CN1153852C - Device and method for controlling electric power line distribution - Google Patents
Device and method for controlling electric power line distribution Download PDFInfo
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- CN1153852C CN1153852C CNB011083743A CN01108374A CN1153852C CN 1153852 C CN1153852 C CN 1153852C CN B011083743 A CNB011083743 A CN B011083743A CN 01108374 A CN01108374 A CN 01108374A CN 1153852 C CN1153852 C CN 1153852C
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- electric force
- force lines
- control electric
- negative electrode
- lines distribution
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Abstract
The present invention relates to a device and a method for controlling electric power line distribution, which is used for an electroforming technology. The device for controlling electric power line distribution comprises an anode piece, a cathode piece, an electroforming medium and a shading device, wherein the anode piece corresponding to electric power application decomposes an ion of a specified material; the cathode piece is arranged on a corresponding position of the anode piece, the cathode piece receives the ion so as to form a specified material accumulation layer on the cathode piece, and a conductive layer is wound on the periphery of the cathode piece; the electroforming medium exists between the anode piece and the cathode piece so as to form electric power lines by transferring the ion; the shading device is arranged between an anode plate and a cathode plate and is provided with an opening, and the electric power lines can penetrate through the opening to be emitted on the cathode plate.
Description
The present invention is the device and method that is applied to the control electric force lines distribution on the electroforming process for a kind of.
Generally on ink cartridges nozzle piece technology, for in the control of the aperture of nozzle bore, major part can be average by adding masking shield or utilize the metallic conduction characteristic, make in technology the metallic diaphragm of being piled up, thereby the approaching ± 3 μ m of hole tolerance energy, can be uniform and stable to guarantee the ink spray volume.
As shown in Figure 1, after utilizing galvanic current to make anode metal on the positive plate 11 produce oxidizing reaction in the electrotyping bath to become metal ion, because of being subjected to the field of electric force effect between this positive plate 11 and a negative plate 12, to form power line 13, again this power line 13 be subjected to electric current distribution and conduction time length influence, the intensive more then formed power line of electric current distribution is also many more, causes metal ion to be reduced into atoms metal and forms and arrange the situation of piling up and the zone that these several power lines 13 are concentrated is easy more.The emission of this power line 13 and none fixed position again, thereby if there is not the masking shield of this power line 13 of control, then have the situation of these power line 13 skewness to take place, and its metal accumulation can be subjected to the field of electric force distribution influence, the phenomenon that causes the accumulation degree to have thickness to differ.And because of being subjected to the effect of fringing effect on this negative plate 12, potential difference is bigger, and electric field is stronger, and therefore, if the control of no masking shield, then the formed metallic diaphragm in edge can be than thick middle.
At above shortcoming, the prior art for example wild neat Japanese application for a patent for invention publication number that waits the people of virtue is the method that the Chinese utility application of 91205260.0d has worked out another kind of solution for people's such as the special application case of opening flat 5-25676 and Chen Xiaojuan application number, see also Fig. 2 (a) (b), in a positive plate 21 and a negative plate 22, add a single hole masking shield 24 between 221, power line 23 can be concentrated earlier by this single hole masking shield 24 to be emitted on this negative plate 221 again, can be increased in this negative plate 22 whereby, 221 intermediary projection probability, with improve because of fringing effect cause at this negative plate 22, the formed metal level in 221 edges can be than the problem of thick middle, and through test, its result shows: differ ± 10 μ m with the edge in the middle of it, with ideal value ± 3 μ m still have gap, so its qualification rate is not good.
From the above, there is following shortcoming in prior art:
1. the metallic diaphragm uneven thickness on this negative plate.
2. utilize this single hole masking shield, can cause the big multidirectional intermediate distribution of this metallic diaphragm on the contrary, cause this metallic diaphragm distribution range too small.
Another known techniques, for example the wild neat Japanese patent of invention publication number that waits the people of virtue number is 91205260.0 application case for people's such as the special application case of opening flat 5-25676 and Chen Xiaojuan Chinese utility model application, and it is to utilize a special former dish bracing frame to carry out the electroforming program.The former dish peripheral portion that is supported at former dish bracing frame will be provided with the supporting electrode more than 1 at least, and utilize different voltage differences to put on former dish and anode with between auxiliary cathode and the anode, to carry out the electroforming program, the power line that can prevent peripheral portion is by this concentrated, and the electroforming film thickness difference on the former dish is diminished.If but voltage difference V1 is when bigger than voltage difference V2, can't prevent concentrating of former dish peripheral portion power line, if voltage difference V2 is more obvious when big than voltage difference V1, can't separate out former dish, therefore, the best relation of current potential size V1 and V2 be V2 than V1 a little more greatly, and V2 is than 1.5 times little of V1, so this known techniques needs CONTROLLED POTENTIAL difference V1 and V2.
