KR20240004056A - Electric coation method acquiring euqalized coating layer surface - Google Patents

Abstract

The purpose of the present invention is to provide a plating method for uniform plating layer surface, which includes the steps of immersing a product to be plated (112) in a plating tank (110) filled with a plating solution; A step of placing the plating derivative 120 in the plating solution of the plating bath 110 so that it is disposed at a position spaced a certain distance from the end of the product to be plated 112, and comprising: Power is applied to form a uniform plating layer on the surface of the product to be plated 112 and at the same time, an abnormal plating layer 112AL is formed on the surface of the plating derivative 120.
The effect of the present invention is to uniformize the surface of the plating layer, which prevents excessively thick plating layer from being formed on a part of the plating product due to concentration of electric charges, etc. on only one side of the plating product, or the plating layer being formed thickly on one side of the plating product. It means that you can hope for.

Description

Coating layer surface uniform plating method {Electric coation method acquiring euqalized coating layer surface}

The present invention relates to a plating method for uniform plating layer surface, and more specifically, to a new configuration that prevents the plating layer from being formed more than necessary on a part of the product to be plated where there is a lot of electricity flow or the plating layer from being formed thickly on one side of the product to be plated. It relates to a plating method for uniform plating layer surface.

In the electroplating process, a plated product is produced by attaching metal in the form of metal ions to the surface of a steel plate installed in a plating bath provided with a plating solution of zinc, copper, silver, etc.

In the manufacturing process of steel and other metal products, a continuous plating process is performed to produce plated products as needed. In another technique, since the plating solution is excessively attached to both sides of the steel sheet that has passed through the plating tank containing the molten plating metal, a plating layer of an appropriate thickness is formed using an air knife, and then approx. By solidifying the unsolidified zinc solution above 460°C using a cooling device, a plating layer with sufficient strength is formed on the surface of the steel sheet to produce a plated product.

Electroplating, a type of plating method, attaches plating metal to the surface by passing electricity to an object as a cathode in an electrolytic solution. It is performed for various purposes such as decoration and anti-rust function. It is relatively inexpensive and can provide an appropriate metal film. , we are plating parts for many purposes, including automobiles, acoustics, aircraft, communications equipment, computer parts, accessories, and construction materials.

This type of electroplating has the advantage of being able to process a variety of small-scale items, imparting a variety of textures to metals, and obtaining a film with excellent properties and good adhesion to expensive metals.

However, in the past, a uniform plating thickness was not formed on the entire surface of the product to be plated, and due to the concentration of electric charges on only one side of the product, a too thick plating layer was formed in some parts of the product to be plated, causing a high flow of electricity. Because the plating layer is formed like a protrusion toward one side of the plated product, there is a problem that many defects in the plated product occur.

In particular, a lot of charge is concentrated on the edges or protruding corners of the product to be plated, and the flow of electricity increases, forming a thick plating layer partially, making it very difficult to produce a precisely plated product.

Korean Patent No. 10-1027489 (registered on March 30, 2011) Korean Patent No. 10-0568386 (registered on March 30, 2006) Korean Patent No. 10-1795965 (registered on November 2, 2017)

The present invention was developed to solve the above-described problem. The present invention prevents the formation of an unnecessary plating layer on a part of the plating product due to the concentration of electric charges, etc. on only one side of the plating product, or the plating layer is formed on the plating product. The purpose is to provide a plating method to uniformize the surface of the plating layer to prevent the plating layer from being formed to be tilted to one side.

According to the present invention, the steps of arranging the plating derivative 120 so as to be placed at a certain distance apart from the edge of the end of the surface to be plated of the product to be plated 112; A step of immersing the product to be plated (112) in a plating bath (110) filled with a plating solution, and applying power to the product to be plated (112) to form a uniform plating layer on the surface of the product to be plated (112). and forming an abnormal plating layer (112AL) on the surface of the plating derivative (120).

