JP3869128B2 - 半導体集積回路装置の製造方法 - Google Patents

半導体集積回路装置の製造方法 Download PDF

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Publication number
JP3869128B2
JP3869128B2 JP25893698A JP25893698A JP3869128B2 JP 3869128 B2 JP3869128 B2 JP 3869128B2 JP 25893698 A JP25893698 A JP 25893698A JP 25893698 A JP25893698 A JP 25893698A JP 3869128 B2 JP3869128 B2 JP 3869128B2
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JP
Japan
Prior art keywords
insulating layer
misfet
forming
gate electrode
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP25893698A
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English (en)
Japanese (ja)
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JP2000091535A5 (enExample
JP2000091535A (ja
Inventor
孝司 橋本
謙一 黒田
章二 宿利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
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Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP25893698A priority Critical patent/JP3869128B2/ja
Priority to TW088113474A priority patent/TW419813B/zh
Priority to US09/393,623 priority patent/US6069038A/en
Priority to KR1019990038505A priority patent/KR20000023044A/ko
Priority to KR1019990038531A priority patent/KR100702869B1/ko
Publication of JP2000091535A publication Critical patent/JP2000091535A/ja
Publication of JP2000091535A5 publication Critical patent/JP2000091535A5/ja
Application granted granted Critical
Publication of JP3869128B2 publication Critical patent/JP3869128B2/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/05—Making the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/013—Manufacturing their source or drain regions, e.g. silicided source or drain regions
    • H10D84/0133—Manufacturing common source or drain regions between multiple IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP25893698A 1998-09-11 1998-09-11 半導体集積回路装置の製造方法 Expired - Fee Related JP3869128B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP25893698A JP3869128B2 (ja) 1998-09-11 1998-09-11 半導体集積回路装置の製造方法
TW088113474A TW419813B (en) 1998-09-11 1999-08-06 Method for manufacturing a semiconductor integrated circuit device
US09/393,623 US6069038A (en) 1998-09-11 1999-09-10 Method of manufacturing a semiconductor integrated circuit device
KR1019990038505A KR20000023044A (ko) 1998-09-11 1999-09-10 반도체집적회로장치의 제조방법
KR1019990038531A KR100702869B1 (ko) 1998-09-11 1999-09-10 반도체집적회로장치의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25893698A JP3869128B2 (ja) 1998-09-11 1998-09-11 半導体集積回路装置の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2006237447A Division JP4357511B2 (ja) 2006-09-01 2006-09-01 半導体集積回路装置の製造方法
JP2006237446A Division JP4357510B2 (ja) 2006-09-01 2006-09-01 半導体集積回路装置の製造方法

Publications (3)

Publication Number Publication Date
JP2000091535A JP2000091535A (ja) 2000-03-31
JP2000091535A5 JP2000091535A5 (enExample) 2005-09-29
JP3869128B2 true JP3869128B2 (ja) 2007-01-17

Family

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Family Applications (1)

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JP25893698A Expired - Fee Related JP3869128B2 (ja) 1998-09-11 1998-09-11 半導体集積回路装置の製造方法

Country Status (4)

Country Link
US (1) US6069038A (enExample)
JP (1) JP3869128B2 (enExample)
KR (2) KR20000023044A (enExample)
TW (1) TW419813B (enExample)

