CN105648507A - Device for electro-depositing planar parts - Google Patents
Device for electro-depositing planar parts Download PDFInfo
- Publication number
- CN105648507A CN105648507A CN201610170809.8A CN201610170809A CN105648507A CN 105648507 A CN105648507 A CN 105648507A CN 201610170809 A CN201610170809 A CN 201610170809A CN 105648507 A CN105648507 A CN 105648507A
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- Prior art keywords
- electro
- cathode substrate
- anode
- deposition
- stabilier
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
Abstract
The invention discloses a device for electro-depositing planar parts. The device comprises an outer tank, an electro-deposition tank, a cathode substrate, an anode, a current stabilizing board and a stirring board, wherein the electro-deposition tank, the cathode substrate, the anode, the current stabilizing board and the stirring board are placed in the outer tank. The electro-deposition tank is divided by the current stabilizing board into a cathode tank zone and an anode tank zone. The stirring board is connected to an external driving source and arranged between the cathode substrate and the current stabilizing board and is parallel to the cathode substrate. When the device works, the stirring board does translational motion under the action of the external driving source; under the dual effects of the current stabilizing board and the stirring board, electric field distribution and flow field distribution on the surface of the cathode substrate are more uniform. The device greatly improves the uniformity of thickness distribution of the electro-deposited planar parts.
Description
Technical field
The present invention relates to a kind of electrochemical depositer, be specially a kind of device improving electro-deposition planar member thickness evenness.
Background technology
Thickness distribution uniformity is one of core index of paying close attention to of all electrodeposition technologies (including plating, electroforming, Brush Plating etc.). The factor affecting deposit thickness distributing homogeneity is a lot, also very complicated. Wherein, cathode plane electric field is core with the distribution character in flow field. For this, in the industrial production, scientific worker is mainly around improving the Electric Field Distribution of electro-deposition processing procedure with Flow Field Distribution to improve the uniformity of deposit thickness distribution. The patent No. be 200920286121.1 patent propose a kind of electroplating bath with the barricade containing through hole. This patent utilization is placed in the barricade adjustment between negative electrode and anode and the electric force lines distribution improving on cathode plane. But, only being improved the uniformity of the electric force lines distribution of cathode surface by barricade thus the effect improving electro-deposition planar member thickness distribution uniformity is often limited, the result obtained is less desirable. Meanwhile, the patent No. be 201510135135.3 patent of invention propose the device of the circumferentially equidistant planar movement of a kind of negative electrode. This patent adopts negative electrode circumference travel mechanism to make negative electrode relative to electrolyte movement, and then drives electrolyte stream to move up. Although this device can obtain relatively uniform cathode plane flow field to a certain extent, but stirring intensity is often relatively low, and for large area workpiece, it is necessary to taking much room, cost is high. Additionally, this device is not having obvious good effect in the uniformity of electric current distribution to improving on cathode plane. For this, it would be highly desirable to develop a kind of more efficiently device and work in coordination with the electric deposition device improving cathode substrate surface electrical line of force distributing homogeneity and Flow Field Distribution uniformity, to solve the homogeneity question of electro-deposition planar member thickness better.
Summary of the invention
For the problems referred to above, it is an object of the invention to develop a kind of electrolyte and stir stronger and uniform, the uniform planar member electric deposition device of Electric Field Distribution, thus improving the uniformity of plane electro-deposition part thickness distribution.
The technical scheme is that a kind of device for electro-deposition planar member, including water jacket, the galvanic deposition cell being positioned in water jacket, cathode substrate and anode, it is characterized in that: it also includes stabilier and agitating plate, described agitating plate is provided with equally distributed through hole A, and described galvanic deposition cell is divided into cathode can district and anode slot district by stabilier;Described cathode substrate and anode are respectively arranged in cathode can district and anode slot district, and described cathode substrate is parallel to each other with described anode; Described agitating plate is arranged between cathode substrate and stabilier, and parallel with cathode substrate; Described agitating plate is provided with equally distributed through hole A; Described agitating plate is connected with outer drive source, makes translational motion in perpendicular; The groove that the side plate of described galvanic deposition cell is identical with being equipped with shape of cross section on base plate; The bottom surface of described groove is provided with outage; Described anode slot district is provided with inlet opening; Described water jacket is provided with liquid outlet.