Power is applied to the product to be plated 112 to form a plating layer on the surface of the product to be plated 112, and at the same time, the electric charge is applied to the plating derivative 120 so that the electric charge of the plating derivative 120 is concentrated. The abnormal plating layer 112AL is formed in the area where the plated product 112 is formed, and the concentrated charge is dispersed through the corner of the end of the plated product 112, which is adjacent to the plating derivative 120 of the plated product 112. , It is characterized by preventing the formation of an abnormal plating layer 112AL by preventing the flow of current from being concentrated, thereby enabling the formation of a uniform plating layer over the entire product to be plated.

The plating derivative 120 includes a triangular part 122; a flat part part 124 connected to one end of the triangular part part 122; A uniform plating guide piece 125 connected to the other end of the triangular part 122; It includes a uniform plating guide curved portion (122CP) formed at a portion where the uniform plating guide piece 125 and the triangular part portion 122 are connected, and power is applied to the plated product 112 to plate the product ( When forming a plating layer on the surface of 112), the uniform plating guide curved portion 122CP prevents current from concentrating and flowing at the end of the product to be plated 112, thereby preventing the plating from being formed thickly. It is characterized by

The triangular part 122 is configured to be spaced apart from the side of the product to be plated 112 when plating is in progress, and forms a round triangular protrusion to induce the flow of current through the triangular protrusion, thereby plating the product ( 112) is characterized in that it is configured to form a smooth and uniform plating.

The uniform plating guide curved portion 122CP of the uniform plating guide piece 125 is uniformly rounded in order to disperse the current so that it does not flow through any part, and the length of the uniform plating guide curved portion 122CP is P It is characterized by having a length that can include the edge length of the plated product 112.

The separation distance (D) between the uniform plating guide curved portion 122CP of the uniform plating guide piece 125 and the corner end of the product to be plated 112 is characterized in that it is in the range of 2 to 5 mm.

Maintain the separation distance (D) between the uniform plating guide curved portion 122CP of the uniform plating guide piece 125 and the corner end of the product to be plated 112, and perform uniform plating in a direction perpendicular to the separation distance. The uniform plating guide curved portion 122CP of the guide piece 125 or one of the edge portions of the plated product 112 is moved irregularly within a certain range while maintaining the separation distance D to control the current. It is characterized by the ability to disperse concentrated plating as the concentrated flow continues.

The present invention is a plating method for uniformizing the surface of the plating layer, which prevents the formation of a too thick plating layer on a part of the product due to concentration of electric charges on only one side of the product or the case where the plating layer is formed thickly on one side of the product. It has the effect of providing. In the present invention, when performing a plating process on a product to be plated, a plating derivative made of a conductive metal is placed next to the end of the product to be plated, so that the current flows intensively to the end of the product to be plated, causing the plating to form an abnormal plating layer such as a bumpy shape. This has the effect of preventing this formation and forming a part through which current flows intensively in the plating conductor, thereby allowing the formation of an abnormal plating layer such as a bumpy protrusion shape, thereby enabling high-quality plating of the product to be plated. In other words, the present invention has the effect of preventing a case where a too thick plating layer is formed on a part of the plated product or the plating layer is formed thick on one side of the plated product due to the concentration of electric charges on only one side of the plated product. Furthermore, it has the effect of ensuring the production of precisely plated products.

1 is a perspective view of a plating derivative used in the plating method of the present invention;
Figure 2 is a plan view showing the main parts used in the plating method of the present invention, the plating derivative and the product to be plated, installed in a plating bath;
Figure 3 is a plan view showing a state in which a plating layer is formed on the surface to be plated of the product shown in Figure 2;
Figure 4 is a front view showing a state in which a plating layer is formed on the surface to be plated of the product shown in Figure 2;
Figure 5 is a front view of Figure 2;
Figure 6 is a front view showing a state in which an abnormal plating layer is formed on the plating derivative shown in Figure 3;
Figure 7 is a plan view showing a state in which an abnormal plating layer is formed at the end of the plating derivative shown in Figure 6;
Figure 8 is a plan view schematically showing the main parts used in the plating layer surface uniformity plating method according to another embodiment of the present invention installed in a plating bath.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The purpose, features, and advantages of the present invention can be more easily understood by referring to the accompanying drawings and the following detailed description. Additionally, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted.