Main purpose of the present invention provides a kind of apparatus and method of avoiding the control electric force lines distribution of the edge metal layer meeting problem thick and heavy than the centre.
For achieving the above object, the device of control electric force lines distribution of the present invention, it is applied on the electroforming one ink cartridges nozzle piece technology, and it comprises: an anode member, it applies corresponding to an electric power and decomposites the ion of a predetermined substance; One negative electrode spare is located on the relative position of this anode member, receive this ion forming a predetermined substance accumulation horizon thereon, and at this negative electrode spare periphery winding one conductive layer, wherein said conductive layer adheres on the described negative electrode spare periphery by a conductive tape; One electroforming medium is present between this anode member and this negative electrode spare, forms a power line to transmit this ion; And a shading unit, to be located between this anode member and this negative electrode spare, it has at least one perforate and is made by the insulation material, can make this power line pass this perforate and be emitted on this negative electrode spare.
According to above-mentioned conception, this anode member is a positive plate in the device of control electric force lines distribution, and its material is a nickel.
According to above-mentioned conception, this negative electrode spare is a negative plate in the device of control electric force lines distribution, and its material is titanium or chromium.
According to above-mentioned conception, the spacing of this anode member and this negative electrode spare is 15~30cm in the device of control electric force lines distribution.
According to above-mentioned conception, this conductive layer material is a copper in the device of control electric force lines distribution.
According to above-mentioned conception, this electroforming medium is by being made up of nickel sulfamic acid, nickelous chloride and boric acid in the device of control electric force lines distribution.
According to above-mentioned conception, this shading unit and this negative plate distance are 1~5cm in the device of control electric force lines distribution.
According to above-mentioned conception, control electric force lines distribution device in this shading unit be a porous masking shield, and the aperture of these several perforates is diminished from the both sides in regular turn by the centre and in twos the symmetry, its perforate spacing is all identical again.
According to above-mentioned conception, the opening diameter size of this porous masking shield is between between 1~3cm in the device of control electric force lines distribution.
For achieving the above object, the method for control electric force lines distribution of the present invention, it is applied on the electroforming one ink cartridges nozzle piece technology, and described method comprises the following steps:
One electrotyping bath is provided, described electrotyping bath comprises an anode member and a negative electrode spare, and described anode member applies corresponding to an electric power and decomposites the ion of a predetermined substance, has an electroforming medium again, be present between described anode member and described negative electrode spare, form a power line to transmit described ion;
Apply a conductive layer in described negative electrode spare periphery, wherein said conductive layer is to adhere on the described negative electrode spare periphery by at least one conductive tape;
One shading unit is provided, is located between described anode member and the described negative electrode spare, this shading unit has at least one perforate and is made by the insulation material; And
A logical electric current is between described anode member and described negative electrode spare, to produce described power line corresponding to its current density.
According to above-mentioned conception, shown in step (a), wherein this anode member is a positive plate, and its material is a nickel in the method for control electric force lines distribution.
According to above-mentioned conception, shown in step (a), wherein this negative electrode spare is a negative plate in the method for control electric force lines distribution, is located on the relative position of this anode member, and receiving this ion forming a predetermined substance accumulation horizon thereon, and its material is titanium or chromium.
According to above-mentioned conception, shown in step (a), wherein the spacing of this anode member and this negative electrode spare is 15~30cm in the method for control electric force lines distribution.
According to above-mentioned conception, shown in step (a), wherein this electroforming medium is made up of nickel sulfamic acid, nickelous chloride and boric acid in the method for control electric force lines distribution.
According to above-mentioned conception, shown in step (b), wherein this conductive layer is evenly to attach on this negative plate periphery by a conductive tape in the method for control electric force lines distribution, and this conductive tape width is 0.3~0.6cm again, and material is a copper.
According to above-mentioned conception, shown in step (b), wherein this conductive layer also can connect into a sealing or a non-closed region by several sections conductive tapes, to attach on this negative plate periphery in the method for control electric force lines distribution.
According to above-mentioned conception, shown in step (c), wherein this shading unit and this negative plate spacing are 1~5cm in the method for control electric force lines distribution.
According to above-mentioned conception, shown in step (c), wherein this masking methods is a single hole masking shield in the method for control electric force lines distribution.
According to above-mentioned conception, as step (c) shown in, wherein this masking methods is a porous masking shield in the method for control electric force lines distribution, and these several perforated areas are diminished from the both sides in regular turn by the centre and symmetrical in twos, and its perforate spacing is all identical again.
According to above-mentioned conception, control electric force lines distribution method in wherein the opening diameter size of this porous masking shield be between 1~3cm.