Preferably, the side of described agitating plate is just right with groove.
Preferably, the distance between described agitating plate and cathode substrate is 2 ~ 5mm.
Preferably, described cathode substrate, anode and the length of stabilier and the groove depth of galvanic deposition cell are equal, and described cathode substrate, anode and the width of stabilier and the width of galvanic deposition cell are equal.
Preferably, the distance between the center of circle and the cathode substrate of described outage is 2 ~ 5mm.
Preferably, the diameter of described through hole A is 0.5 ~ 1mm, pitch of holes is 2 ~ 4mm.
Preferably, the diameter of described through hole B is 0.5 ~ 1mm, pitch of holes is 2 ~ 4mm.
Preferably, the diameter of described outage is 0.3 ~ 1mm, pitch of holes is 4 ~ 10mm.
Preferably, described anode surface area is 1.5 ~ 2 times of cathode substrate surface area.
Preferably, the nonmetal agitating plate of electric insulation of described galvanic deposition cell, water jacket, stabilier and the nonmetal galvanic deposition cell of electric insulation of agitating plate respectively acid-alkali-corrosive-resisting, the nonmetal water jacket of electric insulation of acid-alkali-corrosive-resisting, the nonmetal stabilier of electric insulation of acid-alkali-corrosive-resisting and acid-alkali-corrosive-resisting. Concrete material can be polypropylene, polrvinyl chloride etc.
Operation principle involved in the present invention is as follows.
Stabilier is vertically placed in galvanic deposition cell, and galvanic deposition cell is divided into cathode can district and anode slot district. Owing to stabilier having equally distributed through hole B so that the electrolyte flowing to cathode can district from anode slot district is smaller by the impact of galvanic deposition cell inlet. Now, press close to cathode plane to do the agitating plate of translational motion and constantly drive the electrolyte stream near cathode plane to move up by shear action in motor process. Owing to the electrolyte in cathode can district is mainly only limited by the stirring action of agitating plate, and the movement velocity of agitating plate opposing cathode face each point is essentially identical, make the shear flow intensity of major part region (except periphery) on cathode plane essentially identical, thus forming more uniform Flow Field Distribution. Because the translation radius of agitating plate is adjustable with movement velocity, so, can as needed in the uniform flow field obtaining required varying strength on cathode plane.
On the other hand, due to anode and cathode substrate parallel just to and area identical, and their area is equal to the cross-sectional area (namely anode, cathode substrate periphery are all in close contact) of galvanic deposition cell with galvanic deposition cell sidewall, making be evenly distributed in cathode substrate from the electric lines of force on anode, namely Electric Field Distribution is uniform. So, based on apparatus of the present invention, cathode plane can be made to obtain uniform flow field and Electric Field Distribution simultaneously.
During work, electrolyte enters from the inlet opening being positioned at galvanic deposition cell anode slot district, after stabilier current stabilization, becomes flow velocity extremely low and be susceptible to the stable electrolyte of anode slot district flow regime interference. Agitating plate translational motion in cathode can district, drives the electrolyte flow in cathode can district. Simultaneously, the electrolyte in cathode can district is slowly flowed out by the outage on galvanic deposition cell and overflows with edge on galvanic deposition cell, so, while realizing the renewal of cathodic electrodeposition process electrolyte, it is unlikely to the Flow Field Distribution (or stirring intensity distribution) on cathode plane is brought greater impact. After the electrolyte flowed out and overflow converges to water jacket, the liquid outlet again through water jacket is discharged into electrolyte circulated filter system.
Compared with prior art, the outstanding advantages of the present invention is:
(1) acquisition flow field and the uniform electro-deposition environment of Electric Field Distribution can be worked in coordination with.By the geometric configuration relation of complex optimum anode and cathode and alr mode so that the flow field of cathode plane is all relatively uniform with Electric Field Distribution.