Additionally, when describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, or order of the component is not limited by the term. When a component is described as being "connected," "coupled," or "connected" to another component, that component may be directly connected or connected to that other component, but there is another component between each component. It will be understood that elements may be “connected,” “combined,” or “connected.”

In addition, the specific structural and functional descriptions in the present invention are merely illustrative for the purpose of explaining embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention may be implemented in various forms and may be applied in the present specification or application. It should not be construed as limited to the embodiments described in.

Figure 1 is a perspective view of the plating derivative used in the plating method of the present invention, Figure 2 is a plan view showing the plating derivative used in the plating method of the present invention and the product to be plated installed in the plating tank, Figure 3 is Figure 2 A plan view showing a state in which a plating layer is formed on the plated surface of the plated product shown in , FIG. 4 is a front view showing a state in which a plating layer is formed on the plated surface of the plated product shown in FIG. 2 , and FIG. 5 is a FIG. 2, FIG. 6 is a front view showing a state in which an abnormal plating layer is formed on the plating derivative shown in FIG. 3, FIG. 7 is a plan view showing a state in which an abnormal plating layer is formed at the end of the plating derivative shown in FIG. 6, and FIG. 8. is a front view schematically showing the state in which the main parts used in the plating layer surface uniformity plating method according to another embodiment of the present invention are installed in the plating tank.

Referring to the drawings, the plating layer surface uniformity plating method of the present invention includes the steps of arranging the plating derivative 120 at a position spaced a certain distance away from the end of the product to be plated 112, and plating tank 110 filled with a plating solution. ), and when plating is performed by applying power to the plated product 112, a uniform current flows so that a uniform current is applied to the surface of the plated product 112. Forms a plating layer (CL), prevents charges from concentrating on sharp or protruding parts of the plated product 112, and at the same time forms an abnormal plating layer (112AL) on the part where current flows intensively on the surface of the plating derivative 120. ) is formed.

The plating tank 110 generally has a hexahedral or cylindrical tank shape with an open top. The inside of the plating tank 110 is filled with a plating solution for plating the product to be plated 112.

Inside the plating tank 110, a hanger supporter (not shown) is provided to support the product to be plated 112 to be immersed in the plating solution inside the plating tank 110. Power is applied to the plated product 112 through the hanger supporter to form a plating layer on the surface of the plated product 112 while the plated product 112 is immersed in the plating solution.

In the present invention, power is applied to the product to be plated 112 to form a plating layer on the surface of the product to be plated 112, to prevent charges from being concentrated on sharp or protruding parts of the product to be plated 112, and at the same time, A sharp or protruding portion is formed on the plating derivative 120 to concentrate charges, thereby forming an abnormal plating layer 112AL on the surface of the plating derivative 120. In this way, the abnormal plating layer 112AL is prevented from being formed in the portion adjacent to the plating derivative 120 of the product to be plated 112, thereby enabling the formation of a uniform plating layer over the entire product to be plated.

At this time, the plating derivative 120 is a triangular part 122, a flat part 124 connected to one end of the triangular part 122, and a uniform plating connected to the other end of the triangular part 124. It includes a guide piece 125 and a uniform plating guide curved portion 122CP formed in a portion where the uniform plating guide piece 125 and the triangular part portion 122 are connected.

Therefore, when power is applied to the plated product 112 to form a plating layer on the surface of the plated product 112, the end of the plated product 112 is bent due to the uniform plating guide curved portion 122CP. It has the effect of preventing the part from forming thickly.

