment of the present invention is the same as the electroplating method using the shielding plate according to the first embodiment of the present invention, the detailed description will be given above. Replace with.

4A and 4B are views illustrating a shielding plate according to a third embodiment of the present invention.

The shielding plate according to the third embodiment of the present invention illustrated in FIGS. 4A and 4B has a hole 102 in the center of the shielding plate 100 as compared to the shielding plate according to the first embodiment of the present invention illustrated in FIG. 2. Except for the formation of), the shape is formed in the same manner, so the detailed description will be replaced with the above description.

Perforations 102 and 104 are formed in the center of the shield plate 100 in a grid shape to prevent the current density is concentrated in the center of the shield plate (100). In other words, the perforations 102 and 104 serve to uniformly distribute the current throughout the shielding plate 100 by lengthening the interface where the current per unit area reaches the central portion of the shielding plate 100. In this case, the perforations 102 and 104 may be formed of any one of a circle or a polygon such as a rectangle or a rhombus, but more preferably, may be formed in a rhombus shape in order to make the interface length to which the current reaches the same.

The shielding plate 100 is installed between the printed circuit board and the anode during the electroplating process to uniformly distribute the current density at the edges and the center of the printed circuit board so that the thickness of the plated layer formed by the electroplating process is uniform. To form.

Since the electroplating method on the printed circuit board using the shielding plate according to the third embodiment of the present invention is the same as the electroplating method using the shielding plate according to the first embodiment of the present invention, the detailed description will be given above. Replace with.

5A and 5B are views illustrating a shielding plate according to a fourth embodiment of the present invention.

The shielding plate according to the fourth embodiment of the present invention shown in FIGS. 5A and 5B has a hole 102 in the center of the shielding plate 100 as compared to the shielding plate according to the second embodiment of the present invention shown in FIG. 3. Except for the formation of), the shape is formed in the same manner, so the detailed description will be replaced with the above description.

In addition, since the through-holes 102 and 104 are formed in the same manner as the shielding plate according to the third embodiment of the present invention shown in FIGS. 4A and 4B and play the same role, the detailed description will be replaced with the above description.

The shielding plate 100 is installed between the printed circuit board and the anode during the electroplating process to uniformly distribute the current density at the edges and the center of the printed circuit board so that the thickness of the plated layer formed by the electroplating process is uniform. To form.

Since the electroplating method on the printed circuit board using the shielding plate according to the fourth embodiment of the present invention is the same as the electroplating method using the shielding plate according to the first embodiment of the present invention, the detailed description will be given above. Replace with.

6A and 6B are views illustrating a shielding plate according to a fifth embodiment of the present invention.

6A and 6B, the shielding plate according to the fifth embodiment of the present invention is formed such that the current dispersion induction part 110 is bent at an outer edge for current dispersion. In this case, the current dispersion induction part 110 is formed so that the semi-circular semicircular protrusion 110b protrudes in the outward direction, and the semi-circular groove 110a is recessed in a form corresponding to the semicircular protrusion 110b, and the semicircular protrusion 110b. And semicircular grooves 110a are alternately formed. In addition, first center holes 102a and 104a are formed in the center of the shielding plate 100 in a lattice shape, and second hole holes 102b and 104b are formed in the semicircular protrusions 110b.

Accordingly, the shielding plate according to the fifth embodiment of the present invention is shielded by the first through holes (102a, 104a) and the second through holes (102b, 104b) formed in the central portion and the semi-circular projection (110b) of the shielding plate 100 The boundary surface at which the electric current per unit area reaches the plate 100 becomes long, so that the entire shield plate 100 has a uniform current density distribution. As a result, the plating layer is formed to have a uniform thickness on the entire printed circuit board during the electroplating process.

Here, the first through holes (102a, 104a) to prevent the current density is concentrated in the center of the shield plate 100, as described in the shielding plate according to the third embodiment of the present invention, the second through holes (102b, 104b) ) Prevents current density from concentrating on the outer edge of the shield plate 100.