According to above-mentioned conception, shown in step (d), wherein this current density is 2.5~10A/dm in the method for control electric force lines distribution
2
According to above-mentioned conception, shown in step (d), wherein this power line is by passing several perforates in this masking methods evenly being emitted to this negative plate, and deposits this predetermined substance accumulation horizon on this negative plate in the method for control electric force lines distribution.
The apparatus and method of control electric force lines distribution provided by the present invention only can be improved in the prior art with the problems of single hole masking shield as many past these negative plate intermediary areal distribution of power line that mode is caused of control electric force lines distribution, and then can make the average and distribution range of this metallic diaphragm thickness more meet required.
For clearer understanding purpose of the present invention, characteristics and advantage, preferred embodiment of the present invention is elaborated below in conjunction with accompanying drawing.
Fig. 1 is existing electroforming apparatus synoptic diagram;
Fig. 2 (a) is existing negative plate synoptic diagram;
Fig. 2 (b) is the synoptic diagram that adds a masking shield in the existing electroforming apparatus in addition;
Fig. 3 (a) is the negative plate synoptic diagram of preferred embodiment of the present invention;
Fig. 3 (b) is the electroforming apparatus synoptic diagram of preferred embodiment of the present invention.
Please be simultaneously (b) referring to Fig. 3 (a), they are device synoptic diagram of preferred embodiment of the present invention, it comprises: a positive plate 31, one negative plate 32,321 and one single hole masking shield 34, wherein this positive plate 31 and this negative plate 32, the 321st, be positioned on the relative position, its spacing is 15~30cm, and this shield board 34 is located at this positive plate 31 and this negative plate 32, between 321, and with this negative plate distance be 1~5cm, the material of this positive plate 31 can be nickel, 32 of this negative plates are titanizing on the sheet glass, this single hole masking shield 34 is a non-conductive material, for example: acrylic plate.
Owing in electrolyzer, include nickel sulfamic acid, electroforming such as nickelous chloride and boric acid medium, when a logical electric current promptly can dissociate metal ion in this positive plate, and the metal ion that is dissociateed is because be subjected to the field of electric force effect, can between this positive plate 31 and this negative plate 32, form power line 33, can on this negative plate, make metal ion be reduced into atoms metal by this power line 33, if the atoms metal of its packing arrangement of zone that this power line 33 is concentrated is also many more, these power line 33 distributions are influenced by fringing effect again, therefore be easy to the negative plate edge and form metallic diaphragm, though add a single hole masking shield 34 in addition, but cause power line many, so that still have the situation of skewness to exist toward the intermediary areal distribution.Shown in Fig. 3 (a), therefore around this negative plate 32, add a conductive metal layer 35, wherein this conductive metal layer 35 evenly attaches on this negative plate periphery by a conductive tape, and this conductive tape width is 0.3~0.6cm again, and material is a copper.Shown in Fig. 3 (b), because of copper has better electroconductibility than titanium, so when several power lines 33 are emitted to this negative plate 321, can be because of the function influence of single hole masking shield 34, and only at intermediary zone formation metallic diaphragm, this power line 33 has partly and distributes to both sides, thereby can make the comparatively average and distribution range of metallic diaphragm thickness on this negative plate 32 can meet ideal value (± 3 μ m approximately).
In sum, the apparatus and method of the control electric force lines distribution that the present invention is provided in above-mentioned preferred embodiment only can be improved in the prior art with the problems of single hole masking shield as many past these negative plate intermediary areal distribution of power line that mode is caused of control electric force lines distribution, and then can make the average and distribution range of this metallic diaphragm thickness more meet required.
Claims (21)
1. device of controlling electric force lines distribution, it is applied on the electroforming one ink cartridges nozzle piece technology, and it comprises:
One anode member, it applies corresponding to an electric power and decomposites the ion of a predetermined substance;
One negative electrode spare is located on the relative position of this anode member, receive this ion forming a predetermined substance accumulation horizon thereon, and at this negative electrode spare periphery winding one conductive layer, wherein said conductive layer adheres on the described negative electrode spare periphery by a conductive tape;
One electroforming medium is present between this anode member and this negative electrode spare, forms a power line to transmit this ion; And
One shading unit is located between this anode member and this negative electrode spare, and it has at least one perforate and is made by the insulation material, can make this power line pass this perforate and be emitted on this negative electrode spare.
2. the device of control electric force lines distribution as claimed in claim 1 is characterized in that, described anode member is a positive plate, and its material is a nickel.
3. the device of control electric force lines distribution as claimed in claim 1 is characterized in that, described negative electrode spare is a negative plate, and its material is titanium or chromium.
4. the device of control electric force lines distribution as claimed in claim 1 is characterized in that, the spacing of described anode member and described negative electrode spare is 15~30cm.