Preventing the edge of the plated product 112 from becoming thick means preventing the edge of the plating layer CL of the plated product 112 from becoming thicker than other parts. The thickness of the plating layer CL of the plated product 112 prevents the edge portion of the plated product 112 from becoming thicker, thereby ensuring the production of a precisely plated product.

Charges are concentrated on the protruding part of the end of the plating derivative 120, and an abnormal plating layer 112AL is formed in the area where the current flow is high, thereby uniformizing the overall thickness of the plating layer CL of the plated product 112, thereby ensuring precision It is possible to reliably guarantee the production of a well-plated product 112.

Since the abnormal current flow moves from the plated product 112 to the plated derivative 120, the overall thickness of the plating layer CL of the plated product 112 can be made uniform.

In the present invention, as shown in FIG. 3, the plated product 112 and the plated derivative 120 are electrically connected through a connection support means such as a conductive clamp (CLP). In Figure 3, the plating layer (CL) and the plating derivative 120 of the product to be plated 112 are shown in a plan view. In the plated product 112, the non-plated layer is covered with an aluminum cover (ALC). In addition, the flat part portion 124 of the plating derivative 122 is fixed to the plated product 112 by a fixing means such as a fixing pin (FP).

A plating layer (CL) as shown in FIG. 3 is formed on the surface (CF) to be plated of the product to be plated (112) shown in FIG. 2, and the uniform plating guide curved portion (122CP) of the plating derivative (120) is rounded. Therefore, the flow of charge is dispersed rather than concentrated so that the plating layer CL is formed homogeneously, and the flow of charge can also maintain homogeneity even as plating progresses.

When the tip of the plating derivative 120 is sharp, charges are concentrated at the edge of the product to be plated 112, thereby concentrating the flow of electricity and forming a thick plating layer CL. If the end of the plating derivative 120 is sharp, it is very difficult to match the end of the product to be plated 112 to be plated, and as the plating progresses, the shape changes and the flow of charge becomes non-homogeneous, resulting in the resulting (i.e. plating layer (CL) The formed product to be plated (112) becomes non-homogeneous.

Therefore, the plating guide curved portion 122CP is formed to have a more stable shape than a shape having a right-angled corner (i.e., a shape where the tip of the plating derivative 120 has a right-angled corner), and the flow of current induces uniform plating. It is formed at the end of the piece 125 so that the current flows intensively at the end, so that the charge does not concentrate on the edge of the plated product 112 and the flow of electricity does not concentrate, so the plating layer (CL) This thickening phenomenon (i.e., the phenomenon in which the end portion of the plating layer (CL) of the plated product 112 is formed thicker than other parts) is prevented, so that the entire plating layer (CL) of the plated product 112 is homogeneous. It has the effect of being formed as a plating layer.

As shown in FIG. 7, the abnormal plating layer 110AL is induced to be formed at the end of the plating derivative 120, which has the effect of forming the entire plating layer CL of the plated product 112 into a homogeneous plating layer.

Meanwhile, in the present invention, the separation distance (D) between the portion of the product to be plated 112 and the plating derivative 120 is in the range of 2 to 5 mm. If the separation distance is less than 2 mm, the flow of current through the plating conductor 120 increases, and the flow of current at the end of the product to be plated 112 blocks the plating solution dissolved in the molten pool in the plating bath and the current flow. There is a possibility that a plating layer with a thinner thickness than normal may be formed, so the separation distance is set to 2 mm or more. If the separation distance exceeds 5 mm, the flow of current flowing through the plating inductor 120 decreases, and the induction of charge concentration in the furnace is not performed properly. Since the current flow flowing through the edge of the plated product 112 increases the plating solution and current flow in the plating bath, an abnormal plating layer 112AL may be formed at the end of the plated product 112, so the separation distance Setting it to 5 mm or less is suitable for securing a plating layer of precise and uniform thickness.