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US6838320B2 (en) * 2000-08-02 2005-01-04 Renesas Technology Corp. Method for manufacturing a semiconductor integrated circuit device
US6218288B1 (en) 1998-05-11 2001-04-17 Micron Technology, Inc. Multiple step methods for forming conformal layers
JP3911585B2 (ja) * 1999-05-18 2007-05-09 富士通株式会社 半導体装置およびその製造方法
KR100359246B1 (ko) * 1999-09-29 2002-11-04 동부전자 주식회사 적층형 캐패시터를 갖는 반도체 장치 제조 방법
JP2001176964A (ja) * 1999-12-16 2001-06-29 Mitsubishi Electric Corp 半導体装置および半導体装置製造方法
US6251726B1 (en) * 2000-01-21 2001-06-26 Taiwan Semiconductor Manufacturing Company Method for making an enlarged DRAM capacitor using an additional polysilicon plug as a center pillar
JP4057770B2 (ja) 2000-10-11 2008-03-05 株式会社ルネサステクノロジ 半導体集積回路装置
US6403423B1 (en) 2000-11-15 2002-06-11 International Business Machines Corporation Modified gate processing for optimized definition of array and logic devices on same chip
KR100574715B1 (ko) * 2001-01-30 2006-04-28 가부시키가이샤 히타치세이사쿠쇼 반도체 집적 회로 장치
US6486033B1 (en) * 2001-03-16 2002-11-26 Taiwan Semiconductor Manufacturing Company SAC method for embedded DRAM devices
JP3863391B2 (ja) * 2001-06-13 2006-12-27 Ｎｅｃエレクトロニクス株式会社 半導体装置
KR100404480B1 (ko) * 2001-06-29 2003-11-05 주식회사 하이닉스반도체 반도체 소자의 제조방법
JP4911838B2 (ja) * 2001-07-06 2012-04-04 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US6518151B1 (en) * 2001-08-07 2003-02-11 International Business Machines Corporation Dual layer hard mask for eDRAM gate etch process
US6730553B2 (en) * 2001-08-30 2004-05-04 Micron Technology, Inc. Methods for making semiconductor structures having high-speed areas and high-density areas
US6501120B1 (en) * 2002-01-15 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Capacitor under bitline (CUB) memory cell structure employing air gap void isolation
JP2004111414A (ja) * 2002-09-13 2004-04-08 Renesas Technology Corp 半導体装置の製造方法
DE10314595B4 (de) * 2003-03-31 2006-05-04 Infineon Technologies Ag Verfahren zur Herstellung von Transistoren unterschiedlichen Leitungstyps und unterschiedlicher Packungsdichte in einem Halbleitersubstrat
TWI223392B (en) * 2003-04-07 2004-11-01 Nanya Technology Corp Method of filling bit line contact via
US8118869B2 (en) * 2006-03-08 2012-02-21 Flexuspine, Inc. Dynamic interbody device
KR100869236B1 (ko) * 2006-09-14 2008-11-18 삼성전자주식회사 커패시터 제조 방법 및 이를 사용한 디램 장치의 제조 방법
JP2008108761A (ja) * 2006-10-23 2008-05-08 Elpida Memory Inc ダイナミックランダムアクセスメモリの製造方法
WO2008157208A2 (en) 2007-06-13 2008-12-24 Incyte Corporation Salts of the janus kinase inhibitor (r)-3-(4-(7h-pyrrolo[2,3-d]pyrimidin-4-yl)-1h-pyrazol-1-yl)-3-cyclopentylpropanenitrile
US20090001438A1 (en) * 2007-06-29 2009-01-01 Doyle Brian S Isolation of MIM FIN DRAM capacitor
JP2009200517A (ja) * 2009-04-28 2009-09-03 Renesas Technology Corp 半導体装置の製造方法
JP2011049601A (ja) * 2010-12-03 2011-03-10 Renesas Electronics Corp 半導体装置
CN106463352B (zh) * 2014-06-13 2020-06-19 英特尔公司 借助于电子束的层上单向金属

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0144902B1 (ko) * 1995-04-17 1998-07-01 김광호 불휘발성 메모리장치 및 그 제조방법
TW318933B (en) * 1996-03-08 1997-11-01 Hitachi Ltd Semiconductor IC device having a memory and a logic circuit implemented with a single chip
US5792681A (en) * 1997-01-15 1998-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Fabrication process for MOSFET devices and a reproducible capacitor structure
US6008084A (en) * 1998-02-27 1999-12-28 Vanguard International Semiconductor Corporation Method for fabricating low resistance bit line structures, along with bit line structures exhibiting low bit line to bit line coupling capacitance

Also Published As

Publication number Publication date
KR20000023051A (ko) 2000-04-25
US6069038A (en) 2000-05-30
TW419813B (en) 2001-01-21
KR20000023044A (ko) 2000-04-25
KR100702869B1 (ko) 2007-04-04
JP2000091535A (ja) 2000-03-31

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