JP3825664B2 - フィルム基板、フィルム基板の製造方法及びフィルム基板付回路基板の製造方法 - Google Patents

フィルム基板、フィルム基板の製造方法及びフィルム基板付回路基板の製造方法 Download PDF

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Publication number
JP3825664B2
JP3825664B2 JP2001297041A JP2001297041A JP3825664B2 JP 3825664 B2 JP3825664 B2 JP 3825664B2 JP 2001297041 A JP2001297041 A JP 2001297041A JP 2001297041 A JP2001297041 A JP 2001297041A JP 3825664 B2 JP3825664 B2 JP 3825664B2
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JP
Japan
Prior art keywords
film substrate
conductive pattern
semiconductor device
insulating sheet
device chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001297041A
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English (en)
Japanese (ja)
Other versions
JP2003100813A5 (https=
JP2003100813A (ja
Inventor
哲哉 横井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2001297041A priority Critical patent/JP3825664B2/ja
Priority to TW091121903A priority patent/TW558802B/zh
Priority to KR1020020058485A priority patent/KR100550171B1/ko
Priority to US10/254,779 priority patent/US6911725B2/en
Priority to CNB021439133A priority patent/CN1245755C/zh
Publication of JP2003100813A publication Critical patent/JP2003100813A/ja
Priority to US10/941,908 priority patent/US20050029635A1/en
Publication of JP2003100813A5 publication Critical patent/JP2003100813A5/ja
Application granted granted Critical
Publication of JP3825664B2 publication Critical patent/JP3825664B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
JP2001297041A 2001-09-27 2001-09-27 フィルム基板、フィルム基板の製造方法及びフィルム基板付回路基板の製造方法 Expired - Fee Related JP3825664B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001297041A JP3825664B2 (ja) 2001-09-27 2001-09-27 フィルム基板、フィルム基板の製造方法及びフィルム基板付回路基板の製造方法
TW091121903A TW558802B (en) 2001-09-27 2002-09-24 Film substrate, semiconductor device, manufacturing method of film substrate, manufacturing method of semiconductor device, and manufacturing method of circuit board having the semiconductor device
US10/254,779 US6911725B2 (en) 2001-09-27 2002-09-26 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device
KR1020020058485A KR100550171B1 (ko) 2001-09-27 2002-09-26 필름 기판, 반도체 장치, 필름 기판의 제조 방법, 및반도체 장치를 갖는 회로 기판의 제조 방법
CNB021439133A CN1245755C (zh) 2001-09-27 2002-09-27 薄膜基板、半导体器件、电路基板及其制造方法
US10/941,908 US20050029635A1 (en) 2001-09-27 2004-09-16 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001297041A JP3825664B2 (ja) 2001-09-27 2001-09-27 フィルム基板、フィルム基板の製造方法及びフィルム基板付回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2003100813A JP2003100813A (ja) 2003-04-04
JP2003100813A5 JP2003100813A5 (https=) 2005-10-27
JP3825664B2 true JP3825664B2 (ja) 2006-09-27

Family

ID=19118184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001297041A Expired - Fee Related JP3825664B2 (ja) 2001-09-27 2001-09-27 フィルム基板、フィルム基板の製造方法及びフィルム基板付回路基板の製造方法

Country Status (5)

Country Link
US (2) US6911725B2 (https=)
JP (1) JP3825664B2 (https=)
KR (1) KR100550171B1 (https=)
CN (1) CN1245755C (https=)
TW (1) TW558802B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7300182B2 (en) 2003-05-05 2007-11-27 Lamina Lighting, Inc. LED light sources for image projection systems
EP1550889A3 (en) * 2003-12-30 2005-12-14 IBM Corporation Opto-electronic module comprising flexible electric connection cable and method of making the same
US9113547B2 (en) * 2008-10-24 2015-08-18 Intel Corporation Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)
NL2036014B1 (en) * 2023-10-12 2025-04-30 Tracxon B V Manufacturing of electronic devices using electronic foil pieces

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2751450B2 (ja) 1989-08-28 1998-05-18 セイコーエプソン株式会社 テープキャリアの実装構造及びその実装方法
JPH0653288A (ja) 1992-07-29 1994-02-25 Sony Corp タブテープ及びタブテープの実装方法
JP2852178B2 (ja) * 1993-12-28 1999-01-27 日本電気株式会社 フィルムキャリアテープ
JPH0982752A (ja) * 1995-09-14 1997-03-28 Sony Corp 半導体装置
US6171888B1 (en) * 1996-03-08 2001-01-09 Lsi Logic Corp. Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
JP3442978B2 (ja) 1997-10-15 2003-09-02 シャープ株式会社 テープキャリアパッケージ半導体装置及びそれを用いた液晶パネル表示装置
JP2001007239A (ja) * 1999-06-17 2001-01-12 Nec Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
KR100550171B1 (ko) 2006-02-10
KR20030027757A (ko) 2003-04-07
TW558802B (en) 2003-10-21
US6911725B2 (en) 2005-06-28
US20030057543A1 (en) 2003-03-27
US20050029635A1 (en) 2005-02-10
CN1411056A (zh) 2003-04-16
CN1245755C (zh) 2006-03-15
JP2003100813A (ja) 2003-04-04

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