JP3813890B2 - ３層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法 - Google Patents

３層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法 Download PDF

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Publication number
JP3813890B2
JP3813890B2 JP2002081328A JP2002081328A JP3813890B2 JP 3813890 B2 JP3813890 B2 JP 3813890B2 JP 2002081328 A JP2002081328 A JP 2002081328A JP 2002081328 A JP2002081328 A JP 2002081328A JP 3813890 B2 JP3813890 B2 JP 3813890B2
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JP
Japan
Prior art keywords
group
intermediate layer
layer
resist
polymer
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Expired - Fee Related
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JP2002081328A
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English (en)
Japanese (ja)
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JP2003280207A5 (enExample
JP2003280207A (ja
Inventor
一也 上西
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Fujifilm Holdings Corp
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Fuji Photo Film Co Ltd
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Priority to JP2002081328A priority Critical patent/JP3813890B2/ja
Priority to US10/392,814 priority patent/US6884571B2/en
Publication of JP2003280207A publication Critical patent/JP2003280207A/ja
Publication of JP2003280207A5 publication Critical patent/JP2003280207A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Silicon Polymers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2002081328A 2002-03-22 2002-03-22 ３層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法 Expired - Fee Related JP3813890B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002081328A JP3813890B2 (ja) 2002-03-22 2002-03-22 ３層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法
US10/392,814 US6884571B2 (en) 2002-03-22 2003-03-21 Intermediate layer composition for three-layer resist process and pattern formation method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002081328A JP3813890B2 (ja) 2002-03-22 2002-03-22 ３層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法

Publications (3)

Publication Number Publication Date
JP2003280207A JP2003280207A (ja) 2003-10-02
JP2003280207A5 JP2003280207A5 (enExample) 2005-04-07
JP3813890B2 true JP3813890B2 (ja) 2006-08-23

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JP2002081328A Expired - Fee Related JP3813890B2 (ja) 2002-03-22 2002-03-22 ３層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法

Country Status (2)

Country Link
US (1) US6884571B2 (enExample)
JP (1) JP3813890B2 (enExample)

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CN107207456B (zh) 2015-02-02 2021-05-04 巴斯夫欧洲公司 潜酸及其用途
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JP7069033B2 (ja) 2016-04-06 2022-05-17 ソニーグループ株式会社 スペーシングリンカー基を有する超明色ダイマーまたはポリマー染料
WO2017197014A2 (en) 2016-05-10 2017-11-16 Sony Corporation Compositions comprising a polymeric dye and a cyclodextrin and uses thereof
JP7527537B2 (ja) 2016-05-10 2024-08-05 ソニーグループ株式会社 ペプチド骨格を有する超明色ポリマー染料
AU2017264861B2 (en) 2016-05-11 2021-09-23 Sony Group Corporation Ultra bright dimeric or polymeric dyes
WO2017214165A1 (en) 2016-06-06 2017-12-14 Sony Corporation Ionic polymers comprising fluorescent or colored reporter groups
US12018159B2 (en) 2016-07-29 2024-06-25 Sony Group Corporation Ultra bright dimeric or polymeric dyes and methods for preparation of the same
EP3691689A1 (en) 2017-10-05 2020-08-12 Sony Corporation Programmable dendritic drugs
JP7551056B2 (ja) 2017-10-05 2024-09-17 ソニーグループ株式会社 プログラマブルなポリマー薬物
JP2021503450A (ja) 2017-11-16 2021-02-12 ソニー株式会社 プログラム可能なポリマー薬
JP2021510698A (ja) 2018-01-12 2021-04-30 ソニー株式会社 生物学的に活性な化合物を含むホスホアルキルリボースポリマー
CN111565757A (zh) 2018-01-12 2020-08-21 索尼公司 包含生物活性化合物的磷酸烷基聚合物
JP7813098B2 (ja) 2018-01-12 2026-02-12 ソニーグループ株式会社 生物学的に活性な化合物を含む剛性間隔基を有するポリマー
KR102742386B1 (ko) 2018-03-19 2024-12-16 소니그룹주식회사 형광 신호 향상을 위한 2가 금속의 사용
WO2019182766A1 (en) 2018-03-21 2019-09-26 Sony Corporation Polymeric tandem dyes with linker groups
KR102854332B1 (ko) 2018-06-27 2025-09-03 소니그룹주식회사 디옥시리보오스를 포함하는 링커 군을 갖는 중합체성 염료
EP3820944A1 (en) 2018-07-13 2021-05-19 Sony Corporation Polymeric dyes having a backbone comprising organophosphate units
WO2021062176A2 (en) 2019-09-26 2021-04-01 Sony Corporation Polymeric tandem dyes with linker groups
JP7816141B2 (ja) 2019-09-30 2026-02-18 ソニーグループ株式会社 ヌクレオチドプローブ
CN111533860B (zh) * 2020-06-10 2021-10-01 青岛天祥环保工程有限公司 水性涂料超疏水改性剂及其制备方法
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US6743885B2 (en) * 2001-07-31 2004-06-01 Sumitomo Chemical Company, Limited Resin composition for intermediate layer of three-layer resist

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Publication number Publication date
JP2003280207A (ja) 2003-10-02
US20030207208A1 (en) 2003-11-06
US6884571B2 (en) 2005-04-26

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