The first and second holes 102a and 104a and 102b and 104b may be formed of any one of a polygon, such as a circle, a quadrangle, and a rhombus, but are formed in a rhombus shape in order to make the same interface length to which an electric current is applied. More preferably.

In addition, the first through holes 102a and 104a are formed to have the same size as or larger than the second through holes 102b and 104b so as to uniformly distribute the current density throughout the shield plate 100.

The shielding plate 100 is installed between the printed circuit board and the anode during the electroplating process to uniformly distribute the current density at the edges and the center of the printed circuit board so that the thickness of the plated layer formed by the electroplating process is uniform. To form.

In the above description, the shielding plate 100 formed in the central portion of the shielding plate 100 and the semicircular protrusion 110b has been described, but the perforations 102a, 102b, 104a, 104b are described. It may be formed only in the semi-circular projection (110b).

Such a method of electroplating a printed circuit board using the shielding plate according to the fifth embodiment of the present invention is the same as the electroplating method using the shielding plate according to the first embodiment of the present invention. Replace with.

7A and 7B are views illustrating a shielding plate according to a sixth embodiment of the present invention.

7A and 7B, the shielding plate according to the sixth embodiment of the present invention is formed such that the current dispersion induction part 112 is bent at the outer edge for current dispersion. In this case, the current dispersion induction part 112 is formed such that the square protrusion 112b having a square shape protrudes in the outward direction, the square groove 112a is recessed in a shape corresponding to the square protrusion 1120a, and the square protrusion 112b is provided. And square grooves 112a are alternately formed. In addition, first center holes 102a and 104a are formed in the center of the shielding plate 100 in a lattice shape, and second hole holes 102b and 104b are formed in the semicircular protrusions 110b.

Accordingly, the shielding plate according to the sixth embodiment of the present invention is shielded by the first through holes (102a, 104a) and the second through holes (102b, 104b) formed in the central portion and the rectangular protrusion 112b of the shielding plate (100). The boundary surface at which the electric current per unit area reaches the plate 100 becomes long, so that the entire shield plate 100 has a uniform current density distribution. As a result, the plating layer is formed to have a uniform thickness on the entire printed circuit board during the electroplating process.

Here, the first through holes (102a, 104a) to prevent the current density is concentrated in the center of the shield plate 100, as described in the shielding plate according to the third embodiment of the present invention, the second through holes (102b, 104b) ) Prevents current density from concentrating on the outer edge of the shield plate 100.

The first and second holes 102a and 104a and 102b and 104b may be formed of any one of a polygon, such as a circle, a quadrangle, and a rhombus, but are formed in a rhombus shape in order to make the same interface length to which an electric current is applied. More preferably.

In addition, the first through holes 102a and 104a are formed to have the same size as or larger than the second through holes 102b and 104b so as to uniformly distribute the current density throughout the shield plate 100.

The shielding plate 100 is installed between the printed circuit board and the anode during the electroplating process to uniformly distribute the current density at the edges and the center of the printed circuit board so that the thickness of the plated layer formed by the electroplating process is uniform. To form.

In the above description, the shielding plate 100 formed in the center of the shielding plate 100 and the rectangular protrusion 112b is formed in the through holes 102a, 102b, 104a and 104b, but the through holes 102a, 102b, 104a and 104b are described. It may be formed only in the rectangular protrusion 112b.

Since the electroplating method on the printed circuit board using the shielding plate according to the sixth embodiment of the present invention is the same as the electroplating method using the shielding plate according to the first embodiment of the present invention, the detailed description will be given above. Replace with.

8A and 8B are views illustrating a shielding plate according to a seventh embodiment of the present invention.

8A and 8B, the shielding plate according to the seventh embodiment of the present invention has an outer border formed in a rectangular shape, that is, near the outer border, that is, perforated between the outer border and the center of the shielding plate 100. 102 and 104 are formed in a lattice form. In addition, the shielding plate 100 is formed such that the current dispersion induction part 110 for current dispersion in the center portion is bent.

In this case, the current spreading induction part 110 protrudes so that the semi-circular semicircular protrusion 110b faces the center of the shielding plate 100, and the semicircular groove 110a corresponds to the semicircular protrusion 110b. It is formed to be concaved in the outer edge direction of, the semi-circular protrusion 110b and the semi-circular groove (110a) are formed alternately to induce current dispersion in the center of the shielding plate (100).