Therefore, in the present invention, it is preferable that the separation distance (D) between the portion of the product to be plated 112 and the plating derivative 120 is in the range of 2 to 5 mm.

In summary, the plating layer surface uniformity plating method according to the present invention places a plating derivative 120 made of a conductive metal next to the end of the plated product 112 when performing the plating process on the plated product 112, While preventing the formation of an abnormal plating layer (112AL) that protrudes thicker than other parts at the end of the plated product (112), a concentrated current flows through the plating derivative (120) to form an abnormal plating layer (112AL) that has a bumpy shape. By forming this, it has the effect of reliably guaranteeing the production of a precisely plated product (i.e., the product to be plated 112).

The above has described an embodiment in which the plating derivative 120 is energized through a support (FP) fixed to the side of the product to be plated 112, or the separation distance (D) is fixed through a conductive clamp (CLP).

As another example, if a fixed separation distance (D) is set for more precise plating, the plating layer becomes thicker in areas where a lot of current flows, and as the plating progresses, the current flows intensively, especially at the corners. In order to prevent it from becoming thicker, if you move the separation distance (D) slightly or repeat moving the distance in the direction perpendicular to the separation distance (D), the increase in current will concentrate as the plating progresses, causing the plating to attach to the product. You can achieve the effect of dispersing the increase in thickness.

This means that when the thickness of the plating increases, the current flows intensively in the area where the thickness has increased, and the speed at which the plated metal is attached to the protruding plated area increases, resulting in a plating thickness that becomes higher than that of other areas over time. This is because by maintaining the distance from the beginning and moving it slightly, the concentrated amount of plating can be dispersed.

In the present invention, the plating tank 110 is provided with a derivative supporter 132, and a derivative supporter 132 is provided to support the plating derivative 120 so that it is immersed in the plating solution inside the plating tank 110, and the derivative The supporter 132 is configured to move the plating derivative 120 forward and backward with respect to the product to be plated 112 while moving forward and backward in the plating tank 110 by a moving drive unit. The derivative supporter 132 grips at least the upper and lower ends of the plating derivative 120 so that the plating derivative 120 is placed inside the plating bath 110 and at the same time, the plating derivative 120 is immersed in the plating solution. Maintain it. Preferably, the plating bath 110 is provided with an LM guide extending in the left and right side directions, so that the derivative supporter 132 can move forward and backward with respect to the product to be plated 112 by the LM guide.

At this time, the moving drive unit includes a moving guide bar 133 disposed outside the plating tank 110 and connected to the inductor supporter 132, and a moving drive motor 134 disposed outside the plating tank 110. and a ball screw 135 connected to the motor shaft of the moving drive motor 134, and a ball screw nut 136 coupled to the outer peripheral surface of the ball screw 135 and connected to the moving guide bar 133. do. Preferably, the movement drive motor 134 is configured as a servo motor whose motor shaft rotates forward and backward. At this time, as shown in FIG. 5, a moving connection bar (132MB) is connected to the inductor supporter 132, and the moving connection bar (132MB) passes through a bar formed on one side wall (110SW) of the plating tank 110. It is slidably coupled to the hole, and a moving guide bar 133 is connected to the moving connection bar (132MB) to provide a moving guide bar 133 and a moving drive motor 134 in the outer space of the plating tank 110. and the ball screw 135 and the ball screw nut 136 are configured to be disposed. Meanwhile, the gap between the outer peripheral surface of the moving connection bar (132MB) and the bar passage hole formed on one side wall (110SW) of the plating tank 110 is interposed by packing, so that the plating solution is allowed to pass through the moving connecting bar ( It is configured to prevent water leakage through the gap between the outer peripheral surface of the plating tank 110 and the bar passage hole of one side wall 110SW of the plating tank 110. If a chemical-resistant and corrosion-resistant bushing is inserted between the bar passage hole of the plating tank 110 and the outer circumferential surface of the moving connecting bar (132MB), the bar passing hole of the plating tank 110 and the outer peripheral surface of the moving connecting bar (132MB) are interposed. This can prevent the plating solution from leaking into the gaps.

