EP1524338A4 - Plating device - Google Patents

Plating device

Info

Publication number
EP1524338A4
EP1524338A4 EP03765327A EP03765327A EP1524338A4 EP 1524338 A4 EP1524338 A4 EP 1524338A4 EP 03765327 A EP03765327 A EP 03765327A EP 03765327 A EP03765327 A EP 03765327A EP 1524338 A4 EP1524338 A4 EP 1524338A4
Authority
EP
European Patent Office
Prior art keywords
plating device
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03765327A
Other languages
German (de)
French (fr)
Other versions
EP1524338A1 (en
Inventor
Toshikazu Yajima
Takashi Takemura
Rei Kiumi
Nobutoshi Saito
Fumio Kuriyama
Masaaki Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of EP1524338A1 publication Critical patent/EP1524338A1/en
Publication of EP1524338A4 publication Critical patent/EP1524338A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
EP03765327A 2002-07-18 2003-07-18 Plating device Withdrawn EP1524338A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002210097 2002-07-18
JP2002210097 2002-07-18
PCT/JP2003/009144 WO2004009879A1 (en) 2002-07-18 2003-07-18 Plating device

Publications (2)

Publication Number Publication Date
EP1524338A1 EP1524338A1 (en) 2005-04-20
EP1524338A4 true EP1524338A4 (en) 2008-02-27

Family

ID=30767712

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03765327A Withdrawn EP1524338A4 (en) 2002-07-18 2003-07-18 Plating device

Country Status (6)

Country Link
US (2) US20040262150A1 (en)
EP (1) EP1524338A4 (en)
JP (1) JP4434948B2 (en)
KR (2) KR101027489B1 (en)
CN (2) CN100439571C (en)
WO (1) WO2004009879A1 (en)

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JP2006513041A (en) * 2002-12-05 2006-04-20 サーフェクト テクノロジーズ インク． Coated magnetic particles and their applications
US20050230260A1 (en) * 2004-02-04 2005-10-20 Surfect Technologies, Inc. Plating apparatus and method
US20060081478A1 (en) * 2004-10-19 2006-04-20 Tsuyoshi Sahoda Plating apparatus and plating method
JP4878866B2 (en) * 2006-02-22 2012-02-15 イビデン株式会社 Plating apparatus and plating method
KR20090049957A (en) * 2007-11-14 2009-05-19 삼성전기주식회사 Plating apparatus
US8012319B2 (en) * 2007-11-21 2011-09-06 Texas Instruments Incorporated Multi-chambered metal electrodeposition system for semiconductor substrates
JP5184308B2 (en) * 2007-12-04 2013-04-17 株式会社荏原製作所 Plating apparatus and plating method
US8177944B2 (en) * 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
JP2009299128A (en) * 2008-06-13 2009-12-24 Panasonic Corp Electroplating apparatus
TWI550139B (en) 2011-04-04 2016-09-21 諾菲勒斯系統公司 Electroplating apparatus for tailored uniformity profile
KR20120129125A (en) * 2011-05-19 2012-11-28 삼성전자주식회사 Electroplating apparatus for semiconductor substrate and method the same
JP5795965B2 (en) * 2011-05-30 2015-10-14 株式会社荏原製作所 Plating equipment
JP5731917B2 (en) * 2011-06-30 2015-06-10 上村工業株式会社 Surface treatment equipment and plating tank
US9790610B2 (en) * 2012-07-02 2017-10-17 Nippon Steel & Sumitomo Metal Corporation Electro plating device
JP2014088600A (en) * 2012-10-31 2014-05-15 C Uyemura & Co Ltd Surface treating device
US9909228B2 (en) 2012-11-27 2018-03-06 Lam Research Corporation Method and apparatus for dynamic current distribution control during electroplating
JP5651737B2 (en) * 2013-06-03 2015-01-14 株式会社ムラタ Plating equipment for nickel plating
KR101789080B1 (en) * 2014-05-12 2017-10-23 가부시키가이샤 야마모토메키시켄키 Plating apparatus and container bath
CN104005077B (en) * 2014-05-14 2016-11-09 上海交通大学 The electroplanting device of optimized temperature field distribution and electro-plating method thereof
EP3016486B1 (en) * 2014-10-29 2017-08-16 ATOTECH Deutschland GmbH Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module
US9978882B2 (en) * 2014-11-13 2018-05-22 Shindengen Electric Manufacturing Co., Ltd. Method of manufacturing semiconductor device and glass film forming apparatus
JP6335777B2 (en) * 2014-12-26 2018-05-30 株式会社荏原製作所 Substrate holder, method for holding substrate with substrate holder, and plating apparatus
KR20180091948A (en) * 2016-01-06 2018-08-16 어플라이드 머티어리얼스, 인코포레이티드 Systems and methods for shielding features of a workpiece during electrochemical deposition
CN105648507A (en) * 2016-03-24 2016-06-08 河南理工大学 Device for electro-depositing planar parts
GB201701166D0 (en) * 2017-01-24 2017-03-08 Picofluidics Ltd An apparatus for electrochemically processing semiconductor substrates
JP6847691B2 (en) * 2017-02-08 2021-03-24 株式会社荏原製作所 Substrate holder used with plating equipment and plating equipment
GB2564893B (en) * 2017-07-27 2020-12-16 Semsysco Gmbh Distribution system for chemical and/or electrolytic surface treatment
CN107447249A (en) * 2017-08-17 2017-12-08 苏州市金翔钛设备有限公司 A kind of electroplating bath
JP6986921B2 (en) 2017-10-12 2021-12-22 株式会社荏原製作所 Plating equipment and plating method
JP6329681B1 (en) 2017-10-31 2018-05-23 株式会社荏原製作所 Plating apparatus and plating method
JP6790016B2 (en) * 2018-04-10 2020-11-25 上村工業株式会社 Surface treatment equipment, surface treatment method and paddle
JP6971915B2 (en) 2018-06-05 2021-11-24 株式会社荏原製作所 Plating method, plating equipment, and method for estimating critical current density
JP7227875B2 (en) * 2019-08-22 2023-02-22 株式会社荏原製作所 Substrate holder and plating equipment
JP7383441B2 (en) * 2019-10-07 2023-11-20 上村工業株式会社 Surface treatment equipment, surface treatment method and paddle
TWI721760B (en) * 2020-01-17 2021-03-11 海技股份有限公司 Electroplating device and method
JP7354020B2 (en) * 2020-03-04 2023-10-02 株式会社荏原製作所 Plating equipment and resistors
JP7356401B2 (en) 2020-05-12 2023-10-04 株式会社荏原製作所 Plate, plating equipment, and plate manufacturing method
KR102558727B1 (en) 2020-11-16 2023-07-24 가부시키가이샤 에바라 세이사꾸쇼 Plate and plating apparatus
CN112708922B (en) * 2020-12-31 2024-02-02 郑州琦升精密制造有限公司 Electroplating stirring filter device
KR102447745B1 (en) * 2021-03-05 2022-09-28 가부시키가이샤 에바라 세이사꾸쇼 How to adjust the plating module
JP7027622B1 (en) * 2021-06-17 2022-03-01 株式会社荏原製作所 Resistors and plating equipment
JP7093478B1 (en) * 2021-06-18 2022-06-29 株式会社荏原製作所 Plating equipment and plating method
US11859302B2 (en) * 2021-10-14 2024-01-02 Unimicron Technology Corp. Electroplating apparatus and electroplating method
WO2023073860A1 (en) * 2021-10-28 2023-05-04 株式会社荏原製作所 Plating device
KR20240004056A (en) 2022-07-04 2024-01-11 김강민 Electric coation method acquiring euqalized coating layer surface
CN117587487B (en) * 2024-01-18 2024-04-02 南京海创表面处理技术有限公司 High-precision magnesium alloy workpiece surface electroplating equipment and control method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176500A (en) * 1987-01-16 1988-07-20 Shinko Electric Ind Co Ltd Shielding plate for electroplating
JP2001329400A (en) * 2000-05-17 2001-11-27 Hitachi Kyowa Engineering Co Ltd Plating device and plating method
JP2002054000A (en) * 2000-08-02 2002-02-19 Nitto Denko Corp Electroplating method for substrate
US20030155231A1 (en) * 2002-02-19 2003-08-21 Chao-Fu Weng Field adjusting apparatus for an electroplating bath