Here, the through holes 102 and 104 are formed only at the outer edge and the center of the shielding plate 100, but may also be formed at the semicircular protrusion 110b.

Accordingly, the outer portion of the shielding plate 100 where the holes 102 and 104 are formed and the current dispersion induction unit 110 distribute the current density, and the center portion formed by the semicircular protrusion 110b and the semicircular groove 110a has a current. It will penetrate the density. At this time, the outer portion of the shielding plate 100 in which the perforations 102 and 104 are formed distributes more current density than the current dispersion induction unit 110.

The shielding plate according to the seventh embodiment of the present invention having such a configuration has a uniform current density by semicircular protrusions 110b and semicircular grooves 110a formed in the center and through holes 102 and 104 formed between the outer edge and the center. Will be distributed.

Here, the perforations 102 and 104 may be formed of any one of a circle or a polygon such as a rectangle or a rhombus, but it is more preferable to form a rhombus shape in order to make the interface length to which the current reaches the same.

The shielding plate 100 is installed between the printed circuit board and the anode during the electroplating process to uniformly distribute the current density at the edges and the center of the printed circuit board so that the thickness of the plated layer formed by the electroplating process is uniform. To form.

Since the electroplating method on the printed circuit board using the shielding plate according to the seventh embodiment of the present invention is the same as the electroplating method using the shielding plate according to the first embodiment of the present invention, the detailed description will be given above. Replace with.

9A and 9B are views illustrating a shielding plate according to an eighth embodiment of the present invention.

9A and 9B, the shielding plate according to the eighth embodiment of the present invention has an outer border formed in a quadrangular shape, that is, near the outer border, that is, a perforation between the outer border and the center of the shielding plate 100 ( 102, 104 are formed in the form of a lattice. In addition, the shielding plate 100 is formed such that the current dispersion induction part 112 for current dispersion in the center portion is bent.

In this case, the current dispersion induction part 112 is projected so that the square protrusion 112b having a square shape is directed toward the center of the shielding plate 100, and the square groove 112a is formed to correspond to the square protrusion 112b. It is formed to be concaved in the outer edge direction of, the rectangular protrusion 112b and the square groove 112a are formed alternately to induce current dispersion in the center of the shielding plate (100).

Here, the through holes 102 and 104 are formed only at the outer edge and the center of the shielding plate 100, but may also be formed at the rectangular protrusion 112b.

Accordingly, the outer portion of the shielding plate 100 in which the holes 102 and 104 are formed and the current dispersion induction portion 112 distribute the current density, and the center portion formed by the square protrusion 112b and the square groove 112a has a current. It will penetrate the density. At this time, the outer portion of the shielding plate 100 in which the perforations 102 and 104 are formed distributes more current density than the current dispersion inducing unit 112.

In the shielding plate according to the eighth embodiment of the present invention having such a configuration, the current density is uniform by the rectangular protrusion 112b formed in the center and the through holes 102 and 104 formed between the square groove 112a and the outer edge and the center. Will be distributed.

Here, the perforations 102 and 104 may be formed of any one of a circle or a polygon, such as a square or a rhombus, but more preferably formed in a rhombus shape in order to make the interface length to which an electric current reaches the same.

The shielding plate 100 is installed between the printed circuit board and the anode during the electroplating process to uniformly distribute the current density at the edges and the center of the printed circuit board so that the thickness of the plated layer formed by the electroplating process is uniform. To form.

Since the electroplating method on the printed circuit board using the shielding plate according to the eighth embodiment of the present invention is the same as the electroplating method using the shielding plate according to the first embodiment of the present invention, the detailed description will be given above. Replace with.

As described above, the present invention may be formed to bend the outer edge of the shielding plate so that the current density of the entire shielding plate may be uniform to form a uniform thickness of the plating layer formed on the printed circuit board.

In addition, the present invention by forming a hole in the shielding plate formed so that the outer edge is curved to uniform the current density of the entire shielding plate it is possible to uniformly form the thickness of the plating layer formed on the printed circuit board.