(2) suitability and practicality are good. The kinestate changing agitating plate is obtained with the mixing speed of varying strength, and then can implement the electrodeposition technology of different deposition velocity. And, the electrolyte update mode in cathode can district so that the effective coverage (thickness distribution homogeneous area) that can obtain in cathode substrate is very big, enhances economy.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of electro-deposition planar member device of the present invention.
Fig. 2 is the galvanic deposition cell schematic diagram of electro-deposition planar member device of the present invention.
In figure: 1, cathode can district; 2, cathode substrate; 3, agitating plate; 4, galvanic deposition cell; 5, outage; 6, water jacket; 7, stabilier; 8, through hole A; 9, inlet opening; 10, through hole B; 11, anode slot district; 12, liquid outlet; 13, anode; 14, groove; 15, side plate; The bottom surface of 16 grooves; 17, base plate.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiments of the present invention are further described.
A kind of device for electro-deposition planar member that the present invention proposes, including water jacket 6, is positioned in water jacket 6 and for the galvanic deposition cell 4 of cuboid, cathode substrate 2 and anode 13, and it also includes stabilier 7 and agitating plate 3; The length of cathode substrate 2, anode 13 and stabilier 7 is equal with the groove depth of galvanic deposition cell 4, and the width of cathode substrate 2, anode 13 and stabilier 7 is equal with the width of galvanic deposition cell 4; Stabilier 7 is provided with equally distributed diameter to be 1mm, pitch of holes is the through hole B10 of 3mm; Galvanic deposition cell 4 is divided into cathode can district 1 and anode slot district 11 by stabilier 7; Cathode substrate 2 and anode 13 are vertically arranged at cathode can district 1 and anode slot district 11 respectively, and cathode substrate and anode are parallel to each other, and anode 13 surface area is 1.5 times of cathode substrate 2 surface area; Agitating plate 3 is arranged between cathode substrate 2 and stabilier 7, parallel with cathode substrate 2, and and distance between cathode substrate 2 be 4mm; Agitating plate 3 thickness is 2mm, and is connected with outer drive source (not shown), makes the translational motion that translation radius is 20mm in perpendicular, which is provided with equally distributed diameter to be 0.8mm, pitch of holes be the through hole A8 of 2mm; Position is just being provided with the identical groove of shape of cross section 14 by the side plate 15 of galvanic deposition cell 4 and base plate 17 with the side of agitating plate 3; The bottom surface 16 of groove is provided with diameter to be 0.7mm, pitch of holes is the outage 5 of 8mm, and the distance between the center of circle of outage 5 and cathode substrate 2 is 5mm; Inlet opening 9 it is provided with in anode slot district 11; The bottom of water jacket 6 is provided with liquid outlet 12; Galvanic deposition cell 4, water jacket 6, stabilier 7 and agitating plate 3 are polypropylene material.
Claims (10)
1. for a device for electro-deposition planar member, including water jacket (6), the galvanic deposition cell (4) being positioned in water jacket (6), cathode substrate (2) and anode (13), it is characterised in that: it also includes stabilier (7) and agitating plate (3); Described stabilier (7) is provided with equally distributed through hole B(10); Described galvanic deposition cell (4) is divided into cathode can district (1) and anode slot district (11) by stabilier (7); Described cathode substrate (2) and anode (13) are respectively arranged in cathode can district (1) and anode slot district (11), and described cathode substrate (2) is parallel to each other with described anode (13);Described agitating plate (3) is arranged between cathode substrate (2) and stabilier (7), and parallel with cathode substrate (2); Described agitating plate (3) is provided with equally distributed through hole A(8); Described agitating plate (3) is connected on outer drive source, makes translational motion in perpendicular; The side plate (15) of described galvanic deposition cell (4) is equipped with the identical groove of shape of cross section (14) with on base plate (17); The bottom surface (16) of described groove is provided with outage (5); Described anode slot district (11) is provided with inlet opening (9); Described water jacket (6) is provided with liquid outlet (12).
2. it is a kind of device for electro-deposition planar member according to claim 1, it is characterised in that: the side of described agitating plate (3) is just right with groove (14).