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US3824137A (en) * 1973-04-18 1974-07-16 In Line Technology Inc Solution agitation process
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
US4469566A (en) * 1983-08-29 1984-09-04 Dynamic Disk, Inc. Method and apparatus for producing electroplated magnetic memory disk, and the like
US5514258A (en) * 1994-08-18 1996-05-07 Brinket; Oscar J. Substrate plating device having laminar flow
US5516412A (en) * 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
US6179983B1 (en) * 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
JP2000313990A (en) * 1999-04-27 2000-11-14 Dainippon Screen Mfg Co Ltd Substrate plating device
US6254742B1 (en) * 1999-07-12 2001-07-03 Semitool, Inc. Diffuser with spiral opening pattern for an electroplating reactor vessel
US6231743B1 (en) * 2000-01-03 2001-05-15 Motorola, Inc. Method for forming a semiconductor device
EP2017374A3 (en) * 2000-03-17 2011-04-27 Ebara Corporation Plating apparatus and method
US6802946B2 (en) * 2000-12-21 2004-10-12 Nutool Inc. Apparatus for controlling thickness uniformity of electroplated and electroetched layers
CN1153852C (en) * 2001-02-28 2004-06-16 研能科技股份有限公司 Device and method for controlling electric power line distribution
CN1153851C (en) * 2001-02-28 2004-06-16 研能科技股份有限公司 Device and method for controlling electric power line distribution
CN2504282Y (en) * 2001-10-25 2002-08-07 王敬伦 Palte plating appts.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176500A (en) * 1987-01-16 1988-07-20 Shinko Electric Ind Co Ltd Shielding plate for electroplating
JP2001329400A (en) * 2000-05-17 2001-11-27 Hitachi Kyowa Engineering Co Ltd Plating device and plating method
JP2002054000A (en) * 2000-08-02 2002-02-19 Nitto Denko Corp Electroplating method for substrate
US20030155231A1 (en) * 2002-02-19 2003-08-21 Chao-Fu Weng Field adjusting apparatus for an electroplating bath

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200231, Derwent World Patents Index; AN 2002-262527, XP002464511 *
See also references of WO2004009879A1 *

Also Published As

Publication number Publication date
KR20100052577A (en) 2010-05-19
CN101387004B (en) 2010-12-15
CN1610769A (en) 2005-04-27
US20090218231A1 (en) 2009-09-03
JPWO2004009879A1 (en) 2005-11-17
US20040262150A1 (en) 2004-12-30
KR101027489B1 (en) 2011-04-06
JP4434948B2 (en) 2010-03-17
CN101387004A (en) 2009-03-18
WO2004009879A1 (en) 2004-01-29
KR20050025114A (en) 2005-03-11
EP1524338A1 (en) 2005-04-20
CN100439571C (en) 2008-12-03

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Legal Events

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Effective date: 20101217