In addition, the present invention is formed by forming the outer edge of the shielding plate in a rectangular shape, the center portion is formed to be bent, and forming a perforation between the outer edge and the center portion of the plating layer formed on the printed circuit board to uniform the current density of the entire shielding plate. The thickness can be formed uniformly.

As described above, according to the present invention, the outer edge of the shielding plate may be bent to uniformly form the current density of the entire shielding plate to uniformly form the thickness of the plating layer formed on the printed circuit board.

In addition, the present invention can form a through hole inside the shielding plate formed so that the outer edge is curved to uniform the current density of the entire shielding plate to uniformly form the thickness of the plating layer formed on the printed circuit board.

In addition, the present invention is formed by forming the outer edge of the shielding plate in a rectangular shape, the center portion is formed to be bent, and forming a perforation between the outer edge and the center portion of the plating layer formed on the printed circuit board to uniform the current density of the entire shielding plate. The thickness can be formed uniformly.

Claims (19)

A plating bath in which a plating solution is accommodated; A printed circuit board disposed to face the anode in the plating bath; And Electrolytic plating, characterized in that it comprises a shielding plate provided between the printed circuit board and the anode is formed alternately formed so that the protrusion protruding outwardly and the groove of the shape corresponding to the protrusion so that the outer edge is bent toward the center. Device. The method of claim 1, The protruding portion is formed to protrude in a semicircular shape toward the outer edge and the groove is recessed in a semicircular shape to face the inside of the shielding plate. The method of claim 2, Electrolytic plating apparatus characterized in that the perforation is formed in the center of the shield plate in the form of a lattice. The method of claim 3, wherein Electrolytic plating apparatus, characterized in that the hole is formed in the protrusion. The method of claim 4, wherein The perforation is an electroplating apparatus, characterized in that formed in the form of any one of a circular or rhombus. The method of claim 5, wherein The hole formed in the center of the shielding plate is formed to have the same size or larger than the hole formed in the semi-circular projection portion, characterized in that the electroplating apparatus. The method of claim 1, The protruding portion is formed to protrude in a square shape toward the outer edge, the groove is indented in a square shape to face the inside of the shielding plate. delete The method of claim 7, wherein Electrolytic plating apparatus characterized in that the perforation is formed in the center of the shield plate in the form of a lattice. The method of claim 9, Electrolytic plating apparatus, characterized in that the hole is formed in the protrusion. The method of claim 10, The perforation is an electroplating apparatus, characterized in that formed in the form of any one of a circular or rhombus. The method of claim 11, The hole formed in the center of the shielding plate is formed to have the same size or larger than the hole formed in the protrusion portion, characterized in that the electroplating apparatus. A plating bath in which a plating solution is accommodated; A printed circuit board disposed to face the anode in the plating bath; And The current-dispersion induction part alternately formed in the center so that the protrusion protruding toward the center and the groove corresponding to the protrusion is recessed toward the outside is formed in the shape of a groove, and a hole is formed between the current-dispersion induction part and the rectangular outer edge. Electrolytic plating apparatus comprising a shield plate formed in the form of a grid. The method of claim 13, The current distributing induction part of the electroplating apparatus, characterized in that the semi-circular semi-circular protrusion projecting toward the center of the shield plate, the semi-circular groove is inclined toward the outer edge of the shield plate to correspond to the semi-circular projection. The method of claim 14, Electrolytic plating device characterized in that the hole is formed in the semi-circular projection. The method of claim 15, The perforation is an electroplating apparatus, characterized in that formed in the form of any one of a circular or rhombus. The method of claim 13, And the current spreading induction part protrudes such that a square projecting portion having a square shape faces toward the center of the shielding plate, and a square groove corresponding to the rectangular projecting portion is directed toward an outer edge of the shielding plate. The method of claim 17, Electrolytic plating apparatus, characterized in that the perforations are formed in the rectangular projection. The method of claim 18, The perforation is an electroplating apparatus, characterized in that formed in the form of any one of a circular or rhombus.

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