3. it is a kind of device for electro-deposition planar member according to claim 1, it is characterised in that: the distance between described agitating plate (3) and cathode substrate (2) is 2 ~ 5mm.
4. it is a kind of device for electro-deposition planar member according to claim 1, it is characterized in that: the length of described cathode substrate (2), anode (13) and stabilier (7) is equal with the groove depth of galvanic deposition cell (4), the width of described cathode substrate (2), anode (13) and stabilier (7) is equal with the width of galvanic deposition cell (4).
5. it is a kind of device for electro-deposition planar member according to claim 1, it is characterised in that: the distance between the center of circle and the cathode substrate (2) of described outage (5) is 2 ~ 5mm.
6. it is a kind of device for electro-deposition planar member according to claim 1, it is characterised in that: diameter described through hole A(8) is 0.5 ~ 1mm, pitch of holes is 2 ~ 4mm.
7. it is a kind of device for electro-deposition planar member according to claim 1, it is characterised in that: diameter described through hole B(10) is 0.5 ~ 1mm, pitch of holes is 2 ~ 4mm.
8. it is a kind of device for electro-deposition planar member according to claim 1, it is characterised in that: the diameter of described outage (5) is 0.3 ~ 1mm, pitch of holes is 4 ~ 10mm.
9. it is a kind of device for electro-deposition planar member according to claim 1, it is characterised in that: described anode (13) surface area is 1.5 ~ 2 times of cathode substrate (2) surface area.
10. it is a kind of device for electro-deposition planar member according to claim 1, it is characterised in that: the nonmetal agitating plate of electric insulation of described galvanic deposition cell (4), water jacket (6), stabilier (7) and the nonmetal galvanic deposition cell of electric insulation of agitating plate (3) respectively acid-alkali-corrosive-resisting, the nonmetal water jacket of electric insulation of acid-alkali-corrosive-resisting, the nonmetal stabilier of electric insulation of acid-alkali-corrosive-resisting and acid-alkali-corrosive-resisting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610170809.8A CN105648507A (en) | 2016-03-24 | 2016-03-24 | Device for electro-depositing planar parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610170809.8A CN105648507A (en) | 2016-03-24 | 2016-03-24 | Device for electro-depositing planar parts |
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| Publication Number | Publication Date |
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| CN105648507A true CN105648507A (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610170809.8A Pending CN105648507A (en) | 2016-03-24 | 2016-03-24 | Device for electro-depositing planar parts |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0234212A1 (en) * | 1986-02-28 | 1987-09-02 | International Business Machines Corporation | Electroplating cell |
| US6193861B1 (en) * | 1999-02-23 | 2001-02-27 | International Business Machines Corporation | Apparatus and method to enhance hole fill in sub-micron plating |
| CN1610769A (en) * | 2002-07-18 | 2005-04-27 | 株式会社荏原制作所 | Plating device |
| CN202323079U (en) * | 2011-11-17 | 2012-07-11 | 天津市大港镀锌厂 | High-uniformity zinc plating device |
| CN103060871A (en) * | 2007-12-04 | 2013-04-24 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN205474068U (en) * | 2016-03-24 | 2016-08-17 | 河南理工大学 | A device for electro -deposition plane piece |
-
2016
- 2016-03-24 CN CN201610170809.8A patent/CN105648507A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0234212A1 (en) * | 1986-02-28 | 1987-09-02 | International Business Machines Corporation | Electroplating cell |
| US6193861B1 (en) * | 1999-02-23 | 2001-02-27 | International Business Machines Corporation | Apparatus and method to enhance hole fill in sub-micron plating |
| CN1610769A (en) * | 2002-07-18 | 2005-04-27 | 株式会社荏原制作所 | Plating device |
| CN103060871A (en) * | 2007-12-04 | 2013-04-24 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN202323079U (en) * | 2011-11-17 | 2012-07-11 | 天津市大港镀锌厂 | High-uniformity zinc plating device |
| CN205474068U (en) * | 2016-03-24 | 2016-08-17 | 河南理工大学 | A device for electro -deposition plane piece |
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Application publication date: 20160608 |
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