5. the device of control electric force lines distribution as claimed in claim 1 is characterized in that, described conductive layer material is a copper.
6. the device of control electric force lines distribution as claimed in claim 1 is characterized in that, described electroforming medium is made up of nickel sulfamic acid, nickelous chloride and boric acid.
7. the device of control electric force lines distribution as claimed in claim 1 is characterized in that, described shading unit and described negative electrode spare distance are 1~5cm.
8. the device of control electric force lines distribution as claimed in claim 1 is characterized in that, described shading unit is a porous masking shield, and the aperture of described several perforates is diminished from the both sides in regular turn by the centre and in twos the symmetry, its perforate spacing is all identical again.
9. the device of control electric force lines distribution as claimed in claim 8 is characterized in that, the opening diameter size of described porous masking shield is between 1~3cm.
10. method of controlling electric force lines distribution, it is applied on the electroforming one ink cartridges nozzle piece technology, and described method comprises the following steps:
One electrotyping bath is provided, described electrotyping bath comprises an anode member and a negative electrode spare, and described anode member applies corresponding to an electric power and decomposites the ion of a predetermined substance, has an electroforming medium again, be present between described anode member and described negative electrode spare, form a power line to transmit described ion;
Apply a conductive layer in described negative electrode spare periphery, wherein said conductive layer is to adhere on the described negative electrode spare periphery by at least one conductive tape;
One shading unit is provided, is located between described anode member and the described negative electrode spare, this shading unit has at least one perforate and is made by the insulation material; And
A logical electric current is between described anode member and described negative electrode spare, to produce described power line corresponding to its current density.
11. the method for control electric force lines distribution as claimed in claim 10 is characterized in that, described anode member is a positive plate, and its material is a nickel.
12. the method for control electric force lines distribution as claimed in claim 10, it is characterized in that described negative electrode spare is a negative plate, be located on the relative position of described anode member, receiving described ion forming a predetermined substance accumulation horizon thereon, and its material is titanium or chromium.
13. the method for control electric force lines distribution as claimed in claim 10 is characterized in that, the spacing of described anode member and described negative electrode spare is 15~30cm.
14. the method for control electric force lines distribution as claimed in claim 10 is characterized in that, described electroforming medium is made up of nickel sulfamic acid, nickelous chloride and boric acid.
15. the method for control electric force lines distribution as claimed in claim 10 is characterized in that, described conductive layer evenly attaches on the described negative plate periphery by a conductive tape, and described conductive tape width is 0.3~0.6cm, and its material is a copper.
16. the method for control electric force lines distribution as claimed in claim 10 is characterized in that, described conductive layer connects into a sealing or a non-closed region by several sections conductive tapes, to attach on the described negative plate periphery.
17. the method for control electric force lines distribution as claimed in claim 10 is characterized in that, described shading unit and described negative electrode spare spacing are 1~5cm.
18. the method for control electric force lines distribution as claimed in claim 10 is characterized in that, described shading unit is a single hole masking shield.
19. the method for control electric force lines distribution as claimed in claim 10 is characterized in that, described shading unit is a porous masking shield, and described several perforated areas are diminished from the both sides in regular turn by the centre and in twos the symmetry, its perforate spacing is all identical again.
20. the method for control electric force lines distribution as claimed in claim 19 is characterized in that, the opening diameter size of described porous masking shield is between 1~3cm.
21. the method for control electric force lines distribution as claimed in claim 10 is characterized in that, described current density is 2.5~10A/dm
2
Priority Applications (1)
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CNB011083743A CN1153852C (en) | 2001-02-28 | 2001-02-28 | Device and method for controlling electric power line distribution |
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CNB011083743A CN1153852C (en) | 2001-02-28 | 2001-02-28 | Device and method for controlling electric power line distribution |
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CN1372019A CN1372019A (en) | 2002-10-02 |
CN1153852C true CN1153852C (en) | 2004-06-16 |
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CNB011083743A Expired - Fee Related CN1153852C (en) | 2001-02-28 | 2001-02-28 | Device and method for controlling electric power line distribution |
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KR101027489B1 (en) * | 2002-07-18 | 2011-04-06 | 가부시키가이샤 에바라 세이사꾸쇼 | Plating apparatus and plating method |
CN106637318A (en) * | 2015-10-29 | 2017-05-10 | 神华集团有限责任公司 | A nanostructured array and a preparing method thereof |
CN106149033A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
WO2019021599A1 (en) * | 2017-07-26 | 2019-01-31 | 住友電気工業株式会社 | Printed wiring board production method and printed wiring board production apparatus |
US20200190681A1 (en) * | 2018-12-13 | 2020-06-18 | Unison Industries, Llc | Electroforming apparatus and method for forming a rib |
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