The moving guide bar 133 is movably coupled to the external tank 110TA outside the plating tank 110 via the LM guide. The moving guide bar 133 is disposed inside the external tank 110TA and is coupled to the external tank 110TA via an LM guide extending in the longitudinal direction of the external tank 110TA. The moving guide bar 133 is configured to move in a direction away from one side wall (110SW) of the plating tank 110 or closer to one side wall (110SW) of the plating tank 110, and the moving guide bar 113 The moving connection bar (132MB) connected to is also configured to move forward or backward through the bar passage hole formed on one side wall (110SW) of the plating tank (110).

In summary, the plating bath 110 is provided with an inductor supporter 132, and the inductor supporter 132 moves forward and backward with respect to the product to be plated 112 in the plating bath 110 by a moving drive unit. It is configured to increase the separation distance between the plated derivatives 120 by the derivative supporter 132 when the step of forming a plating layer on the surface of the plated product 112 is repeated and accumulated.

The moving drive unit includes a moving guide bar 133 connected to the guide supporter 132 that supports the plating guide 120 to be immersed in the plating solution inside the plating tank 110, and a moving guide bar 133 outside the plating tank 110. A moving drive motor 134 disposed on the side, a ball screw 135 connected to the motor shaft of the moving drive motor 134, and a motor coupled to the outer peripheral surface of the ball screw 135 and connected to the moving guide bar 133. Includes a ballscrew nut (136).

When the motor shaft of the moving drive motor 134 rotates in one direction (for example, clockwise), the ball screw 135 also rotates in one direction (for example, clockwise) and the ball screw nut (136) retreats along the ball screw 135 and connects the plating derivative 120 together with the derivative supporter 132 connected to the ball screw nut 136, the moving connection bar 132MB, and the moving guide bar 133. The product to be plated (112) is retreated in a direction away from the end. In this way, the distance between the plating derivative 120 and the end of the product to be plated 112 increases.

Meanwhile, when the motor shaft of the moving drive motor 134 is rotated in the other direction (for example, counterclockwise), the ball screw 135 is also rotated in the other direction (for example, counterclockwise). Rotating, the ball screw nut 136 moves forward along the ball screw 135 and is connected to the ball screw nut 136 together with the inductor supporter 132, the moving connection bar (132 MB), and the moving guide bar 133. The plating guide 120 is advanced in a direction closer to the end of the plated product 112. In this way, the distance between the plating derivative 120 and the end of the product to be plated 112 is narrowed.

Therefore, the present invention can increase the separation distance of the plating derivative 120 by the derivative supporter 132 when the step of forming the plating layer on the surface of the plated product 112 is repeated and accumulated. The distance at which 120 is separated from the end of the plated product 112 is maintained within a range at which an abnormal plating layer 112AL can be formed on the plating derivative 120. For example, maintain the separation distance within the range of 2mm to 5mm mentioned above. In this way, when the abnormal plating layer 112AL is accumulated and formed on the plating derivative 120 and the thickness of the abnormal plating layer 112AL accumulates and becomes thick, the distance between the end of the plated product 112 and the plating derivative 120 is reduced. It can be maintained conveniently, making plating work more comfortable and smooth.

On the other hand, if the plating conductor 120 is repeatedly moved in a direction perpendicular to the separation distance D, the concentration of the increase in current during plating is dispersed, thereby preventing uneven plating in the plating layer of the plated product 112. This has the effect of forming a plating layer of uniform thickness throughout the plated surface of the plated product 112 without forming protrusions.

Above, specific embodiments of the present invention have been described in detail. However, the spirit and scope of the present invention are not limited to these specific embodiments, and it is known by common knowledge in the technical field to which the present invention pertains that various modifications and variations can be made without changing the gist of the present invention. Anyone who has it will understand.

Therefore, the embodiments described above are provided to fully inform those skilled in the art of the present invention of the scope of the invention, and should be understood as illustrative in all respects and not restrictive. The invention is defined only by the scope of the claims.

110. Plating bath 112. Product to be plated
112AL. Abnormal plating layer 120. Plating derivative
122. Triangular part 122CP. Uniform plating guide curved part
124. Flat part part 132. Derivative supporter
133. Moving guide bar 134. Moving drive motor
135. Ballscrew 136. Ballscrew nut
CF. Plated side CL. plating layer
CLP. Current-conducting clamp FP. fixing pin

Claims (7)

A step of arranging the plating derivative 120 so that it is disposed at a position spaced a certain distance away from the edge of the end of the surface to be plated of the product to be plated 112;
It includes the step of immersing the product to be plated (112) in a plating bath (110) filled with a plating solution,
A plating layer characterized in that applying power to the product to be plated 112 to form a uniform plating layer on the surface of the product to be plated 112 and to form an abnormal plating layer 112AL on the surface of the plating derivative 120 Surface uniformity plating method.
According to paragraph 1,
Power is applied to the product to be plated 112 to form a plating layer on the surface of the product to be plated 112, and at the same time, the electric charge is applied to the plating derivative 120 so that the electric charge of the plating derivative 120 is concentrated. The abnormal plating layer 112AL is formed in the area where the plated product 112 is formed, and the concentrated charge is dispersed through the corner of the end of the plated product 112, which is adjacent to the plating derivative 120 of the plated product 112. , A plating method for uniform plating surface, characterized in that it prevents the formation of an abnormal plating layer (112AL) by preventing the flow of current from being concentrated, thereby enabling the formation of a uniform plating layer on the entire product to be plated.
According to paragraph 2,
The plating derivative 120 includes a triangular part 122;
a flat part part 124 connected to one end of the triangular part part 122;
A uniform plating guide piece 125 connected to the other end of the triangular part 122;
It includes a uniform plating guide curved portion (122CP) formed at a portion where the uniform plating guide piece 125 and the triangular part portion 122 are connected,
When power is applied to the plated product 112 to form a plating layer on the surface of the plated product 112, the current is concentrated at the end of the plated product 112 due to the uniform plating guide curved portion 122CP. A plating method for plating surface uniformity, characterized in that it is configured to prevent the plating from forming thickly by preventing the plating from flowing.
According to paragraph 3,
The triangular part 122 is configured to be spaced apart from the side of the product to be plated 112 when plating is in progress, and forms a round triangular protrusion to induce the flow of current through the triangular protrusion, thereby plating the product ( 112) A plating method for uniformizing the surface of a plating layer, characterized in that it is configured to form a smooth and uniform plating.
According to paragraph 3,
The uniform plating guide curved portion 122CP of the uniform plating guide piece 125 is uniformly rounded in order to disperse the current so that it does not flow through any part, and the length of the uniform plating guide curved portion 122CP is P A plating method for plating surface uniformity, characterized in that the plating layer is composed of a length that can include the edge length of the plating product (112).
According to paragraph 3,
The separation distance (D) between the uniform plating guide curved portion 122CP of the uniform plating guide piece 125 and the corner end of the plated product 112 is in the range of 2 to 5 mm. Plating method.
According to clause 6,
Maintain the separation distance (D) between the uniform plating guide curved portion 122CP of the uniform plating guide piece 125 and the corner end of the product to be plated 112, and perform uniform plating in a direction perpendicular to the separation distance. The uniform plating guide curved portion 122CP of the guide piece 125 or one of the edge portions of the plated product 112 is moved irregularly within a certain range while maintaining the separation distance D to control the current. A plating method for uniformizing the surface of a plating layer, characterized in that the concentrated flow continues to disperse the concentrated plating.